Infrared-Transmitting Cover

• US 20080316594A1
• Filed: 10/07/2005
• Published: 12/25/2008
• Est. Priority Date: 11/12/2004
• Status: Abandoned Application

• Current Assignee: Tokai Optical Co., Ltd.
• Original Assignee: Tokai Optical Co., Ltd.
• Inventors: Miyaguchi, Akira, Hashiguchi, Takashi
• Application Number:
  US11/667,568
• Publication Number:
  US 20080316594A1
• Time in Patent Office: Days
• US Class Current: 359/359
• CPC Class Codes: G02B 5/281 designed for the infrared light
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating

Abstract

Disclosed is an infrared-transmitting cover (21) comprising an infrared-transmitting base layer (23) and an infrared-transmitting dielectric multilayer film (24) which is arranged on the base layer (23). The infrared-transmitting cover (21) has optical characteristics since the dielectric multilayer film (24) selectively reflects visible light in a specific wavelength range, and the cover appears in the color corresponding to the specific wavelength range. A cover according to one embodiment of the present invention appears in a color other than black, namely such as blue, yellow or green, thereby enabling to improve decoration ability of infrared signal ports of electronic devices such as portable information terminals.

Claims

1. An infrared transparent cover comprising:

a base layer having infrared transparency; and

an infrared transparent and visible light reflective dielectric multilayer film laminated on one surface of the base layer, wherein the infrared transparent cover is colored by only the visible light reflected by the dielectric multilayer film.

2. The infrared transparent cover according to claim 1, further comprising:

a primer layer that has undergone a hard coating process and is laminated between the dielectric multilayer film and the base layer, wherein the dielectric multilayer film serves as an outer surface of the cover.

3. The infrared transparent cover according to claim 1, wherein the base layer includes a first surface on which the dielectric multilayer film is laminated and a second surface opposite the first surface, the cover further comprising:

an antireflection film laminated on the second surface of the base layer, the dielectric multilayer film and the antireflection film respectively serving as an inner surface and an outer surface of the cover.

4. The infrared transparent cover according to claim 1, wherein:

the base layer has two surfaces; and

the dielectric multilayer film is laminated on the two surfaces of the base layer.

5. The infrared transparent cover according to claim 1, wherein the base layer includes a frosted region, formed on at least part of the surface, for scattering light rays.

6. The infrared transparent cover according to claim 1, wherein an interface between the base layer and the dielectric multilayer film is curved.

7. The infrared transparent cover according to claim 6, wherein the interface between the base layer and the dielectric multilayer film is convex.

8. The infrared transparent cover according to claim 1, wherein the cover is attached to an infrared signal port of an electronic device, and the cover includes an outer surface exposed outside the electronic device and an inner surface arranged inside the electronic device;

the base layer is colorless and transparent and includes a first surface close to the inner surface of the cover and a second surface close to the outer surface of the cover; and

the dielectric multilayer film is laminated on the first surface of the base layer;

the cover further comprising;

a black layer laminated on the dielectric multilayer film, having infrared transparency, and inhibiting transmission of visible light; and

a diffusion layer laminated on the second surface of the base layer.

9. The infrared transparent cover according to claim 1, wherein:

the base layer is colorless and transparent and includes a first surface close to the inner surface of the cover and a second surface close to the outer surface of the cover; and

the dielectric multilayer film is laminated on the first surface of the base layer;

the cover further comprising;

an information printed layer laminated on the dielectric multilayer film;

a black layer laminated on the information printed layer, having infrared transparency, and inhibiting transmission of visible light; and

a diffusion layer laminated on the second surface of the base layer.

10. The infrared transparent cover according to claim 9, wherein the information printed layer is a monolayer.

11. The infrared transparent cover according to claim 1, wherein the base layer is colorless and transparent and includes a first surface close to the inner surface of the cover and a second surface close to the outer surface of the cover, the cover further comprising:

an information printed layer laminated between the first surface of the base layer and the dielectric multilayer film;

a black layer laminated on the dielectric multilayer film, having infrared transparency, and inhibiting transmission of visible light; and

a diffusion layer laminated on the second surface of the base layer.

12. The infrared transparent cover according to claim 9, wherein the information printed layer includes a plurality of layers.

13. The infrared transparent cover according to claim 1, wherein:

the base layer is a dark colored base layer having infrared transparency and includes a first surface close to the inner surface of the cover and a second surface close to the outer surface of the cover; and

the dielectric multilayer film is formed on the second surface of the dark colored base layer;

the cover further comprising;

a protective layer laminated on the dielectric multilayer film.

14. The infrared transparent cover according to claim 1, wherein:

the base layer is clear and colorless and includes a first surface close to the inner surface of the cover and a second surface close to the outer surface of the cover; and

the dielectric multilayer film is formed on the second surface of the base layer;

the cover further comprising;

a black layer laminated on the first surface of the base layer, having infrared transparency, and inhibiting transmission of visible light; and

a protective layer laminated on the dielectric multilayer film.

15. The infrared transparent cover according to claim 1, wherein the dielectric multilayer film selectively reflects visible light of a specific wavelength band.

16. The infrared transparent cover according to claim 15, wherein the dielectric multilayer film mainly transmits visible light having a wavelength outside the specific wavelength band.

17. The infrared transparent cover according to claim 15, having an appearance coloring other than black.

18. An electronic device comprising:

a housing with an opening;

an infrared detection element accommodated in the housing; and

the infrared transparent cover according to claim 1 attached to the housing and closing the opening.

19. A method for manufacturing an infrared transparent cover according to claim 1 comprising:

forming an infrared transparent and visible light reflective dielectric multilayer film on one surface of a base layer, having infrared transparency, under a low temperature by performing ion assist deposition, plasma CVD, or sputtering.

20. The method for manufacturing an infrared transparent cover according to claim 19, wherein the base layer is a low softening point material.

21. The infrared transparent cover according to claim 1, wherein the dielectric multilayer film has a visible wavelength band including both of a first wavelength band in which the reflectivity is greater than the transmittance and a second wavelength band in which the reflectivity is less than the transmittance.