CONFORMAL SHIELDING PROCESS USING FLUSH STRUCTURES
First Claim
1. A method of manufacturing a module comprising:
- providing an electronic meta-module comprising a substrate and a plurality of component areas on a surface of the substrate for a plurality of modules, wherein certain component areas of the plurality of component areas are associated with exposed metallic structures;
forming a body of a dielectric material that covers the plurality of component areas, wherein a top surface of each of the exposed metallic structures is substantially flush with a top portion of an exterior surface of the body; and
applying an electromagnetic shield material over at least portions of the exterior surface of the body for each of the certain component areas and on the top surface of each of the exposed metallic structures to form electromagnetic shields over the certain component areas.
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Accused Products
Abstract
In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
165 Citations
25 Claims
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1. A method of manufacturing a module comprising:
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providing an electronic meta-module comprising a substrate and a plurality of component areas on a surface of the substrate for a plurality of modules, wherein certain component areas of the plurality of component areas are associated with exposed metallic structures; forming a body of a dielectric material that covers the plurality of component areas, wherein a top surface of each of the exposed metallic structures is substantially flush with a top portion of an exterior surface of the body; and applying an electromagnetic shield material over at least portions of the exterior surface of the body for each of the certain component areas and on the top surface of each of the exposed metallic structures to form electromagnetic shields over the certain component areas. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. An electronic module formed by a process comprising:
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providing an electronic meta-module comprising a substrate and a plurality of component areas on a surface of the substrate for a plurality of modules, wherein certain component areas of the plurality of component areas are associated with exposed metallic structures; forming a body of a dielectric material that covers the plurality of component areas, wherein a top surface of each of the exposed metallic structures is substantially flush with a top portion of an exterior surface of the body; applying an electromagnetic shield material over at least portions of the exterior surface of the body for each of the certain component areas and on the top surface of each of the exposed metallic structures to form electromagnetic shields over the certain component areas; and separating the plurality of modules of the electronic meta-module from each other to provide the electronic module. - View Dependent Claims (21, 22, 23, 24, 25)
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Specification