METHOD AND APPARATUS FOR MANUFACTURING ELECTRONIC CIRCUIT BOARD
First Claim
1. A method for manufacturing an electronic circuit board on which repeated electrode patterns such as wirings are formed, comprising the steps of:
- detecting a defect caused by short-circuit between electrodes of a circuit on the electronic circuit board;
specifying correction target defect based on defect existing area information stored in advance in association with defect type after specifying the position and the defect type of the detected defect; and
cutting and correcting a short-circuit defect portion based on the cutting position information stored in advance in association with the defect type and the defect existing area information.
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Accused Products
Abstract
A method for manufacturing an electronic circuit board which contains an electronic circuit on a main surface of a glass substrate according to the invention sequentially performs a step of electrically inspecting the main surface of the glass substrate on which the electronic circuit is formed, a step of specifying positions and defect types of defects on the main surface of the glass substrate, a step of calculating reference point coordinates on the main surface of the glass substrate and correcting the coordinates, a step of extracting respective defects from an image around the defects and specifying a defect to be corrected in the extracted defects by referring to a defect existing range registered in advance for each defect type, and a step of cutting the specified defect. By this method, a foreign material adhering to the glass substrate is not erroneously judged as short-circuit defect causing short-circuit on the electronic circuit, and only defect actually requiring correction can be removed.
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Citations
23 Claims
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1. A method for manufacturing an electronic circuit board on which repeated electrode patterns such as wirings are formed, comprising the steps of:
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detecting a defect caused by short-circuit between electrodes of a circuit on the electronic circuit board; specifying correction target defect based on defect existing area information stored in advance in association with defect type after specifying the position and the defect type of the detected defect; and cutting and correcting a short-circuit defect portion based on the cutting position information stored in advance in association with the defect type and the defect existing area information. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An apparatus for manufacturing an electronic circuit board on which repeated patterns are formed, comprising:
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a correction device which corrects the electronic circuit board; a short-circuit defect detecting part; a defect position specifying part; a defect type specifying part; a reference point coordinates part; a reference point coordinates correcting part; a defect image acquiring part; a defect extracting part; a correction target defect specifying part; a cutting position specifying part; a cutting part; and a storing part which stores inspection condition information, inspection result information, circuit design information, defect existing area information, and cutting position information. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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Specification