Method for Manufacturing Long Force Sensors Using Screen Printing Technology

• US 20080314165A1
• Filed: 06/16/2006
• Published: 12/25/2008
• Est. Priority Date: 06/16/2005
• Status: Active Grant

• Current Assignee: Alexander Jaoshvili, Ilya D. Rosenberg, Richard A. Brandt
• Original Assignee: Alexander Jaoshvili, Ilya D. Rosenberg, Richard A. Brandt
• Inventors: Rosenberg, Ilya D.
• Granted Patent: US 7,984,544 B2
• Time in Patent Office: Days
• US Class Current: 73/862.621
• CPC Class Codes: A63B 2071/0611 Automatic tennis linesmen, i.e. in-out detectors
• CPC Class Codes: A63B 71/0605 Decision makers and devices using detection means facilitating arbitration
• CPC Class Codes: A63C 19/065 Line markings, e.g. tapes; Methods therefor
• CPC Class Codes: Y10T 29/49007 Indicating transducer
• CPC Class Codes: Y10T 29/49103 Strain gauge making
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49826 Assembling or joining

Abstract

A force or pressure sensor and appertaining method for manufacturing are provided in which the sensor comprises a repeating conductive trace pattern that can be replicated to produce a consistent conductive trace across more than one adjacent pattern section forming an electrical bus, wherein more than one section of a series of conductive traces are printed on a thin and flexible dielectric backing using the pattern. The thin and flexible dielectric backing has a repeated pattern of conductive traces printed above the dielectric backing and one or more dielectric layers provided above the conductive traces, the dielectric layers having access regions permitting contact of conductors above the one or more dielectric layers, and a sensor conductor layer printed above the one or more dielectric layers that contacts the conductive traces via at least one of the access regions or regions not covered by the one or more dielectric layers.

Claims

1. A method for manufacturing a force or pressure detecting sensor comprising:

designing a repeating conductive trace pattern that can be replicated to produce a consistent conductive trace across more than one adjacent pattern section forming an electrical bus; and

printing more than one section of a series of conductive traces on a thin and flexible dielectric backing using the pattern.

2. The method according to claim 1, further comprising:

printing an overlay pattern alongside the conductive traces that connects to the conductive traces.

3. The method according to claim 2, wherein the overlay pattern is that of a sensor pattern comprising interdigitating fingers.

4. The method according to claim 1, further comprising:

covering a portion of the repeated conductive traces that forms a bus with dielectric, wherein the dielectric exposes the conductive traces below with holes or exposes tips of the traces in order to allow electrical contact of conductors on a layer above the holes or tips with appropriate traces below the dielectric.

5. The method according to claim 4, further comprising:

printing an overlay sensor pattern over the dielectric that connects to the conductive traces below the dielectric.

6. The method according to claim 5 where the overlay pattern is that of a sensor pattern comprising interdigitating fingers.

7. The method according to claim 1, further comprising:

creating a conductive tail on the flexible dielectric backing at one end of the printed sensor sections that connects the sensors with electronic interface cables.

8. The method according to claim 1, further comprising subsequently printing an adhesive layer in a pattern on an exterior surface.

9. The method according to claim 8, wherein the pattern comprises dots.

10. The method according to claim 8, wherein the adhesive layer comprises double sided adhesive, contact cement, epoxy or other adhesion mechanism which forms a durable bond.

11. The method according to claim 8, further comprising attaching VHB strips along a perimeter of the sensor.

12. The method according to claim 1, further comprising adding a laminating film to a top and bottom surface of the sensor.

13. The method according to claim 1, further comprising assembling at least two of the layers on an installation site with a laminator.

14. The method according to claim 1, wherein portions of the repeating pattern are a cascading pattern.

15. The method according to claim 1, wherein the conductive traces are made of silver.

16. The method according to claim 1, wherein the dielectric backing is Mylar.

17. The method according to claim 1, wherein a conductive trace width=50 mils.

18. The method according to claim 1, wherein a conductive trace separation is 50 mils.

19. A sensor comprising:

a thin and flexible dielectric backing;

a repeated pattern of conductive traces printed above the dielectric backing;

one or more dielectric layers provided above the conductive traces, the dielectric layers having access regions permitting contact of conductors above the one or more dielectric layers; and

a sensor conductor layer printed above the one or more dielectric layers that contacts the conductive traces via at least one of the access regions or regions not covered by the one or more dielectric layers.

20. A sensor according to claim 19, further comprising:

a conductive tail created on the dielectric backing at one end of the repeated pattern of conductive traces that connects the sensors with electronic interface cables.

21. The sensor according to claim 19, wherein the sensor conductor layer comprises interdigitating fingers.

22. The sensor according to claim 19, further comprising an adhesive layer on an exterior surface.

23. The sensor according to claim 19, wherein portions of the repeating pattern are a cascading pattern.

24. The sensor according to claim 19, wherein the conductive traces are made of silver.

25. The sensor according to claim 19, wherein the dielectric backing is Mylar.

26. The sensor according to claim 19, wherein at least one of a width of the conductive traces or a separation of the conductive traces is 50 mils.