Time division duplex front end module

• US 20080316948A1
• Filed: 06/17/2008
• Published: 12/25/2008
• Est. Priority Date: 06/14/2006
• Status: Active Grant

• Current Assignee: CTS Corporation
• Original Assignee: CTS Corporation
• Inventors: Knecht, Thomas A., Reeser, Glen
• Granted Patent: US 7,855,983 B2
• Time in Patent Office: Days
• US Class Current: 370/294
• CPC Class Codes: H04B 1/18 Input circuits, e.g. for coupling to an antenna or a transmission line coupling networks between antennas or lines and receivers independent of the nature of the receiver H03H
• CPC Class Codes: H04B 1/48 in circuits for connecting transmitter and receiver to a common transmission path, e.g. by energy of transmitter H04B1/46 takes precedence
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/09181 Notches in edge pads
• CPC Class Codes: H05K 2201/1006 Non-printed filter
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers

Abstract

An RF module adapted for direct surface mounting to the top surface of the front end of the motherboard of a wireless base station such as, for example, a femtocell. The module comprises a printed circuit board having a plurality of direct surface mounted electrical components defining respective signal transmit and receive sections for RF signals. The signal transmit section is defined by at least a power amplifier, a coupler, and a lowpass filter. The signal receive section is defined by at least a receive bandpass filter and a low-noise amplifier. A lid covers selected ones of the electrical components except for at least the power amplifier. An RF switch is located between and interconnects the respective transmit and receive sections to an antenna pin.

Claims

1. An RF module adapted for direct-surface mounting to the front end of the motherboard of a cell, the module comprising:

a substrate including top and bottom surfaces;

a first section on said substrate defining a transmit path for RF signals and including at least the following electrical components;

a power amplifier, a coupler, and a lowpass filter;

a second section on said substrate defining a receive path for RF signals and including at least the following electrical components;

a receive bandpass filter and a low-noise amplifier; and

an RF switch between and interconnecting said respective first and second sections to an antenna pin.

2. The RF module of claim 1 further comprising a lid adapted to cover at least said receive bandpass filter and said low-noise amplifier.

3. An RF module adapted for direct surface mounting to a front end of a motherboard of a wireless base station and adapted to transmit and receive RF signals, the module comprising:

a signal transmit section on a circuit board including at least a power amplifier, a coupler, and a lowpass filter; and

a signal receive section on said circuit board including at least a receive bandpass filter and a low-noise amplifier.

4. The RF module of claim 3 further comprising a lid adapted to cover selected ones of the electrical components mounted on said printed circuit board.

5. The RF module of claim 4, wherein at least said receive bandpass filter and said low-noise amplifier are located under said lid.

6. The RF module of claim 4, wherein said power amplifier is located outside said lid and said printed circuit board defines a plurality of through-holes located below said power amplifier.

7. The RF module of claim 3, wherein a switch is located between said respective signal transmit and receive sections.

8. An RF module adapted for direct surface mounting to a front end of a motherboard of a wireless base station, said module including a printed circuit board having a plurality of electrical components mounted thereon and adapted to allow for the transmission and reception of wireless signals between the antenna of said wireless base station on one end and the respective input and output pads on said motherboard of said wireless base station at the other end.

9. The RF module of claim 8 comprising at least a receive bandpass filter and a transmit lowpass filter all direct surface mounted to said printed circuit board of said module.

10. The RF module of claim 9 further comprising a power amplifier and a low-noise amplifier, both also direct surface mounted to said printed circuit board of said module.

11. The RF module of claim 10 wherein said power amplifier, a coupler, a lowpass filter and a switch define a transmit path for RF signals.

12. The RF module of claim 11 wherein said switch, said receive bandpass filter, and said low-noise amplifier define a receive path for RF signals.

13. The RF module of claim 12 further comprising a lid adapted to cover at least said low-noise amplifier and said receive bandpass filter.