HEAT SINK FORMED WITH CONFORMAL SHIELD

• US 20090000114A1
• Filed: 12/07/2007
• Published: 01/01/2009
• Est. Priority Date: 06/27/2007
• Status: Active Grant

• Current Assignee: Qorvo US, Inc. (Qorvo, Inc.)
• Original Assignee: RF Micro Devices Incorporated (Qorvo, Inc.)
• Inventors: Morris, Thomas Scott, Rao, Jayanti Jaganatha, Shah, Milind
• Granted Patent: US 8,434,220 B2
• Time in Patent Office: Days
• US Class Current: 29/832
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01016 Sulfur [S]
• CPC Class Codes: H01L 2924/01018 Argon [Ar]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/0103 Zinc [Zn]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 1/0218 : by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 2203/0723 : Electroplating, e.g. finish plating
• CPC Class Codes: H05K 3/0052 : Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/181 : by electroless plating adhesives therefor H05K3/387
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: Y10T 29/49 : Method of mechanical manufacture
• CPC Class Codes: Y10T 29/49002 : Electrical device making
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49131 : by utilizing optical sighting device
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49153 : with shaping or forcing terminal into base aperture
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49204 : Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/49789 : Obtaining plural product pieces from unitary workpiece

Abstract

In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

Claims

1. A method of manufacturing a module comprising:

providing an electronic meta-module comprising;

a substrate;

a plurality of component areas on a surface of the substrate for a plurality of modules; and

a body formed from a dielectric material that covers the plurality of component areas, wherein certain component areas of the plurality of component areas are associated with metallic structures and comprise first electronic components that are covered by the body;

exposing at least a portion of the metallic structures associated with the certain component areas and at least a portion of the first electronic components through the body to provide a plurality of exposed metallic structures and exposed portions of the first electronic components; and

applying an electromagnetic shield material over at least portions of an exterior surface of the body for each of the certain component areas, on the plurality of exposed metallic structures to form electromagnetic shields over the certain component areas, and on the exposed portions of the first electronic components, wherein each of the certain component areas has an electromagnetic shield and a first electronic component beneath and in contact with the electromagnetic shield.

2. The method of claim 1 wherein the first electronic components are in thermal contact with the electromagnetic shields, which function as heat sinks.

3. The method of claim 1 wherein the first electronic components are in electrical contact with the electromagnetic shields, which function as conductive paths.

4. The method of claim 1 wherein the substrate further comprises heat sink vias, which are in thermal contact with the first electronic components.

5. The method of claim 4 wherein the substrate further comprises conductors for connecting the heat sink vias with the electromagnetic shields.

6. The method of claim 1 wherein the certain component areas further comprise second electronic components that are covered by the body and are not in contact with the electromagnetic shields.

7. The method of claim 6 wherein the substrate further comprises heat sink vias, which are in thermal contact with the first electronic components.

8. The method of claim 6 wherein the substrate further comprises heat sink vias, which are in thermal contact with the second electronic components.

9. The method of claim 1 further comprising separating the plurality of modules of the electronic meta-module from each other, wherein each module comprises at least one of the certain component areas having one of the electromagnetic shields.

10. The method of claim 1 further comprising exposing the exterior surface of the body to a reactive process gas to remove contaminants on the exterior surface of the body prior to applying the electromagnetic shield material.

11. The method of claim 1 further comprising roughening the exterior surface of the body prior to applying the electromagnetic shield material.

12. The method of claim 1 wherein applying the electromagnetic shield material comprises spraying a conductive material over the at least portions of the exterior surface of the body and on the plurality of exposed metallic structures.

13. The method of claim 1 wherein applying the electromagnetic shield material comprises plating at least one conductive material over the at least portions of the exterior surface of the body and on the plurality of exposed metallic structures.

14. The method of claim 13 wherein plating the at least one conductive material comprises plating a first layer with an electroless plating process and plating a second layer with an electrolytic plating process.

15. The method of claim 1 wherein the body is formed by uniformly covering the component areas for the plurality of modules with the dielectric material, such that the body is initially a single, continuous element that covers all of the plurality of component areas prior to exposing the exposed metallic structures.

16. The method of claim 1 wherein the metallic structures extend substantially about a periphery of each of the certain component areas.

17. The method of claim 16 wherein each of the metallic structures comprises a continuous metal trace on the top surface of the substrate and extending substantially about the periphery of each of the certain component areas.

18. The method of claim 16 wherein each of the metallic structures comprises a discontinuous metal trace on the top surface of the substrate and extending substantially about the periphery of each of the certain component areas.

19. The method of claim 16 wherein each of the metallic structures comprises a series of segments on the top surface of the substrate and extending substantially about the periphery of each of the certain component areas.

20. An electronic module formed by a process comprising:

providing an electronic meta-module comprising;

a substrate;

a plurality of component areas on a surface of the substrate for a plurality of modules; and

a body formed from a dielectric material that covers the plurality of component areas wherein certain component areas of the plurality of component areas are associated with metallic structures and comprise first electronic components that are covered by the body;

* exposing at least a portion of the metallic structures associated with the certain component areas and at least a portion of the first electronic components through the body to provide a plurality of exposed metallic structures and exposed portions of the first electronic components;

* applying an electromagnetic shield material over at least portions of an exterior surface of the body for each of the certain component areas, on the plurality of exposed metallic structures to form electromagnetic shields over the certain component areas, and on the exposed portions of the first electronic components, wherein each of the certain component areas has an electromagnetic shield and a first electronic component beneath and in contact with the electromagnetic shield; and

separating the plurality of modules of the electronic meta-module from each other to provide the electronic module.

21. The electronic module formed by the process of claim 20 wherein the first electronic components are in thermal contact with the electromagnetic shields, which function as heat sinks.

22. The electronic module formed by the process of claim 20 wherein the first electronic components are in electrical contact with the electromagnetic shields, which function as conductive paths.

23. The electronic module formed by the process of claim 20 wherein the substrate further comprises heat sink vias, which are in thermal contact with the first electronic components.

24. The electronic module formed by the process of claim 23 wherein the substrate further comprises conductors for connecting the heat sink vias with the electromagnetic shields.

25. The electronic module formed by the process of claim 20 wherein the certain component areas further comprise second electronic components that are covered by the body and are not in contact with the electromagnetic shields.