Temperature Controlled Loadlock Chamber

• US 20090000769A1
• Filed: 06/27/2007
• Published: 01/01/2009
• Est. Priority Date: 06/27/2007
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Sheu, Jyh-Cherng, Yoo, Ming-Feng, Lin, Chun-Hsien, Zuo, Kewei
• Granted Patent: US 8,905,124 B2
• Time in Patent Office: Days
• US Class Current: 165/80.400
• CPC Class Codes: H01L 21/67201 characterized by the construction of the load-lock chamber
• CPC Class Codes: H01L 21/67248 Temperature monitoring

Abstract

A temperature controlled loadlock chamber for use in semiconductor processing is provided. The temperature controlled loadlock chamber may include one or more of an adjustable fluid pump, mass flow controller, one or more temperature sensors, and a controller. The adjustable fluid pump provides fluid having a predetermined temperature to a temperature-controlled plate. The mass flow controller provides gas flow into the chamber that may also aid in maintaining a desired temperature. Additionally, one or more temperature sensors may be combined with the adjustable fluid pump and/or the mass flow controller to provide feedback and to provide a greater control over the temperature. A controller may be added to control the adjustable fluid pump and the mass flow controller based upon temperature readings from the one or more temperature sensors.

Claims

1. A loadlock chamber for semiconductor processing, the loadlock chamber comprising:

a chamber having sidewalls, a top, and a bottom;

a temperature-controlled plate within the chamber, the temperature-controlled plate having a first intake port and a first output port; and

a chiller having a second output port coupled to the first intake port and a second intake port coupled to the first output port, the chiller having an adjustable temperature within a range of temperatures at which the chiller may provide cooling fluid to the temperature-controlled plate via the second output port and the first intake port.

2. The loadlock chamber of claim 1, further comprising a mass flow controller providing gas to an interior region of the chamber.

3. The loadlock chamber of claim 2, further comprising:

one or more temperature sensors within the chamber; and

a controller communicatively coupled to the one or more temperature sensors and to the mass flow controller, the controller adjusting a flow rate of the gas supplied by the mass flow controller based at least in part on one or more temperature samples received from the one or more temperature sensors.

4. The loadlock chamber of claim 1, wherein the temperature-controlled plate includes a plurality of pins.

5. The loadlock chamber of claim 1, further comprising:

one or more temperature sensors within the chamber; and

a controller communicatively coupled to the one or more temperature sensors and to the chiller, the controller adjusting the adjustable temperature based at least in part on one or more temperature samples received from the one or more temperature sensors.

6. The loadlock chamber of claim 1, wherein the chiller provides cooling liquid at a pressure of about 1 atm to about 10 atm.

7. The loadlock chamber of claim 1, wherein the range of temperatures is about 17°

C. to about 120°

C.

8. A loadlock chamber for semiconductor processing, the loadlock chamber comprising:

a chamber having sidewalls, a top, and a bottom;

a temperature-controlled plate within the chamber;

an adjustable chiller coupled to the temperature-controlled plate, the adjustable chiller providing cooling liquid to the temperature-controlled plate;

a gas intake port in the chamber; and

a mass flow controller coupled to the gas intake port, the mass flow controller allowing a flow of gas into the chamber.

9. The loadlock chamber of claim 8, wherein the gas comprises nitrogen or helium.

10. The loadlock chamber of claim 8, wherein the adjustable chiller provides cooling liquid at a pressure of about 1 atm to about 10 atm.

11. The loadlock chamber of claim 8, wherein the adjustable chiller is configured to provide cooling liquid at any temperature between about 17°

C. and about 120°

C.

12. The loadlock chamber of claim 8, further comprising one or more temperature sensors mounted within the chamber.

13. The loadlock chamber of claim 12, further comprising a controller communicatively coupled to the one or more temperature sensors, the controller controlling at least one of a temperature or a pressure of the cooling liquid provided by the adjustable chiller to the temperature-controlled plate based at least in part on the one or more temperature sensors.

14. The loadlock chamber of claim 12, further comprising a controller communicatively coupled to the one or more temperature sensors, the controller controlling the flow rate of gas into the chamber by the mass flow controller based at least in part on the one or more temperature sensors.

15. A loadlock chamber for semiconductor processing, the loadlock chamber comprising:

a chamber having an interior region and an exterior region, the chamber having a first port;

a mass flow controller coupled to the chamber, the mass flow controller providing gas to the interior region of the chamber;

a cooling plate in the interior region of the chamber;

an adjustable chiller coupled to the cooling plate, the adjustable chiller flowing fluid at an adjustable temperature through the cooling plate;

one or more temperature sensors in the interior region of the chamber; and

a controller communicatively coupled to the one or more temperature sensors, the adjustable chiller, and the mass flow controller, the controller configured to receive one or more temperature samples from the one or more temperature sensors and to adjust the mass flow controller or the adjustable chiller based upon the one or more temperature samples.

16. The loadlock chamber of claim 15, wherein the gas comprises nitrogen or helium.

17. The loadlock chamber of claim 15, wherein the adjustable chiller provides cooling liquid at a pressure of about 1 atm to about 10 atm.

18. The loadlock chamber of claim 15, wherein the adjustable chiller is configured to provide cooling liquid at any temperature between about 17°

C. and about 120°

C.

19. The loadlock chamber of claim 15, wherein the controller adjusts the temperature of the fluid at which the adjustable chiller provides cooling liquid to the cooling plate.

20. The loadlock chamber of claim 15, wherein the controller adjusts the flow rate of gas supplied by the mass flow controller.