Power Semiconductor Devices with Shield and Gate Contacts and Methods of Manufacture
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Accused Products
Abstract
A semiconductor power device includes active trenches that define an active area and an edge area that is located outside of the active area. The active trenches include a lower shield poly, an upper gate poly, a first oxide layer and a second oxide layer wherein the first oxide layer separates the lower shield poly from the upper gate poly and the second oxide layer covers the upper gate poly. The lower shield poly, upper gate poly, first oxide layer and second oxide layer conform to the shape of the active trench and extend from the active trench to a surface of the edge area. The edge area includes a first opening that extends through the first oxide layer to the lower shield poly and a second opening that extends through the second oxide layer to the upper gate poly. The first opening is filled with a conductive material that makes electrical contact with the lower shield poly and the second opening is filled with conductive material that makes electrical contact with the upper gate poly. The lower shield poly is electrically insulated from the substrate. The second oxide layer can be directly over the upper gate poly, the upper gate poly can be directly over the first oxide layer, the first oxide layer can be directly over the lower shield poly, and the first opening can be lower than the second opening. The device can further include a perimeter trench with extensions in the longitudinal direction that are staggered with respect to the active trenches so that there can be offset between the extensions of the perimeter trench and the active trenches.
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Citations
256 Claims
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1-235. -235. (canceled)
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236. A semiconductor device comprising:
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a plurality of active trenches that define an active area; an edge area that is located outside of the active area; the plurality of active trenches comprising a lower shield poly, an upper gate poly, a first oxide layer and a second oxide layer wherein the first oxide layer separates the lower shield poly from the upper gate poly and the second oxide layer covers the upper gate poly; wherein the lower shield poly, upper gate poly, first oxide layer and second oxide layer conform to the shape of the active trench and extend from the active trench to a surface of the edge area; wherein, the edge area comprises a first opening that extends through the first oxide layer to the lower shield poly and a second opening that extends through the second oxide layer to the upper gate poly; the first opening is filled with a conductive material that makes electrical contact with the lower shield poly and the second opening is filled with conductive material that makes electrical contact with the upper gate poly; and wherein the lower shield poly is electrically insulated from the substrate. - View Dependent Claims (237, 238, 239, 240, 241, 242)
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243. A semiconductor device comprising:
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a plurality of active trenches that define an active area; an edge area that is located outside of the active area; the plurality of active trenches comprising a lower shield poly, an upper gate poly, a first oxide layer and a second oxide layer wherein the first oxide layer separates the lower shield poly from the upper gate poly and the second oxide layer covers the upper gate poly; wherein the lower shield poly, upper gate poly, first oxide layer and second oxide layer conform to the shape of the active trench and extend from the active trench to a surface of the edge area; wherein, the edge area comprises a first opening that extends through the first oxide layer to the lower shield poly and a second opening that extends through the second oxide layer to the upper gate poly; the first opening is filled with a conductive material that makes electrical contact with the lower shield poly and the second opening is filled with conductive material that makes electrical contact with the upper gate poly; wherein the lower shield poly is electrically insulated from the substrate; wherein the second oxide layer is directly over the upper gate poly, the upper gate poly is directly over the first oxide layer, and the first oxide layer is directly over the lower shield poly; and wherein the first opening is lower than the second opening. - View Dependent Claims (244, 245, 246, 247)
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248. A method of manufacturing a semiconductor device comprising:
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forming an epitaxial layer over a substrate; forming a dielectric layer over the epitaxial layer and patterning the dielectric layer; etching the patterned dielectric layer to form an active trench in the portions of the dielectric layer that have been patterned to not have dielectric layer; forming a first oxide layer across a top surface of the substrate including the active trench; forming a first conductive layer on top of the first oxide layer; etching the first conductive layer away inside the active trench forming a second oxide layer over the first conductive layer; forming a second conductive layer on top of the second oxide layer, wherein the second conductive layer does not extend completely over the first conductive layer in a first region outside of the active trench; forming a third oxide layer over the second conductive layer; etching a first opening through the third oxide layer to expose the second conductive layer outside of the active trench; etching a second opening through the second oxide layer outside of the active trench in the first region to expose the first conductive layer but not the second conductive layer; and filling the first opening and the second opening with a conductive material. - View Dependent Claims (249, 250, 251, 252, 253, 254, 255, 256)
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Specification