PHASED ARRAY ANTENNA ARCHITECTURE

• US 20080316139A1
• Filed: 06/19/2007
• Published: 12/25/2008
• Est. Priority Date: 06/19/2007
• Status: Active Grant

• Current Assignee: The Boeing Co.
• Original Assignee: The Boeing Co.
• Inventors: Navarro, Julio A., Takeuchi, Jimmy S., Soares, Harold Peter JR., Raby, Scott A., Heisen, Peter Timothy, Davis, Mark Richard, Bostwick, Richard N., O'Connell, John B., Blaser, Bruce Larry, Fahley, Stephen Lee
• Granted Patent: US 7,889,135 B2
• Time in Patent Office: Days
• US Class Current: 343/872
• CPC Class Codes: H01Q 21/0006 Particular feeding systems
• CPC Class Codes: H01Q 21/0037 linear waveguide fed arrays
• CPC Class Codes: H01Q 21/064 using horn or slot aerials slotted waveguides arrays H01Q21/005

Abstract

An antenna array core comprising a plurality of microwave modules, a control layer, a mounting layer, and a signal distribution layer. The control layer is capable of distributing control signals to the plurality of microwave modules. The plurality of microwave modules are attached to an upper surface of the mounting layer and the mounting layer is made from a heat conductive material capable of cooling the plurality of microwave modules. The signal distribution layer is located below the mounting layer, wherein the signal distribution layer is capable of transmitting microwave signals to the plurality of microwave modules and wherein the arrangement of the plurality of microwave modules on the mounting layer, the control layer, and the wave distribution network form a layered architecture for the antenna core. The architecture is a balance between, size, thermal control, manufacturability, cost, and performance so as to be a unique solution.

Claims

1. An antenna array core comprising:

a plurality of radio frequency modules;

a control layer capable of distributing control signals to the plurality of radio frequency modules;

a mounting layer, wherein the plurality of radio frequency modules are attached to an upper surface of the mounting layer and is made from a heat conductive material capable of cooling the plurality of radio frequency modules; and

a signal distribution layer located below the mounting layer, wherein the signal distribution layer is capable of transmitting radio frequency signals to the plurality of radio frequency modules and wherein an arrangement of the plurality of radio frequency modules on the mounting layer, the control layer, and a wave distribution network form a layered architecture for the antenna array core.

2. The antenna array core of claim 1, wherein the mounting layer comprises:

a pressure plate, wherein the plurality of radio frequency modules are attached to the pressure plate in which an upper surface of the pressure plate is the upper surface of the mounting layer; and

a cold plate having a plurality of channels through which a plurality of bullet connectors extend, wherein a top surface of the cold plate contacts a bottom surface of the pressure plate and wherein heat is conducted from the plurality of modules through the pressure plate to the cold plate.

3. The antenna array core of claim 1, wherein the signal distribution layer is a waveguide distribution network.

4. The antenna array core of claim 1, wherein the control layer is a power and control distribution board.

5. The antenna array core of claim 4 further comprising:

a button contact assembly capable of electrically connecting the plurality of radio frequency modules to the power and control distribution board.

6. The antenna array core of claim 1 further comprising:

a plurality of coaxial transmission lines having first ends and second ends, wherein the first ends are connected to inputs in the plurality of radio frequency modules, the second ends are connected to the signal distribution layer, and the plurality of coaxial transmission lines extend through a plurality of channels in the mounting layer.

7. The antenna array core of claim 1, wherein the plurality of coaxial transmission lines are a plurality of bullet connectors.

8. The antenna array core of claim 1, wherein the antenna array core transmits radio signals in a form of microwaves.

9. The antenna array core of claim 3 further comprising:

an amplifier capable of supplying amplified signals to the wave distribution network, wherein the amplifier is connected to a lower side of the signal distribution layer.

10. The antenna array core of claim 9, wherein the amplifier is integrated into the signal distribution layer.

11. The antenna array core of claim 1, wherein a microwave module in the plurality of microwave modules comprises:

a structural element having a first end and a second end, wherein the first end is opposite to the second end;

an antenna radiator board attached to the first end of the structural element, wherein the antenna radiator board includes a plurality of microwave radiating elements;

a plurality of circuits attached to the structural element and electrically connected to the antenna integrated printed wiring board, wherein the plurality of circuits are capable of controlling microwave signals radiated by the plurality of microwave radiating elements in the antenna radiator board;

a divider network having a single input and a plurality of outputs, wherein the divider network is attached to the structural element and is electrically connected to the plurality of circuits, the divider network conducts microwave signals received from the single input to the plurality of outputs, which are connected to the plurality of circuits in the ceramic package at the plurality of outputs; and

a set of flexible circuits having a first end and a second end, wherein the set of flexible circuits have a plurality of circuit pads located on the second end of the structural element and a plurality of connections at the second end of the flex circuit in which the plurality of connections are electrically connected to the plurality of circuits, wherein the set of flexible circuits are connected to the second end in a manner that a surface of the second is exposed to form an exposed surface on the second end such that the exposed surface dissipates heat in an amount sufficient to maintain a selected operating temperature.

12. The antenna array core of claim 1 further comprising:

a radio frequency gasket connected to the radio frequency radiating elements in the plurality of radio frequency modules in which the radio frequency gasket is capable of grounding the radio frequency radiating elements with a waveguide, wherein the radio frequency gasket comprises a electrically conductive conformable material having a thickness that eliminates an air gap between the radio frequency radiating elements in the plurality of radio frequency modules.

13. An antenna comprising:

a housing; and

a set of antenna array core modules located in the housing, wherein each antenna array core comprises;

a plurality of radio frequency modules;

a control layer capable of distributing control signals to the plurality of radio frequency modules;

a mounting layer, wherein the plurality of radio frequency modules are attached to an upper surface of the mounting layer and is made from a heat conductive material capable of cooling the plurality of radio frequency modules; and

a signal distribution layer located below the mounting layer, wherein the signal distribution layer is capable of transmitting radio frequency signals to the plurality of radio frequency modules and wherein the arrangement of the plurality of radio frequency modules on the mounting layer, the control layer, and the wave distribution network form a layered architecture for the antenna core.

14. The antenna of claim 13, wherein the mounting layer comprises:

a pressure plate, wherein the plurality of radio frequency modules are attached to the pressure plate in which an upper surface of the pressure plate is the upper surface of the mounting layer; and

a cold plate having a plurality of channels through which the plurality of bullet connectors extend, wherein a top surface of the cold plate contacts a bottom surface of the pressure plate and wherein the heat is conducted from the plurality of modules, through the pressure plate to the cold plate.

15. A radio frequency module comprising:

a structural element having a first end and a second end, wherein the first end is opposite to the second end;

an antenna radiator board attached to the first end of the structural element, wherein the antenna radiator board includes a plurality of radio frequency radiating elements;

a plurality of circuits attached to the structural element and electrically connected to the antenna integrated printed wiring board, wherein the plurality of circuits are capable of controlling radio frequency signals radiated by the plurality of radio frequency radiating elements in the antenna radiator board;

a divider network having a single input and a plurality of outputs, wherein the divider network is attached to the structural element and is electrically connected to the plurality of circuits, the divider network conducts radio frequency signals received from the single input to the plurality of outputs, which are connected to the plurality of circuits in the ceramic package at the plurality of outputs; and

a set of flexible circuits having a first end and a second end, wherein the set of flexible circuits have a plurality of circuit pads located on the second end of the structural element and a plurality of connections at the second end of the flex circuit in which the plurality of connections are electrically connected to the plurality of circuits, wherein the set of flexible circuits are connected to the second end in a manner that a surface of the second is exposed to form an exposed surface on the second end such that the exposed surface dissipates heat in an amount sufficient to maintain a selected operating temperature.

16. The radio frequency module of claim 15, wherein operating temperature is one sufficient to maintain to the plurality of circuits in an operating condition.

17. The radio frequency module of claim 15, wherein the antenna integrated printed wiring board is connected to the ceramic package by another flex circuit.

18. The radio frequency module of claim 15, wherein the plurality of circuits are located in a ceramic package attached to the structural element.

19. The radio frequency module of claim 15, wherein the structural element is a mandrel.