Solderless Integrated Package Connector and Heat Sink for LED

• US 20080315214A1
• Filed: 06/19/2007
• Published: 12/25/2008
• Est. Priority Date: 06/19/2007
• Status: Active Grant

• Current Assignee: Lumileds LLC (Apollo Global Management, Inc.)
• Original Assignee: Philips Lumileds Lighting Company LLC (Apollo Global Management, Inc.)
• Inventors: Farr, Mina, Zhang, Li, Kmetec, Jeffrey, Wall, Franklin JR., Stormberg, Peter
• Granted Patent: US 7,638,814 B2
• Time in Patent Office: Days
• US Class Current: 257/81
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H05K 3/308 Adaptations of leads connectors to printed circuits H01R12/00

Abstract

Standard solderless connectors extend from a molded package body supporting at least one high power LED. The package includes a relatively large metal slug extending completely through the package. The LED is mounted over the top surface of the metal slug with an electrically insulating ceramic submount in-between the LED and metal slug. Electrodes on the submount are connected to the package connectors. Solderless clamping means, such as screw openings, are provided on the package for firmly clamping the package on a thermally conductive mounting board. The slug in the package thermally contacts the board to sink heat away from the LED. Fiducial structures (e,g., holes) in the package precisely position the package on corresponding fiducial structures on the board. Other packages are described that do not use a molded body.

Claims

1. A light emitting diode (LED) package structure comprising:

at least one LED die;

a submount having electrodes, wherein the at least one LED die is mounted on the submount;

a molded package body formed of an electrically insulating material;

a metal slug extending through the body and molded into the body, a top and bottom surface of the slug being exposed through the body, the submount being mounted on the top surface of the slug such that the at least one LED die is electrically insulated from the slug and thermally coupled to the slug;

solderless metal connector terminals molded into the body, the connector terminals being electrically coupled to the submount electrodes for supplying power to the at least one LED die, the connector terminals being configured for connection to a power supply without use of solder; and

a clamping structure formed by the package structure configured to allow the body and slug to be firmly clamped to a thermally conductive mounting structure such that there is a thermal coupling between the bottom surface of the slug and the mounting structure.

2. The structure of claim 1 wherein the bottom surface of the slug extends beyond a bottom of the package body, where the bottom surface of the slug directly contacts the mounting structure when the package is clamped to the mounting structure.

3. The structure of claim 1 wherein the package structure has openings for screws for clamping the package onto the mounting structure.

4. The structure of claim 3 wherein the molded package body is formed to have the openings for the screws.

5. The structure of claim 3 wherein the slug is formed to have the openings for the screws.

6. The structure of claim 1 wherein the package structure has fiducial holes for receiving alignment pins formed on the mounting structure.

7. The structure of claim 6 wherein the fiducial holes have different shapes to align the package structure on the mounting structure in only one orientation.

8. The structure of claim 1 wherein the slug has tabs that extend into screw openings such that a downward movement of clamping screws presses down on the tabs, causing firm contact between the slug and the mounting structure.

9. The structure of claim 1 wherein the slug is substantially a parallelepiped.

10. The structure of claim 1 wherein the slug has a rectangular top surface and wherein its bottom surface is larger than the top surface.

11. The structure of claim 1 wherein the top surface of the slug and a bottom surface of the submount are both rectangular.

12. The structure of claim 1 wherein a bottom surface of the submount is soldered to a top surface of the slug.

13. The structure of claim 1 wherein the connector terminals are spade terminals that extend from a side of the package body substantially parallel to a top surface of the package body.

14. The structure of claim 1 wherein the connector terminals are spade terminals that extend perpendicularly to a top surface of the package body.

15. The structure of claim 1 wherein the connector terminals are pins that extend from a side of the package body substantially parallel to a top surface of the package body.

16. The structure of claim 1 wherein the connector terminals are pins that extend perpendicularly to a top surface of the package body.

17. The structure of claim 1 wherein the connector terminals are wire clamp terminals.

18. A light emitting diode (LED) package structure comprising:

at least one LED die;

a submount having electrodes, wherein the at least one LED die is mounted on the submount;

a metal slug, the submount being mounted on the top surface of the slug such that the at least one LED die is electrically insulated from the slug and thermally coupled to the slug;

an electrically insulating support member;

solderless metal connector terminals affixed to the support member, the connector terminals being electrically coupled to the submount electrodes for supplying power to the at least one LED die, the connector terminals being configured for connection to a power supply without use of solder; and

a clamping structure formed by the package structure configured to allow a bottom surface of the slug to be thermally coupled to a mounting structure.

19. The structure of claim 18 further comprising a metal plate forming a base of the slug, the metal plate having clamping means for firmly clamping the package structure onto the mounting structure.

20. The structure of claim 19 wherein the slug and the metal plate are a single integral piece.

21. The structure of claim 18, wherein the support member is a printed circuit board.