LED lamp structure and system with high-efficiency heat-dissipating function

• US 20090009999A1
• Filed: 11/19/2007
• Published: 01/08/2009
• Est. Priority Date: 07/06/2007
• Status: Active Grant

• Current Assignee: Harvatek Corporation
• Original Assignee: Harvatek Corporation
• Inventors: Wang, Bily, Chuang, Jonnie, Wu, Shih-Yu
• Granted Patent: US 7,828,464 B2
• Time in Patent Office: Days
• US Class Current: 362/249.10
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/71 using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
• CPC Class Codes: F21V 29/773 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes

Abstract

An LED lamp structure with high-efficiency heat-dissipating function includes a heat-dissipating module, a light-emitting module, a power-transmitting module, and a casing module. The heat-dissipating module has a plurality of heat-dissipating fins, and the heat-dissipating fins are combined together to form a radial shape and a receiving space. The light-emitting module is received in the receiving space of the heat-dissipating module. The power-transmitting module is electrically connected with the light-emitting module. The casing module has a top board body, a bottom board body mated with the top board body, and a joint board body disposed between the top board body and the heat-dissipating fins. Both the top board body and the joint board body have an opening for exposing the light-emitting module. Each heat-dissipating fin has a top side contacted with the joint board body and a bottom side separated from the bottom board body by a predetermined distance.

Claims

1. An LED lamp structure with high-efficiency heat-dissipating function, comprising:

a heat-dissipating module having a plurality of heat-dissipating fins, wherein the heat-dissipating fins are combined together to form a radial shape and a receiving space;

a light-emitting module received in the receiving space of the heat-dissipating module;

a power-transmitting module electrically connected with the light-emitting module.

2. The LED lamp structure as claimed in claim 1, wherein the heat-dissipating fins are stacked with each other.

3. The LED lamp structure as claimed in claim 1, further comprising a casing module, wherein the casing module has a top board body, a bottom board body mated with the top board body, and a joint board body disposed between the top board body and the heat-dissipating fins, and both the top board body and the joint board body have an opening for exposing the light-emitting module.

4. The LED lamp structure as claimed in claim 3, wherein each heat-dissipating fin has a top side and a bottom side respectively contacted with the joint board body and the bottom board body.

5. The LED lamp structure as claimed in claim 3, wherein each heat-dissipating fin has a top side contacted with the joint board body and a bottom side separated from the bottom board body by a predetermined distance.

6. The LED lamp structure as claimed in claim 1, wherein the light-emitting module includes a substrate with a positive conductive track and a negative conductive track, two inner conductive pins, at least one light-emitting element electrically connected with the positive conductive track and the negative conductive track via the two inner conductive pins, a fluorescent colloid covered on the at least one light-emitting element, and a light-shielding frame body for covering a peripheral face of the fluorescent colloid and only exposing a top surface of the fluorescent colloid.

7. The LED lamp structure as claimed in claim 6, wherein the power-transmitting module has two leading wires electrically connected with the positive conductive track and the negative conductive track of the substrate, respectively.

8. The LED lamp structure as claimed in claim 1, further comprising a heat-dissipating substrate disposed among the heat-dissipating fins.

9. The LED lamp structure as claimed in claim 8, wherein the heat-dissipating substrate is hollow.

10. The LED lamp structure as claimed in claim 8, wherein the heat-dissipating substrate is solid.

11. The LED lamp structure as claimed in claim 8, wherein the heat-dissipating substrate is cylindrical-shaped.

12. The LED lamp structure as claimed in claim 1, wherein each heat-dissipating fin has a stacked portion and a fined portion extended forward and upward from a lateral side of the stacked portion.

13. The LED lamp structure as claimed in claim 12, wherein the light-emitting module is disposed on the stacked portions of the heat-dissipating fins.

14. The LED lamp structure as claimed in claim 12, wherein the stacked portions are stacked with each other to make the heat-dissipating fins stacked with each other and combined together.

15. The LED lamp structure as claimed in claim 12, wherein the power-transmitting module has two leading wires, and each leading wire passes through a through hole between any two stacked portions.

16. The LED lamp structure as claimed in claim 12, further comprising a heat-dissipating substrate received in the receiving space and disposed on top surfaces of the stacked portions, wherein the heat-dissipating substrate has a peripheral face abutting against inner lateral sides of the fined portions.

17. The LED lamp structure as claimed in claim 16, wherein the light-emitting module is disposed on the heat-dissipating substrate.

18. The LED lamp structure as claimed in claim 16, wherein the power-transmitting module has two leading wires, and each leading wire passes through a gap between any two fined portions.

19. The LED lamp structure as claimed in claim 1, wherein each heat-dissipating fin has a stacked portion and a fined portion extended forward, upward and downward from a lateral side of the stacked portion.

20. The LED lamp structure as claimed in claim 19, further comprising a heat-dissipating substrate abutting against bottom surfaces of the stacked portions and inner lateral sides of the fined portions.

21. The LED lamp structure as claimed in claim 19, wherein the light-emitting module is disposed on the stacked portions.

22. The LED lamp structure as claimed in claim 19, wherein the stacked portions are stacked with each other to make the heat-dissipating fins stacked with each other and combined together.

23. The LED lamp structure as claimed in claim 19, wherein the power-transmitting module has two leading wires, and each leading wire passes through a gap between any two fined portions.

24. The LED lamp structure as claimed in claim 1, wherein each heat-dissipating fin has a fixed portion and a fined portion extended upward from the fixed portion.

25. The LED lamp structure as claimed in claim 24, further comprising a heat-dissipating substrate abutting against inner lateral sides of the fixed portions.

26. The LED lamp structure as claimed in claim 25, wherein the light-emitting module is disposed on the heat-dissipating substrate.

27. The LED lamp structure as claimed in claim 25, wherein the fixed portions are surroundingly fixed on a peripheral face of the heat-dissipating substrate.

28. The LED lamp structure as claimed in claim 24, wherein the power-transmitting module has two leading wires, and each leading wire passes through a gap between any two fixed portions.

29. The LED lamp structure as claimed in claim 1, wherein each heat-dissipating fin has an embedded portion and a fined portion extended forward, upward and downward from a lateral side of the embedded portion.

30. The LED lamp structure as claimed in claim 29, further comprising a heat-dissipating substrate, wherein the heat-dissipating substrate has a plurality of concave grooves formed on a peripheral face thereof and corresponding to the embedded portions, and each embedded portion of each heat-dissipating fin is embedded into the concave groove in order to make the peripheral face of the heat-dissipating substrate abut against inner lateral sides of the fined portions.

31. The LED lamp structure as claimed in claim 30, wherein the light-emitting module is disposed on the heat-dissipating substrate.

32. The LED lamp structure as claimed in claim 29, wherein the power-transmitting module has two leading wires, and each leading wire passes through a gap between any two fined portions.

33. An LED lamp system with high-efficiency heat-dissipating function, comprising:

a plurality of LED lamp structures, wherein each LED lamp structure comprises;

a heat-dissipating module having a plurality of heat-dissipating fins, wherein the heat-dissipating fins are combined together to form a radial shape and a receiving space;

a light-emitting module received in the receiving space of the heat-dissipating module; and

a power-transmitting module electrically connected with the light-emitting module; and

a power supply plug electrically connected with the power-transmitting module of each LED lamp structure.

34. The LED lamp system as claimed in claim 33, wherein each power-transmitting module has a positive leading wire and a negative leading wire electrically connected with a positive side and a negative side of the power supply plug, respectively.

35. The LED lamp system as claimed in claim 33, further comprising a casing module, wherein the casing module has a top board body, a bottom board body mated with the top board body, and a joint board body disposed between the top board body and the heat-dissipating fins, and both the top board body and the joint board body have an opening for exposing the light-emitting modules.

36. The LED lamp system as claimed in claim 35, further comprising a plurality of fins disposed between the top board body and the bottom board body, wherein the fins are combined together to surround the LED lamp structures.

37. The LED lamp system as claimed in claim 33, wherein each heat-dissipating fin of each heat-dissipating module has a stacked portion and a fined portion extended forward and upward from a lateral side of the stacked portion.

38. The LED lamp system as claimed in claim 37, wherein each light-emitting module is correspondingly disposed on the stacked portions of the heat-dissipating fins of each heat-dissipating module.

39. The LED lamp system as claimed in claim 37, wherein each LED lamp structure further comprises a heat-dissipating substrate received in the corresponding receiving space and disposed on top surfaces of the corresponding stacked portions, and the heat-dissipating substrate has a peripheral face abutting against inner lateral sides of the corresponding fined portions.

40. The LED lamp system as claimed in claim 39, wherein the light-emitting modules are respectively disposed on the corresponding heat-dissipating substrates.

41. The LED lamp system as claimed in claim 33, wherein each heat-dissipating fin of each heat-dissipating module has a stacked portion and a fined portion extended forward, upward and downward from a lateral side of the stacked portion.

42. The LED lamp system as claimed in claim 41, wherein each LED lamp structure further comprises a heat-dissipating substrate abutting against bottom surfaces of the corresponding stacked portions and inner lateral sides of the corresponding fined portions.

43. The LED lamp system as claimed in claim 41, wherein each light-emitting module is disposed on the stacked portions of each corresponding heat-dissipating module.

44. The LED lamp system as claimed in claim 33, wherein each heat-dissipating fin of each heat-dissipating module has a fixed portion and a fined portion extended upward from the fixed portion.

45. The LED lamp system as claimed in claim 44, wherein each LED lamp structure further comprises a heat-dissipating substrate abutting against inner lateral sides of the fixed portions of each corresponding heat-dissipating module.

46. The LED lamp system as claimed in claim 45, wherein the light-emitting modules are respectively disposed on the corresponding heat-dissipating substrates.

47. The LED lamp system as claimed in claim 45, wherein the fixed portions of each heat-dissipating fin of each heat-dissipating module are surroundingly fixed on a peripheral face of each corresponding heat-dissipating substrate.

48. The LED lamp system as claimed in claim 33, wherein each heat-dissipating fin of each heat-dissipating module has an embedded portion and a fined portion extended forward, upward and downward from a lateral side of the embedded portion.

49. The LED lamp system as claimed in claim 48, wherein each LED lamp structure further comprises a heat-dissipating substrate, wherein the heat-dissipating substrate has a plurality of concave grooves formed on a peripheral face thereof and corresponding to the embedded portions, and each embedded portion of each heat-dissipating fin is embedded into the concave groove in order to make the peripheral face of the heat-dissipating substrate abut against inner lateral sides of the fined portions.

50. The LED lamp system as claimed in claim 49, wherein the light-emitting modules are disposed on the corresponding heat-dissipating substrates, respectively.