Fuse element and manufacturing method thereof

• US 20090009281A1
• Filed: 07/06/2007
• Published: 01/08/2009
• Est. Priority Date: 07/06/2007
• Status: Abandoned Application

• Current Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Original Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Inventors: Wang, Chung-Hsiung, Qiu, Jian-Da, Song, Yu-Liang, Liu, Meng, Song, Qing-Feng, Li, Yu-Qiao
• Application Number:
  US11/825,488
• Publication Number:
  US 20090009281A1
• Time in Patent Office: Days
• US Class Current: 337/297
• CPC Class Codes: H01H 2085/0414 Surface mounted fuses
• CPC Class Codes: H01H 69/022 of printed circuit fuses
• CPC Class Codes: H01H 85/006 Heat reflective or insulating layer on the casing or on the fuse support
• CPC Class Codes: H01H 85/0418 with ferrule type end contacts
• CPC Class Codes: H01H 85/046 Fuses formed as printed circuits
• CPC Class Codes: H01H 85/11 with applied local area of a metal which, on melting, forms a eutectic with the main material of the fusible member, i.e. M-effect devices

Abstract

A fuse element comprises a substrate having a top surface, a bottom surface opposite to said top surface, and side surfaces, a heat insulation layer including a first surface and a second surface opposite to said first surface, said first surface of said heat insulation layer disposed on said top surface of said substrate, and said second surface having a surface roughness, a protective layer disposed above said heat insulation layer, and a fuse layer disposed between said heat insulation layer and said protective layer.

Claims

1. A fuse element, comprising:

a substrate having a top surface, a bottom surface opposite to said top surface, and side surfaces;

a heat insulation layer including a first surface and a second surface opposite to said first surface, said first surface of said heat insulation layer disposed on said top surface of said substrate, and said second surface having a surface roughness;

a protective layer disposed above said heat insulation layer; and

a fuse layer disposed between said heat insulation layer and said protective layer.

2. The fuse element of claim 1, wherein said heat insulation layer comprises resin having a high glass transition temperature above 150°

C.

3. The fuse element of claim 1, wherein said heat insulation layer comprises resin having a thermal conductivity of between 1.0 W/m°

K. and 0.1 W/m°

K.

4. The fuse element of claim 1, wherein material of said substrate is an aluminum oxide.

5. The fuse element of claim 1, wherein said fuse layer comprise of copper or copper-tin alloy for conducting a current therethrough.

6. The fuse element of claim 1, further comprising a pair of copper terminal disposed at two opposite ends of said second surface of said heat insulation layer, and said fuse layer disposed between said copper terminal and said protective layer.

7. The fuse element of claim 6, further comprising a first seed layer composed of Ni or NiCr disposed on said copper terminals and said second surface of said heat insulation layer, and said fuse layer disposed on said first seed layer.

8. The fuse element of claim 1, further comprising a buffer layer composed of Au/Pd, Au/Pt or Au/Co disposed on said fuse layer and an acceleration layer composed of Sn disposed on said buffer layer.

9. The fuse element of claim 1, wherein said protective layer comprises a Polymer.

10. The fuse element of claim 1, wherein said protective layer comprises a first protective layer and a second protective layer composed of polyimide, and said first protective layer is disposed between said fuse layer and said second protective layer.

11. The fuse element of claim 1, further comprising a bottom terminal layer composed of NiCr/NiCu and disposed on said bottom surface of said substrate, and side terminal layers composed of Cu/Ni/Sn wrapping around said side surfaces of said substrate.

12. The fuse element of claim 11, further comprising:

a seed layer composed of NiCr/NiCu wrapping around said side surfaces of said substrate and disposed between said side terminal layers and said side surfaces of said substrate.

13. A method for manufacturing a fuse element comprising the steps of:

forming a resin layer to a substrate;

roughening a second surface of said resin layer;

forming a fuse layer onto said second surface of said resin layer; and

forming a protective layer over said fuse layer.

14. The method of claim 13, wherein said step of roughening a second surface of said resin layer comprises:

roughening a bottom surface of a copper foil;

laminating a top surface of a substrate to said bottom surface of said copper foil through said resin layer; and

etching out of a central portion of said copper foil to expose said second surface of said resin layer.