Method and Device for Structuring a Substrate

• US 20080318168A1
• Filed: 07/27/2005
• Published: 12/25/2008
• Est. Priority Date: 09/09/2004
• Status: Abandoned Application

• Current Assignee: Forschungszentrum Jã¼Lich GmbH (Bundesrepublik Deutschland)
• Original Assignee: Forschungszentrum Jã¼Lich GmbH (Bundesrepublik Deutschland)
• Inventors: Szot, Krysztof, Reichenberg, Bernd, Peter, Frank
• Application Number:
  US11/662,308
• Publication Number:
  US 20080318168A1
• Time in Patent Office: Days
• US Class Current: 430/322
• CPC Class Codes: G03F 7/70383 Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams maskless lithography using a programmable mask G03F7/70291
• CPC Class Codes: G03F 7/704 Scanned exposure beam, e.g. raster-, rotary- and vector scanning mask projection exposure involving relative movement of patterned beam and workpiece during imaging G03F7/70358

Abstract

The invention relates to a method for structuring a substrate. According to said method, at least one mask with at least one opening is arranged over the substrate, and unmasked regions are modified in relation to masked regions of the substrate in order to form structures. The inventive method is characterised in that the representation of the mask opening on and/or in the substrate has smaller dimensions than those of the actual mask opening. The invention also relates to a device for carrying out said method.

Claims

1. A method for structuring a substrate, according to which at least one mask with an opening is positioned above the substrate and unmasked regions are changed compared to masked regions of the substrate to form structures, a reproduction of the mask opening being produced on and/or in the substrate during the structuring process, which reproduction is smaller than the mask opening wherein the surface(s) of the mask opening(s) is (are) verified by appropriate means.

2. The method according to claim 1 wherein at least two masks with openings are positioned one above the other and offset from each other in the X- and Y-directions on the substrate.

3. The method according to claim 1 wherein at least one mask is moved in relation to the substrate during the method.

4. The method according to claim 1 wherein a structure is produced with the method on and/or in the substrate, which structure has a different geometric shape than the mask opening.

5. The method according to claim 1 wherein during the process a deposition, implantation or exposure step is carried out to produce the structure.

6. The method according to claim 1 wherein the geometry of the structure in the substrate is produced as a function of the geometry selected for the sequence of relative movements between the substrate and mask opening(s).

7. The method according to claim 1 wherein the structuring and/or the sequence of relative movements between the substrate and mask(s) are carried out discontinuously.

8. The method according to claim 1 wherein an inertial drive mechanism is used to perform the relative movements.

9. The method according to claim 1 wherein at least one mask is selected that comprises a glass carrier with a metal layer provided thereon.

10. The method according to claim 1 wherein at least one mask with a circular or square opening is selected.

11. The method according to claim 1 wherein a mask comprising magnetic material is selected.

12. The method according to claim 1, wherein at least one mask performs movements along a isosceles triangle or horizontal elliptic movements or a square movement or a circular movement or a semicircular movement.

13. The method according to claim 1 wherein the position(s) of the mask(s) relative to the substrate is (are) determined by optical, interferometric and/or capacitive sensors.

14. The method according to claim 1 wherein a diode arrangement is selected as the means for controlling the change of the mask opening surface.

15. An apparatus for carrying out the method according to claim 14, comprising at least two masks that are positioned one above the other on the substrate in the z-direction, the mask openings of which masks are offset from each other in the X- and/or Y-directions wherein the apparatus comprises means for controlling the change of the mask opening surface.

16. An apparatus for carrying out the method according to claim 14, the apparatus comprising means for performing relative movements between at least one mask with a mask opening and the substrate wherein the apparatus comprises means for controlling the change of the mask opening surface.

17. An apparatus for carrying out the method according to claim 15 that wherein the apparatus comprises means for performing relative movements between at least the masks with mask openings and the substrate.

18. The apparatus according to claims 15 characterized wherein the apparatus comprises micro- and/or nanoactuators as means for performing movements.

19. An apparatus according to claim 15 wherein the apparatus comprises at least one piezoelectric element as the means for performing movements.

20. An apparatus according to claim 15 characterized wherein the apparatus comprises at least one microscope slide that can move above the means for performing movements.

21. An apparatus according to claim 15 characterized wherein the apparatus comprises a microscope slide made of magnetic material.

22. An apparatus according to claim 15 wherein the means for performing movements are part of a nanomanipulator.

23. An apparatus according to claim 15 wherein this apparatus comprises a control unit for performing relative movements between the mask(s) and substrate in the nanometer range.

24. An apparatus according to claim 15 wherein this apparatus comprises a deposition or implantation source for structuring the substrate.

25. An apparatus according to claim 15 wherein this apparatus can perform discontinuous sequences of movements and/or structuring steps.

26. An apparatus according to claim 15 wherein at least one mask performs movements along an isosceles triangle or horizontal elliptic movements or square movements or circular movements or semicircular movements.

27. An apparatus according to claim 15 wherein the position(s) of the mask(s) relative to the substrate is (are) determined by optical, interferometric and/or capacitive sensors.

28. An apparatus according to claim 15 wherein this apparatus comprises a diode arrangement as the means for controlling the change of the mask opening surface.

29. The apparatus according to claim 28, wherein the diode arrangement is positioned beneath the mask openings.

30. An apparatus according to claim 28 wherein the diode arrangement can be used to direct a UV beam at the mask openings to control clogging of the masks.