Cooling System

• US 20090000329A1
• Filed: 01/26/2007
• Published: 01/01/2009
• Est. Priority Date: 02/03/2006
• Status: Active Grant

• Current Assignee: Airbus Operations GmbH (Airbus SE)
• Original Assignee: Airbus Deutschland GmbH (Airbus SE)
• Inventors: Colberg, Carsten, Pfafferott, Torge
• Granted Patent: US 10,214,292 B2
• Time in Patent Office: Days
• US Class Current: 62/335
• CPC Class Codes: B64D 13/00 Arrangements or adaptations of air-treatment apparatus for aircraft crew or passengers, or freight space , or structural parts of the aircraft treatment rooms with artificial climate for medical purposes A61G10/02; respiratory apparatus in general A62B; for vehicles in general B60H
• CPC Class Codes: B64D 2013/0629 with subsystems for cooling food, catering or special loads
• CPC Class Codes: B64D 2013/0674 comprising liquid subsystems
• CPC Class Codes: F25B 2309/061 with cycle highest pressure above the supercritical pressure
• CPC Class Codes: F25B 2313/0233 in parallel arrangements
• CPC Class Codes: F25B 2313/02331 during cooling
• CPC Class Codes: F25B 25/005 using primary and secondary systems
• CPC Class Codes: F25B 40/00 Subcoolers, desuperheaters or superheaters
• CPC Class Codes: F25B 9/008 the refrigerant being carbon dioxide
• CPC Class Codes: F25D 17/02 for circulating liquids, e.g. brine
• CPC Class Codes: Y02T 50/40 Weight reduction

Abstract

A cooling system suitable for cooling food on board an aircraft is provided which includes a chiller device and a first cooling circuit which is adapted to feed cooling energy generated by the chiller device to at least one cooling station, the chiller device includes a second cooling circuit formed separately from the first cooling circuit and is thermally coupled to the first cooling circuit.

Claims

1. Cooling system for cooling food on board an aircraft, with

a chiller device and

a first cooling circuit adapted to feed cooling energy generated by the chiller device to at least one cooling station, wherein the chiller device comprises a second cooling circuit formed separately from the first cooling circuit and is thermally coupled to the first cooling circuit via a first heat exchanger, wherein a first refrigerant circulating in the first cooling circuit is selected such that it is convertible from the liquid to the gaseous state when its cooling energy is delivered to the at least one cooling station and then returnable to the liquid state again through appropriate pressure and temperature control in the first cooling circuit.

2. Cooling system according to claim 1, further comprising a first delivery device for circulating the first refrigerant in the first cooling circuit is disposed in the first cooling circuit.

3. Cooling system according to claim 1, further comprising a first reservoir for temporarily storing the first refrigerant is disposed in the first cooling circuit.

4. Cooling system according to claim 1, wherein a throttle valve is disposed in the first cooling circuit.

5. Cooling system according to claim 1, further comprising a second delivery device for circulating a second refrigerant in the second cooling circuit is disposed in the second cooling circuit.

6. Cooling system according to claim 1, wherein a cooling device is disposed in the second cooling circuit.

7. Cooling system according to claim 5, further comprising a second heat exchanger is disposed in the second cooling circuit, wherein the second heat exchanger thermally couples a portion of the second cooling circuit which extends upstream of the cooling device to a portion of the second cooling circuit which extends downstream of the cooling device.

8. Cooling system according to claim 1, wherein a second reservoir for temporarily storing the second refrigerant is disposed in the second cooling circuit.

9. Cooling system according to claim 1, wherein the cooling station includes a third cooling circuit which is formed separately from the first cooling circuit and is thermally coupled to the first cooling circuit.

10. Cooling system according to claim 9, wherein the third cooling circuit is thermally coupled to the first cooling circuit via a third heat exchanger formed as an evaporation device.