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METHODS FOR INTEGRATION OF THIN-FILM CAPACITORS INTO THE BUILD-UP LAYERS OF A PRINTED WIRING BOARD

  • US 20080316723A1
  • Filed: 06/19/2007
  • Published: 12/25/2008
  • Est. Priority Date: 06/19/2007
  • Status: Active Grant
First Claim
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1. A device comprising a printed wiring board,the printed wiring board supportingan integrated circuit that hasan area,a plurality of active power and ground terminals, anda plurality of signal terminals,the printed wiring board comprising:

  • a plurality of known good, singulated capacitors,each known good, singulated capacitorhaving a power electrode and a ground electrode, andbeing formed from a known good, thin-film, fired-on-foil capacitor,the known good, thin-film, fired-on-foil capacitor comprisinga first and second electrode,the second electrode having a footprint,wherein each known good, singulated capacitor is formed within the footprint of the second electrode of the known good, fired-on-foil capacitor and embedded into the build-up layers of the printed wiring board;

    wherein each known good, singulated capacitor is of a size and of a pitch such that the plurality of singulated capacitors lies directly under and within the area of the IC;

    wherein each active power and ground terminal of the IC is directly connected to a corresponding power and ground electrode, respectively, of a known good, singulated capacitor; and

    wherein each signal terminal of the IC is directly connected to a signal pad isolated from the singulated capacitors but formed at the same time from the known good fired-on-foil capacitor.

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