Wideband planar transformer
First Claim
1. A method of fabricating a wideband planar transformer comprising:
- a. providing a bottom mold, wherein said bottom mold comprises a pattern of hole pairs disposed in a planar base of said bottom mold;
b. inserting conductive elements to said holes, wherein said conductive elements are disposed vertically from said planar base, whereby a bottom portion of said conductive elements are held by said bottom mold;
c. providing a first top mold, wherein said first top mold is disposed on said bottom mold forming a first mold pair, whereas said first top mold comprises conductive element receiving features and a displacement feature disposed between said conductive element receiving features, whereby a middle portion of said conductive elements spans between said first top mold and said bottom mold;
d. depositing a dielectric material to said first mold pair, wherein said dielectric material envelopes said middle portion of said conductive elements and further envelopes said displacement feature;
e. removing said first top mold, wherein a vacancy is revealed by removing said displacement feature;
f. depositing a ferrite element to said vacancy;
g. providing a second top mold to said bottom mold, wherein said second top mold and said bottom mold define a second mold pair, whereby said second top mold spans said bottom mold;
h. depositing said dielectric material to said second mold pair to create a molded assembly, wherein said dielectric material envelopes a top portion of said conductive element and envelopes said ferrite element;
i. removing said molded assembly from said second mold pair, wherein said molded assembly comprises a top surface and a bottom surface;
j. preparing said top surface and said bottom surface for receiving a pattern of conductive coatings, wherein said preparation comprises removing said top conductive element portion and said bottom conductive element portion, whereby said top surface and said bottom surface comprise said dielectric material and planed ends of said conductive element middle portion;
k. applying said conductive coating, wherein said coating is disposed to connect said middle portion conductive element ends according to a conductive pattern, wherein said conductive pattern defines a primary coil and a secondary coil of said wideband planar transformer.
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Accused Products
Abstract
A method of arranging and fabricating parallel primary and secondary coils of a wideband planar transformer is provided. The spacing and width of the coils are disposed to extend the bandwidth from DC to GHz and allow for high frequency coupling when the core permeability dramatically drops and achieves low reflected energy and low loss over a wide bandwidth. A bottom mold having a pattern of hole-pairs with conductive elements inserted vertically couples to a top mold such that a middle portion of the conductive elements spans between the top and bottom molds. Dielectric material envelopes the middle portion and a displacement feature of the mold creates a vacancy. A ferrite element is deposited to the vacancy. A second top mold spans the bottom mold and dielectric material is deposited to create a molded assembly. A deposited patterned conductive coating connects the element ends to define the transformer coils.
73 Citations
18 Claims
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1. A method of fabricating a wideband planar transformer comprising:
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a. providing a bottom mold, wherein said bottom mold comprises a pattern of hole pairs disposed in a planar base of said bottom mold; b. inserting conductive elements to said holes, wherein said conductive elements are disposed vertically from said planar base, whereby a bottom portion of said conductive elements are held by said bottom mold; c. providing a first top mold, wherein said first top mold is disposed on said bottom mold forming a first mold pair, whereas said first top mold comprises conductive element receiving features and a displacement feature disposed between said conductive element receiving features, whereby a middle portion of said conductive elements spans between said first top mold and said bottom mold; d. depositing a dielectric material to said first mold pair, wherein said dielectric material envelopes said middle portion of said conductive elements and further envelopes said displacement feature; e. removing said first top mold, wherein a vacancy is revealed by removing said displacement feature; f. depositing a ferrite element to said vacancy; g. providing a second top mold to said bottom mold, wherein said second top mold and said bottom mold define a second mold pair, whereby said second top mold spans said bottom mold; h. depositing said dielectric material to said second mold pair to create a molded assembly, wherein said dielectric material envelopes a top portion of said conductive element and envelopes said ferrite element; i. removing said molded assembly from said second mold pair, wherein said molded assembly comprises a top surface and a bottom surface; j. preparing said top surface and said bottom surface for receiving a pattern of conductive coatings, wherein said preparation comprises removing said top conductive element portion and said bottom conductive element portion, whereby said top surface and said bottom surface comprise said dielectric material and planed ends of said conductive element middle portion; k. applying said conductive coating, wherein said coating is disposed to connect said middle portion conductive element ends according to a conductive pattern, wherein said conductive pattern defines a primary coil and a secondary coil of said wideband planar transformer. - View Dependent Claims (2, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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3. A method of fabricating a wideband planar transformer comprising:
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a. providing a bottom mold, wherein said bottom mold comprises a pattern of hole pairs disposed in a planar base of said bottom mold; b. inserting conductive elements to said holes, wherein said conductive elements are disposed vertically from said planar base forming conductive element pairs, whereby a bottom portion of said conductive elements are held by said bottom mold; c. inserting a standoff element to said mold bottom, wherein said standoff element is made from a dielectric material; d. disposing a ferrite material on said standoff element, wherein said ferrite material separates said conductive element pairs; e. providing a top mold to said bottom mold, wherein said top mold spans said bottom mold, whereby said top mold and said bottom mold define a mold pair; f. depositing said dielectric material to said mold pair to create a molded assembly, wherein said dielectric material envelopes a top portion of said conductive element and envelopes said ferrite element and said standoff element; g. removing said molded assembly from said mold pair, wherein said molded assembly comprises a top surface and a bottom surface; h. preparing said top surface and said bottom surface for receiving a pattern of conductive coatings, wherein said preparation comprises making planar said assembly top surface and said bottom surface, whereby ends of said conductive elements are even with said planar surfaces; i. applying said conductive coating, wherein said coating is disposed to connect said conductive element ends according to a conductive pattern, wherein said conductive pattern defines a primary coil and a secondary coil of said wideband planar transformer.
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15. A wideband planar transformer comprising:
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a. a ferrite element; b. at least one conductive element disposed on a first side of said ferrite element; c. at least one conductive element disposed on a second side of said ferrite element, wherein said first conductive element and said second conductive element form a pair of conductive elements; d. a bottom pattern of conductive coating, wherein said bottom pattern is a pattern of teardrop-shape conductors, whereby said bottom teardrop-shape conductor is disposed to connect a bottom end of said first side conductive element of one said pair with a bottom end of said second side conductive element of an adjacent said pair; e. a top pattern of conductive coating, wherein said top pattern is a pattern of said teardrop-shape coatings, whereby said top teardrop-shape conductor is disposed to connect a top end of said first side conductive element with a top end of said second side conductive element of said adjacent pair, whereas said conductive coatings and said conductive elements form a primary coil and a secondary coil around said ferrite element; f. a first primary electrode connected to a first end of said primary coil and a second primary electrode connected to a second end of said primary coil; g. a first secondary coil electrode connected to a first end of said secondary coil and a second secondary coil electrode connected to a second end of said secondary coil; h. a primary coil tap connected to any coil of said primary coil; i. a secondary coil tap connected to any coil of said secondary coil; and j. a dielectric material enveloping said ferrite element and said coils. - View Dependent Claims (16, 17, 18)
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Specification