INTEGRATED CIRCUIT WITH BONDING WIRE ANTENNA STRUCTURE AND METHODS FOR USE THEREWITH

• US 20090009408A1
• Filed: 09/15/2008
• Published: 01/08/2009
• Est. Priority Date: 06/21/2006
• Status: Abandoned Application

• Current Assignee: Broadcom Corporation (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza (Reza)
• Application Number:
  US12/210,616
• Publication Number:
  US 20090009408A1
• Time in Patent Office: Days
• US Class Current: 343/702
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/023 Redistribution layers [RDL] for bonding areas
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/06 of a plurality of bonding areas
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0001 Technical content checked by a classifier
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01031 : Gallium [Ga]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01061 : Promethium [Pm]
• CPC Class Codes: H01L 2924/01083 : Bismuth [Bi]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19104 : on the semiconductor or solid-state device, i.e. passive-on-chip
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/30111 : matching
• CPC Class Codes: H01Q 1/2225 : used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/2283 : mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 23/00 : Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 9/065 : Microstrip dipole antennas patch antenna H01Q9/0407

Abstract

An integrated circuit includes an integrated circuit die having a millimeter wave transceiver for communicating with a remote device via millimeter wave RF signaling. An antenna section facilitates the RF signaling, wherein the antenna section includes at least one bonding wire. A substrate is coupled to support the first integrated circuit die.

Claims

1. An integrated circuit comprising:

an integrated circuit die including;

a millimeter wave transceiver for communicating with a remote device via millimeter wave RF signaling;

an antenna section, coupled to the millimeter wave transceiver, for facilitating the RF signaling, wherein the antenna section includes at least one bonding wire;

a substrate coupled to support the first integrated circuit die.

2. The integrated circuit of claim 1 wherein the millimeter wave transceiver includes a millimeter wave receiver for receiving a first millimeter wave RF signal from the remote device and a millimeter wave transmitter for transmitting a second millimeter wave signal to the remote device.

3. The integrated circuit of claim 1 wherein the at least one bonding wire includes:

a first bonding wire that couples first signals between the integrated circuit die and the substrate.

4. The integrated circuit of claim 3 wherein the first bonding wire has a length that is substantially one-quarter of the wavelength of the millimeter wave RF signaling.

5. The integrated circuit of claim 3 wherein the first bonding wire has a length that is substantially one-half of the wavelength of the millimeter wave RF signaling.

6. The integrated circuit of claim 3 wherein the at least one bonding wire further includes:

a second bonding wire that couples second signals between the circuit and the substrate.

7. The integrated circuit of claim 1 further comprising:

an impedance matching circuit, coupled to the millimeter wave transceiver and the at least one bonding wire that provides impedance matching to the millimeter wave transceiver and the antenna section.

8. The integrated circuit of claim 1 wherein the at least one bonding wire forms an element of at least one of:

a helical antenna, a monopole antenna, and a dipole antenna.

9. The integrated circuit of claim 1 wherein the at least one bonding wire forms an element of an antenna array.

10. The integrated circuit of claim 1 wherein the at least one bonding wire forms an element of a phased array antenna.

11. An integrated circuit comprising:

an integrated circuit die including;

a millimeter wave transceiver for communicating with a remote device via millimeter wave RF signaling, wherein the millimeter wave transceiver includes a millimeter wave receiver for receiving a first millimeter wave RF signal from the remote device and a millimeter wave transmitter for transmitting a second millimeter wave signal to the remote device;

an antenna section for facilitating the RF signaling, wherein the antenna section includes at least one bonding wire;

an impedance matching circuit, coupled to the millimeter wave transceiver and the at least one bonding wire, that provides impedance matching to the millimeter wave transceiver and the antenna section.

a substrate coupled to support the first integrated circuit die.

12. The integrated circuit of claim 11 wherein the at least one bonding wire includes:

a first bonding wire that couples first signals between the integrated circuit die and the substrate.

13. The integrated circuit of claim 12 wherein the first bonding wire has a length that is substantially one-quarter of the wavelength of the millimeter wave RF signaling.

14. The integrated circuit of claim 12 wherein the first bonding wire has a length that is substantially one-half of the wavelength of the millimeter wave RF signaling.

15. The integrated circuit of claim 12 wherein the at least one bonding wire further includes:

a second bonding wire that couples second signals between the circuit and the substrate.

16. The integrated circuit of claim 11 wherein the at least one bonding wire forms an element of at least one of:

a helical antenna, a monopole antenna, and a dipole antenna.

17. The integrated circuit of claim 11 wherein the at least one bonding wire forms an element of an antenna array.

18. The integrated circuit of claim 11 wherein the at least one bonding wire forms an element of a phased array antenna.

19. A method for use in an integrated circuit, the method comprising:

communicating with a remote device via millimeter wave RF signaling via an antenna that includes an antenna element formed by a bonding wire of the integrated circuit.