Connecting Structure and Adhesion Method of Pcb Using Anisotropic Conductive Film, and Method for Evaluating Connecting Condition Using the Same

• US 20090000807A1
• Filed: 01/22/2007
• Published: 01/01/2009
• Est. Priority Date: 01/20/2006
• Status: Active Grant

• Current Assignee: H&S Hightech Corp.
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Chung, Yoon-Jae, Moon, Hyuk-Soo, Park, Jeong-Beom, Lee, Kyung-Joon, Han, Yong-Seok, Han, Chul-Jong, Choi, Sung-Uk, Jang, Jong-Yoon, Cho, Il-Rae
• Granted Patent: US 7,993,417 B2
• Time in Patent Office: Days
• US Class Current: 174/250
• CPC Class Codes: H05K 2201/091 Locally and permanently deformed areas including dielectric material
• CPC Class Codes: H05K 2203/0278 Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• CPC Class Codes: H05K 3/323 by applying an anisotropic conductive adhesive layer over an array of pads
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49131 by utilizing optical sighting device
• CPC Class Codes: Y10T 29/49144 by metal fusion

Abstract

A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 μm due to dents formed by heat-compression.

Claims

1. A connecting structure of printed circuit board having first and second members adhered to each other using an anisotropic conductive film interposed therebetween, the anisotropic conductive film including an insulating adhesive and conductive particles dispersed therein,

wherein the first member has a flexible property relatively to the second member, and wherein, after the first and second members are adhered to each other by heat compression, a surface roughness value of dents formed on the surface of the first member is in the range of 0.1 to 5.0 μ

M.

2. The connecting structure of PCB of claim 1, wherein the first member is Flexible Printed Circuit.

3. A method for adhering to a pair of members, the method comprising:

(a) arranging an anisotropic conductive film including an insulating adhesive and conductive particles dispersed in the insulating adhesive, on one surface of a first member;

(b) applying predetermined heat and pressure to heat-compress the anisotropic conductive film to the first member;

(c) arranging a second member having a flexible property on a surface of the anisotropic conductive film opposite to the surface to which the first member is adhered; and

(d) applying predetermined heat and pressure to heat-compress the anisotropic conductive film to the second member,

wherein the step (d) includes controlling compression pressure, temperature and time such that a surface roughness value of dents formed on the surface of the second member is in the range of 0.1 to 5.0 μ

m.

4. The method for adhering to a pair of members of claim 3, wherein, in the step (d), the compression pressure is 2 MPa to 12 MPa.

5. The method for adhering to a pair of members of claim 3, wherein, in the step (d), the compression temperature is in the range of 120°

C. to 220°

C.

6. The method for adhering to a pair of members of claim 3, herein, in the step (d), the compression time is in the range of 3 to 30 seconds.

7. A method for evaluating a connection state between members, the method comprising:

(a) arranging an anisotropic conductive film including an insulating adhesive and conductive particles dispersed in the insulating adhesive, on one surface of a first member;

(b) applying predetermined heat and pressure to heat-compress the anisotropic conductive film to the first member;

(c) arranging a second member having a flexible property on a surface of the anisotropic conductive film opposite to the surface to which the first member is adhered;

(d) applying predetermined heat and pressure to heat-compress the anisotropic conductive film to the second member; and

(e) measuring a surface roughness value of dents formed on the surface of the second member,

wherein, when a surface roughness value is in the range of 0.1 to 5.0 μ

m the connection state between the members is determined to be normal.