Mems Package and Method for the Production Thereof

• US 20090001553A1
• Filed: 11/06/2006
• Published: 01/01/2009
• Est. Priority Date: 11/10/2005
• Status: Active Grant

• Current Assignee: TDK Corporation
• Original Assignee: Epcos AG (TDK Corporation)
• Inventors: Stelzl, Alois, Krueger, Hans, Pahl, Wolfgang, Leidl, Anton, Seitz, Stefan
• Granted Patent: US 8,169,041 B2
• Time in Patent Office: Days
• US Class Current: 257/704
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 7/0064 for protecting against electromagnetic or electrostatic interferences
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 19/005 using semiconductor materials

Abstract

A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.

Claims

1. A micro electro-mechanical systems (MEMS) package, comprising:

a carrier substrate having a top side,

a MEMS chip mounted on the top side of the carrier substrate,

at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate, and

a thin metallic shielding layer covering the MEMS chip and the at least one chip component and forming a seal with the top side of the carrier substrate,

wherein the MEMS chip and the at least one chip component are electrically connected to each other or with external contacts on the carrier substrate.

2. The MEMS package of claim 1, further comprising an enclosure between the metallic shielding layer and the MEMS chip.

3. The MEMS package of claim 2, wherein the enclosure comprises a laminate film applied over a large surface area above the MEMS chip and the at least one chip component, the laminate film forming a seal with the carrier substrate.

4. The MEMS package of claim 2, wherein the enclosure forms a cover on the MEMS chip.

5. The MEMS package of claim 4, wherein the cover includes a recess facing the MEMS chip and encloses a cavity above the MEMS chip.

6. The MEMS package of claim 1, wherein the at least one chip component is on the MEMS chip under the shielding layer.

7. The MEMS package of claim 2, wherein the enclosure includes a perforation above the MEMS chip.

8. The MEMS package of claim 2, wherein the enclosure comprises a rigid cap on the carrier substrate and forms with the carrier substrate a cavity, wherein the MEMS chip is in the cavity, and wherein the shielding layer is directly on the rigid cap and on the carrier substrate in an edge region around the rigid cap.

9. The MEMS package of claim 2, further comprising a metallization structure above the enclosure, wherein the metallization structure is electrically connected through contact holes in the enclosure to one or more of the MEMS chip, the at least one chip component, and contact surfaces of the carrier substrate.

10. The MEMS package of claim 1, wherein the MEMS chip includes an active side comprising MEMS structures, and a central recess in a passive side opposite the active side, the passive side facing toward the carrier substrate,

wherein a layer thickness of the MEMS chip is reduced in the central recess or the MEMS structures are exposed in the recess.

11. The MEMS package of claim 10, wherein the MEMS chip includes electrical via contacts, and the MEMS structures are electrically connected to terminal surfaces on the carrier substrate by the electrical via contacts.

12. The MEMS package of claim 10, wherein:

the MEMS chip is bonded to the carrier substrate on the passive side, and

the active side includes electrical contact surfaces electrically connected by bonding wires to terminal surfaces on the carrier substrate.

13. The MEMS package of claim 10, wherein:

the active side of the MEMS chip faces toward the carrier substrate, and corresponding electrical contact surfaces on the active side of the MEMS structures and terminal surfaces on the carrier substrate are facing each other and are electrically and mechanically connected.

14. The MEMS package of claim 1, wherein the chip component is under the MEMS chip on the top side of the carrier substrate and is electrically connected to terminal surfaces on the carrier substrate.

15. The MEMS package of claim 1, wherein the chip component is under the MEMS chip and is electrically and mechanically connected to the MEMS chip.

16. The MEMS package of claim 13, further comprising a joint between the MEMS chip and the carrier substrate sealed by a joint seal.

17. The MEMS package of claim 4, wherein the shielding layer is on the MEMS chip tightly contacts the cover, side surfaces of the MEMS chip, and the top side of the carrier substrate.

18. The MEMS package of claim 4, wherein:

the MEMS chip and the at least one chip component are one next to the other and are electrically connected to terminal surfaces on the carrier substrate,

the enclosure seals the MEMS chip and the chip component to the carrier substrate separately, and

the shielding layer covers the MEMS chip and the chip component.

19. The MEMS package of claim 18, wherein:

an active sided MEMS chip is electrically and mechanically connected to the carrier substrate by one or more of bumps and electrically conductive adhesive,

the cover is on a passive side of the MEMS chip facing away from the top side of the carrier substrate,

the MEMS chip, the cover, and the at least one chip component are covered with the laminate film, and

the shielding layer is on an outward surface of the laminate film.

20. The MEMS package of claim 17, wherein:

an active sided MEMS chip is electrically and mechanically connected to the carrier substrate by one of more of bumps and electrically conductive adhesive,

the at least one chip component is configured to provide a cover on a surface of the MEMS chip facing away from the top side of the carrier substrate and is electrically connected to the MEMS chip,

the MEMS chip and the at least one chip component are covered with a first laminate film that includes;

contact holes,

a first metallization structure, electrically connected to the at least one chip component and to contact surfaces on the top side of the carrier substrate, is above the laminate film,

an electrically insulating layer is above the metallization structure, and

the shielding layer is above the insulating layer.

21. The MEMS package of claim 1, wherein:

the MEMS chip comprises a microphone,

a perforation is provided in one or more of the enclosure and the shielding layer, or the MEMS chip is above a sound opening in the carrier substrate and

the MEMS package further comprises a closed back volume on a side of the MEMS chip opposite the sound opening or the perforation.

22. The MEMS package of claim 21, wherein:

the MEMS chip and the at least one chip component are mounted one next to the other on the carrier substrate,

the cavity is formed in the carrier substrate under the at least one chip component, and

the cavity is connected to the closed back volume under the MEMS chip.

23. The MEMS package of claim 19, wherein the electrically conductive adhesive has an anisotropic conductivity perpendicular to an adhesive layer.

24. The MEMS package of claim 1, wherein the carrier substrate comprises a diffusion-resistant material and the shielding layer binds tightly to the diffusion-resistant material circumferentially.

25. The MEMS package of claim 4, wherein the cover comprises a material permeable to electromagnetic radiation, and wherein one or both of the enclosure and the shielding layer is are perforated in a region of the cover.

36. The MEMS package of claim 9, further comprising an electrically insulating layer above the metallization structure and the shielding layer.

26. A method for producing a MEMS package, comprising:

providing a carrier substrate that includes external contacts

mounting a MEMS chip on the carrier substrate,

arranging a chip component above the carrier substrate,

producing an electrical connection between the MEMS chip, the chip component, and the external contacts on the carrier substrate,

placing an enclosure above the MEMS chip and the chip component, and

applying a shielding layer comprising a thin metallic layer above the enclosure.

27. The method of claim 26, wherein:

placing the enclosure comprises laminating a laminate film as an enclosure, the laminate film forming a seal with the carrier substrate around the MEMS chip and the chip component and

applying the shielding layer comprises applying the shielding layer over a large surface area on the laminate film and the carrier substrate, such that the shielding layer forms a seal with the carrier substrate and is connected electrically at one or more positions to a contact surface of the carrier substrate.

28. The method of claim 26, wherein applying the shielding layer comprises generating the shielding layer at least partially by depositing metal from a solution.

29. The method of claim 26, wherein applying the shielding layer comprises generating the shielding layer at least partially by sputtering, a PVD or CVD process, or by evaporation of metal.

30. The method of claim 27, further comprising

generating contact holes in the laminate film after laminating the laminate film,

producing a metallization structure above the laminate film, such that the metallization structure is electrically conductively connected in the contact holes to the MEMS chip and/or to the chip component, and

covering the metallization structure with an electrically insulating layer before applying the shielding layer.

31. The method of claim 30, further comprising applying and structuring a metal layer over a large surface area before producing the metallization structure.

32. The method of claim 30, wherein the metallization structure is structured by selective deposition from a solution or structured printing in a jet method.

33. The method of claim 30, further comprising producing an interconnection of the MEMS chip and/or the chip component with terminal surfaces on the carrier substrate by the metallization structure.

34. The method of claim 26, further comprising

placing a plurality of MEMS chips and chip components in parallel on a large surface area carrier substrate,

applying the shielding layer as the topmost layer, and

separating the MEMS chips and chip components by dividing the carrier substrate into individual MEMS packages.

35. The method of claim 34, further comprising placing the MEMS chips or the chip components, before mounting on the carrier substrate, on a similarly sized auxiliary carrier in a corresponding pattern, and connecting the MEMS chips and the chip components to the carrier substrate in one step.