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Method of Forming a Substrate Core Structure Using Microvia Laser Drilling and Conductive Layer Pre-Patterning And Substrate Core Structure Formed According to the Method

  • US 20090002958A1
  • Filed: 06/28/2007
  • Published: 01/01/2009
  • Est. Priority Date: 06/28/2007
  • Status: Active Grant
First Claim
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1. A method of fabricating a substrate core structure comprising:

  • providing a starting insulating layer;

    providing a first patterned conductive layer on one side of the starting insulating layer, and a second patterned conductive layer on another side of the starting insulating layer each of the first patterned conductive layer and the second patterned conductive layer defining conductive layer openings therein;

    providing a supplemental insulating layer onto the first patterned conductive layer, and a second supplemental insulating layer onto the second patterned conductive layer;

    laser drilling a set of via openings extending from a side of the second supplemental insulating layer farthest from the second patterned conductive layer to a side of the first supplemental insulating layer farthest from the first patterned conductive layer such that the via openings extend through at least some of the conductive layer openings of the first patterned conductive layer and the second patterned conductive layer;

    filling the set of via openings with a conductive material to provide a set of conductive vias;

    providing a first supplemental patterned conductive layer onto the first supplemental insulating layer and a second supplemental patterned conductive layer onto the second supplemental insulating layer, the set of conductive vias contacting the first supplemental patterned conductive layer at one side thereof, and the second supplemental patterned conductive layer at another side thereof.

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