Method of Forming a Substrate Core Structure Using Microvia Laser Drilling and Conductive Layer Pre-Patterning And Substrate Core Structure Formed According to the Method
First Claim
1. A method of fabricating a substrate core structure comprising:
- providing a starting insulating layer;
providing a first patterned conductive layer on one side of the starting insulating layer, and a second patterned conductive layer on another side of the starting insulating layer each of the first patterned conductive layer and the second patterned conductive layer defining conductive layer openings therein;
providing a supplemental insulating layer onto the first patterned conductive layer, and a second supplemental insulating layer onto the second patterned conductive layer;
laser drilling a set of via openings extending from a side of the second supplemental insulating layer farthest from the second patterned conductive layer to a side of the first supplemental insulating layer farthest from the first patterned conductive layer such that the via openings extend through at least some of the conductive layer openings of the first patterned conductive layer and the second patterned conductive layer;
filling the set of via openings with a conductive material to provide a set of conductive vias;
providing a first supplemental patterned conductive layer onto the first supplemental insulating layer and a second supplemental patterned conductive layer onto the second supplemental insulating layer, the set of conductive vias contacting the first supplemental patterned conductive layer at one side thereof, and the second supplemental patterned conductive layer at another side thereof.
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Accused Products
Abstract
A method of fabricating a substrate core structure comprises, providing first and second patterned conductive layers defining openings therein on each side of a starting insulating layer; providing a first and a second supplemental insulating layers onto respective ones of a first and a second patterned conductive layer; laser drilling a set of via openings extending through at least some of the conductive layer openings of the first and second patterned conductive layers; filling the set of via openings with a conductive material to provide a set of conductive vias; and providing a first and a second supplemental patterned conductive layer onto respective ones of the first and the second supplemental insulating layers, the set of conductive vias contacting the first supplemental patterned conductive layer at one side thereof and the second supplemental patterned conductive layer at another side thereof.
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Citations
30 Claims
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1. A method of fabricating a substrate core structure comprising:
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providing a starting insulating layer; providing a first patterned conductive layer on one side of the starting insulating layer, and a second patterned conductive layer on another side of the starting insulating layer each of the first patterned conductive layer and the second patterned conductive layer defining conductive layer openings therein; providing a supplemental insulating layer onto the first patterned conductive layer, and a second supplemental insulating layer onto the second patterned conductive layer; laser drilling a set of via openings extending from a side of the second supplemental insulating layer farthest from the second patterned conductive layer to a side of the first supplemental insulating layer farthest from the first patterned conductive layer such that the via openings extend through at least some of the conductive layer openings of the first patterned conductive layer and the second patterned conductive layer; filling the set of via openings with a conductive material to provide a set of conductive vias; providing a first supplemental patterned conductive layer onto the first supplemental insulating layer and a second supplemental patterned conductive layer onto the second supplemental insulating layer, the set of conductive vias contacting the first supplemental patterned conductive layer at one side thereof, and the second supplemental patterned conductive layer at another side thereof. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 29, 30)
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14. A multilayer substrate core structure including:
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a starting insulating layer; a first patterned conductive layer on one side of the starting insulating layer, and a second patterned conductive layer on another side of the starting insulating layer; a first supplemental insulating layer on the first patterned conductive layer; a second supplemental insulating layer on the second patterned conductive layer; a first supplemental patterned conductive layer on the first supplemental insulating layer; a second supplemental patterned conductive layer on the second supplemental insulating layer; a set of conductive vias provided in corresponding laser-drilled via openings extending from the second supplemental patterned conductive layer to the first supplemental patterned conductive layer, the via openings further extending through the first patterned conductive layer and the second patterned conductive layer. - View Dependent Claims (15, 16, 17, 18, 19)
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20. A system comprising:
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an electronic assembly including; a multilayer substrate core structure including; a starting insulating layer; a first patterned conductive layer on one side of the starting insulating layer, and a second patterned conductive layer on another side of the starting insulating layer; a first supplemental insulating layer on the first patterned conductive layer; a second supplemental insulating layer on the second patterned conductive layer; a first supplemental patterned conductive layer on the first supplemental insulating layer; a second supplemental patterned conductive layer on the second supplemental insulating layer; a set of conductive vias provided in corresponding laser-drilled via openings extending from the second supplemental patterned conductive layer to the first supplemental patterned conductive layer, the via openings further extending through the first patterned conductive layer and the second patterned conductive layer; and a main memory coupled to the electronic assembly. - View Dependent Claims (21, 22, 23, 24, 25)
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26. A method of fabricating a substrate core structure comprising:
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providing a starting insulating layer; providing a patterned conductive layer on one side of the starting insulating layer, the first patterned conductive layer defining conductive layer openings therein; providing a supplemental insulating layer onto the first patterned conductive layer, laser drilling a set of via openings extending from a side of the supplemental insulating layer farthest from the patterned conductive layer to a side of the starting insulating layer farthest from the patterned conductive layer such that the via openings extend through at least some of the conductive layer openings of the patterned conductive layer; filling the set of via openings with a conductive material to provide a set of conductive vias, - View Dependent Claims (27, 28)
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Specification