IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME
First Claim
1. An apparatus comprising:
- a substrate having at least one circuit element;
a bottom electrode, an intrinsic layer, a first conductive layer sequentially formed over the substrate;
a diffusion barrier film formed over the first conductive layer; and
an upper transparent electrode formed over the diffusion barrier film.
1 Assignment
0 Petitions
Accused Products
Abstract
An image sensor and a manufacturing method thereof are provided. The sensor includes a substrate, a bottom electrode, an intrinsic layer and a first conductive layer formed over the substrate, a diffusion barrier film formed over the first conductive layer, and an upper transparent electrode formed over the diffusion barrier film. Therefore, a vertical integration of a transistor circuitry and a photodiode can be provided. Further, the leakage current is prevented and the photosensitivity is increased by performing the plasma treatment on the first conductive layer. Due to the vertically integrated transistor circuitry and photodiode, the fill factor can approach 100%, and higher sensitivity compared with the related art having the same pixel size can be provided. The sensitivity of each unit pixel is not reduced, even though more complex circuitry is realized on the image sensor.
40 Citations
20 Claims
-
1. An apparatus comprising:
-
a substrate having at least one circuit element; a bottom electrode, an intrinsic layer, a first conductive layer sequentially formed over the substrate; a diffusion barrier film formed over the first conductive layer; and an upper transparent electrode formed over the diffusion barrier film. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A method comprising:
-
forming a bottom electrode, an intrinsic layer, and a first conductive layer sequentially over a substrate including at least one circuit element; forming a diffusion barrier film over the first conductive layer; and forming an upper transparent electrode over the diffusion barrier film. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
-
Specification