HEAT RESISTANT RESIN BONDED GRINDSTONE

• US 20090005488A1
• Filed: 10/12/2007
• Published: 01/01/2009
• Est. Priority Date: 08/30/2002
• Status: Abandoned Application

• Current Assignee: Shin-Nissan Diamond Tools Mfg. Co., Ltd., UBE Industries Limited
• Original Assignee: Shin-Nissan Diamond Tools Mfg. Co., Ltd., UBE Industries Limited
• Inventors: Tsumiyama, Tatsuo, Satow, Yoshiyuki
• Application Number:
  US11/871,654
• Publication Number:
  US 20090005488A1
• Time in Patent Office: Days
• US Class Current: 524/435
• CPC Class Codes: C08K 3/04 Carbon
• CPC Class Codes: C08K 3/08 Metals
• CPC Class Codes: C08L 79/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Abstract

A heat resistant resin bonded grindstone is prepared by heating under pressure a molded composition comprising 20 to 50 vol. % of a polyimide resin powder, 50 to 70 vol. % of a metal powder, and 10 to 30 vol. % of a diamond powder, so that the diamond powder can be dispersed in and supported by a binder phase comprising the polyimide resin powder and the metal powder, in which the polyimide resin powder has been produced from a diamine compound comprising p-phenylenediamine and a mixture of 85 to 97 mol. % of 3,3′,4,4′-biphenyltetracarboxylic acid or its dianhydride and 15 to 3 mol. % of 2,3,3′,4′-biphenyltetracarboxylic acid or its dianhydride.

Claims

1. A method for manufacturing a heat resistant resin bonded grindstone, which comprises heating a molded composition comprising 20 to 50 vol. % of a polyimide resin powder, 50 to 70 vol. % of a metal powder, and 10 to 30 vol. % of a diamond powder at a temperature of 500 to 530°

C. and under a pressure of 500 to 5,000 kg/cm², said polyimide resin powder having been produced from a diamine compound comprising p-phenylenediamine and a mixture of 85 to 97 mol. % of 3,3′

,4,4′

-biphenyltetracarboxylic dianhydride and 15 to 3 mol. % of 2,3,3′

,4-biphenyltetracarboxylic dianhydride and being composed of a core portion of a crystalline polyimide resin produced from 3,3′

,4,4′

-biphenyltetracarboxylic acid or dianhydride thereof and p-phenylenediaimine and a surface layer of an amorphous polyimide resin produced from 2,3,3′

,4′

-biphenyltetracarboxylic acid or dianhydride thereof and p-phenylenediamine.

2. The method of claim 1, wherein the metal powder is a powder of aluminum, copper, nickel, or an alloy comprising at least one of aluminum, copper and nickel.

3. The method of claim 1, wherein the metal powder is a powder of an alloy of copper and tin.

4. The method of claim 1, wherein the molded composition comprises 20 to 45 vol. % of the polyimide resin powder, 55 to 70 vol. % of a metal powder, and 10 to 30 vol. % of a diamond powder.