Systems and methods for curing a deposited layer on a substrate

• US 20090004368A1
• Filed: 06/29/2007
• Published: 01/01/2009
• Est. Priority Date: 06/29/2007
• Status: Abandoned Application

• Current Assignee: Tap Development LLC (Intellectual Ventures LLC)
• Original Assignee: Weyerhaeuser Company (Weyerhauser)
• Inventors: Lee, David L., Hirahara, Edwin
• Application Number:
  US11/771,722
• Publication Number:
  US 20090004368A1
• Time in Patent Office: Days
• US Class Current: 427/98.400
• CPC Class Codes: B05D 3/06 by exposure to radiation B05D3/02 takes precedence ; plasma treatment B05D3/141
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 26/03 Observing, e.g. monitoring, the workpiece
• CPC Class Codes: B23K 26/0622 by shaping pulses
• CPC Class Codes: B23K 26/082 Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 2203/107 Using laser light
• CPC Class Codes: H05K 3/0008 for aligning or positioning of tools relative to the circuit board H05K3/4638, H05K3/4679 take precedence; for manufacturing assemblages of components H05K13/0015
• CPC Class Codes: H05K 3/1283 After-treatment of the printed patterns, e.g. sintering or curing methods
• CPC Class Codes: H05K 3/22 Secondary treatment of printed circuits H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107
• CPC Class Codes: H10K 71/421 using coherent electromagnetic radiation, e.g. laser annealing

Abstract

Curing systems are provided that include a planar support surface for supporting a substrate having at least one layer deposited thereon, at least one curing device for curing the at least one deposited layer, and a control system for controlling the overall curing process. The curing device includes at least one laser, a lens module, and an optional modulator. During curing, the beam of light emitted from the laser may be directed onto the deposited layer by 1) controlling the position of an X-Y beam deflecting module to direct the focused beam of laser light onto a desired illumination area of the deposited layer; 2) controlling the position of the laser via an X-Y table, or 3) controlling the position of the substrate via an X-Y table.

Claims

1. A curing system, comprising:

a support having a planar surface for supporting a substrate having a material deposited thereon;

a curing device comprising a laser capable of emitting a beam of light onto at least a portion of the deposited layer of material; and

a control system connected in electrical communication with the curing device.

2. The system of claim 1, wherein the support and/or the curing device is movable in an XY plane.

3. The system of claim 1, further including an X-Y beam deflector connected in electrical communication with the control system, the X-Y beam deflector capable of deflecting the beam of light with respect to the support.

4. The system of claim 3, further comprising a motion device associated with the support, the motion device capable of moving the support in the XY plane, wherein the relative motion between the beam of light and the support is accomplished by a combination of the X-Y beam deflector and motion of the support planar surface.

5. The system of claim 1, wherein the curing device includes two or more lasers emitting beams of light substantially parallel and having approximately the same optical path.

6. The system of claim 1, wherein two or more beams of light are formed from the beam of light emitted from the laser for producing two or more illuminating area on the deposited layer.

7. The system of claim 1, wherein the beam of light emitted by the laser has a wavelength and intensity, the wavelength and intensity of the beam of light being chosen so that the beam of light induces a chemical reaction in the deposited material.

8. The system of claim 1, wherein the deposited layer includes one or more chemical additives and wherein the beam of light emitted by the laser has a wavelength and intensity, the wavelength and intensity of the beam of light being chosen so that the beam of light induces chemical reactions with respect to the chemical additives.

9. The system of claim 1, wherein the beam of light is applied in two or more pulses of controllable length and/or intensity to enhance curing speed and/or quality.

10. The system of claim 1, further comprising at least one optical sensor for viewing the deposited layer during curing to accomplish one or more of the following:

1) identifying a circuit type;

     2) identifying the layer material; and

/or

     3) providing feedback to the control system in order to improve curing performance and/or quality.

11. The system of claim 1, wherein the curing device further includes a lens module that adjusts the focus of the beam of light emitted from the laser and/or a modulator that modulates the intensity of the beam of light emitted from the laser.

12. The system of claim 1, wherein the deposited layer of material is a printed layer of a printed electronics.

13. In a process of fabricating a printed electronics comprising a plurality of layers deposited onto a substrate, a method of curing at least one deposited layer comprising the steps of:

emitting a beam of light from a laser and illuminating a deposited layer with the emitted beam of light; and

moving the beam of light onto selected portions of the deposited layer.

14. The method of claim 13, wherein moving the beam of light includes one of the following steps:

1) moving the substrate with respect to the laser;

     2) moving the laser with respect to the substrate; and

     3) deflecting the beam of light.

15. The method of claim 13, further comprising the step of focusing and/or defocusing the beam of light emitted from the laser for illuminating the selected portions of the deposited layer.

16. The method of claim 13, further comprising the step of modulating the intensity of the beam of light.

17. The method of claim 13, wherein the selected portions of the deposited layer are subjected to different levels of curing.

18. A method of fabricating a printed electronics, comprising the steps of:

(a) supporting a substrate with a support having a planar surface;

(b) depositing via a printing device one of more materials onto the substrate in selected patterns, thereby forming a plurality of printed layers; and

(c) laser curing at least a portion of each printed layer.