SUBSTRATE PROCESSING APPARATUS AND SHOWER HEAD

• US 20090000743A1
• Filed: 06/26/2008
• Published: 01/01/2009
• Est. Priority Date: 06/27/2007
• Status: Abandoned Application

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: IIZUKA, Hachishiro
• Application Number:
  US12/146,706
• Publication Number:
  US 20090000743A1
• Time in Patent Office: Days
• US Class Current: 156/345.340
• CPC Class Codes: H01J 37/32091 the radio frequency energy being capacitively coupled to the plasma
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01J 37/32449 Gas control, e.g. control of the gas flow
• CPC Class Codes: H01J 37/32724 Temperature

Abstract

A substrate processing apparatus includes a shower head having a shower plate of which gas injection portion is formed by a two layer structure made of metal and ceramic. The shower head has an upper plate made of a metal and having a gas inlet hole; a lower plate made of a metal and having a plurality of gas through holes; a gas diffusion space formed between the upper plate and the lower plate; and a cover member made of ceramic and having a plurality of gas injection openings positioned to correspond to the gas through holes, for covering an entire bottom surface of the lower plate. The shower head further includes a plurality of thermally conductive members provided to connect the upper plate with the lower plate in the gas diffusion space for transferring heat generated by processing upward.

Claims

1. A substrate processing apparatus comprising:

a processing chamber accommodating therein a substrate to be processed;

a mounting table disposed in the processing chamber, for mounting thereon the substrate to be processed;

a shower head provided opposite to the mounting table, for injecting a processing gas into the processing chamber;

a gas exhaust unit for exhausting an inside of the processing chamber; and

a processing unit for performing a predetermined processing on the substrate to be processed in the processing chamber,

wherein the shower head includes;

an upper plate made of a metal and having a gas inlet hole;

a lower plate made of a metal and having a plurality of gas through holes;

a gas diffusion space formed between the upper plate and the lower plate;

a cover member made of ceramic and having a plurality of gas injection openings positioned to correspond to the gas through holes, for covering a bottom surface of the lower plate; and

a plurality of thermally conductive members provided to connect the upper plate with the lower plate in the gas diffusion space, for transferring heat generated by the processing of the processing unit upward.

4. The substrate processing apparatus of claim 1 or 2, wherein the processing unit performs plasma processing on the substrate to be processed by generating a plasma in the processing chamber.

5. The substrate processing apparatus of claim 4, wherein the processing unit forms a high frequency electric field between the mounting table and the shower head, and a plasma is generated by the high frequency electric field.

6. The substrate processing unit of claim 1 or 2, wherein a contact portion between the lower plate and the cover member is formed in a convexoconcave shape.

7. The substrate processing apparatus of claim 1 or 2, wherein the thermally conductive members have a cylindrical shape.

8. The substrate processing apparatus of claim 1 or 2, wherein the thermally conductive members have a diameter in a range from about 2 to 12 mm.

9. The substrate processing apparatus of claim 1 or 2, wherein the shower head further includes a cooling unit for forcibly emitting heat transferred via the thermally conductive members.

2. A substrate processing apparatus comprising:

a processing chamber accommodating therein a substrate to be processed;

a mounting table disposed in the processing chamber, for mounting thereon the substrate to be processed;

a shower head provided at opposite to the mounting table, for injecting a processing gas into the processing chamber;

a gas exhaust unit for exhausting an inside of the processing chamber; and

a processing unit for performing a predetermined processing on the substrate to be processed in the processing chamber,

wherein the shower head includes;

an upper plate made of a metal and having a gas inlet hole;

a lower plate made of a metal and having a plurality of gas through holes;

a middle plate provided between the upper plate and the lower plate and having a plurality of gas through holes;

a first gas diffusion space provided between the upper plate and the middle plate;

a second gas diffusion space provided between the middle plate and the lower plate;

a cover member made of ceramic and having a plurality of gas injection openings positioned to correspond to the gas through holes, for covering a bottom surface of the lower plate; and

a plurality of thermally conductive members provided to connect the upper plate with the middle plate in the first gas diffusion space and to connect the middle plate with the lower plate in the second gas diffusion space, for transferring heat generated by the processing of the processing unit upward.

3. The substrate processing apparatus of claim 2, wherein the thermally conductive members provided in the first gas diffusion space and the thermally conductive members provided in the second diffusion space are arranged to correspond to each other.

10. A shower head provided opposite to a mounting table which mounts thereon a substrate to be processed in a processing chamber, for injecting a processing gas into the processing chamber, the shower head comprising:

an upper plate made of a metal and having a gas inlet hole;

a lower plate made of a metal and having a plurality of gas through holes;

a gas diffusion space formed between the upper plate and the lower plate;

a cover member made of ceramic and having a plurality of gas injection openings positioned to correspond to the gas through holes, for covering a bottom surface of the lower plate; and

a plurality of thermally conductive members provided to connect the upper plate with the lower plate in the gas diffusion space, for transferring heat generated by processing performed in the processing chamber upward.

13. The shower head of claim 10 or 11, wherein the processing is plasma processing which is performed on a substrate to be processed by generating a plasma in the processing chamber.

14. The shower head of claim 10 or 11, wherein a contact portion between the lower plate and the cover member is formed in a convexoconcave shape.

15. The shower head of claim 10 or 11, wherein the thermally conductive members have a cylindrical shape.

16. The shower head of claim 10 or 11, wherein the thermally conductive members have a diameter in a rage from about 2 to 12 mm.

17. The shower head of claim 10 or 11, wherein the shower head further includes a cooling unit for forcibly emitting heat transferred via the thermally conductive members.

11. A shower head provided opposite to a mounting table which mounts thereon a substrate to be processed in a processing chamber, for injecting a processing gas when performing a predetermined processing in the processing chamber, the shower head comprising:

an upper plate made of a metal and having a gas inlet hole;

a lower plate made of a metal and having a plurality of gas through holes;

a middle plate provided between the upper plate and the lower plate, having a plurality of gas through holes;

a first gas diffusion space provided between the upper plate and the lower plate;

a second gas diffusion space provided between the middle plate and the lower plate;

a cover member made of ceramic and having a plurality of gas injection openings positioned to correspond to the gas through holes, for covering a bottom surface of the lower plate; and

a plurality of thermally conductive members provided to connect the upper plate with the middle plate in the first gas diffusion space and to connect the middle plate with the lower plate in the second gas diffusion space, for transferring heat generated by the processing performed in the processing chamber upward.

12. The shower head of claim 11, wherein the thermally conductive members provided in the first gas diffusion space and the thermally conductive members provided in the second diffusion space are arranged to correspond to each other.