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HEAT SINK FORMED WITH CONFORMAL SHIELD

  • US 20090000114A1
  • Filed: 12/07/2007
  • Published: 01/01/2009
  • Est. Priority Date: 06/27/2007
  • Status: Active Grant
First Claim
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1. A method of manufacturing a module comprising:

  • providing an electronic meta-module comprising;

    a substrate;

    a plurality of component areas on a surface of the substrate for a plurality of modules; and

    a body formed from a dielectric material that covers the plurality of component areas, wherein certain component areas of the plurality of component areas are associated with metallic structures and comprise first electronic components that are covered by the body;

    exposing at least a portion of the metallic structures associated with the certain component areas and at least a portion of the first electronic components through the body to provide a plurality of exposed metallic structures and exposed portions of the first electronic components; and

    applying an electromagnetic shield material over at least portions of an exterior surface of the body for each of the certain component areas, on the plurality of exposed metallic structures to form electromagnetic shields over the certain component areas, and on the exposed portions of the first electronic components, wherein each of the certain component areas has an electromagnetic shield and a first electronic component beneath and in contact with the electromagnetic shield.

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