METHOD FOR PLACING AT LEAST ONE COMPONENT PROVIDED WITH CONNECTION POINTS ON A SUBSTRATE, AS WELL AS SUCH A DEVICE

• US 20090010528A1
• Filed: 07/02/2008
• Published: 01/08/2009
• Est. Priority Date: 07/03/2007
• Status: Active Grant

• Current Assignee: Assembleon B.V.
• Original Assignee: Assembleon B.V.
• Inventors: HOOGERS, Hubert Francijn Maria
• Granted Patent: US 8,306,313 B2
• Time in Patent Office: Days
• US Class Current: 382/151
• CPC Class Codes: H05K 13/0812 the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
• CPC Class Codes: H05K 13/0815 Controlling of component placement on the substrate during or after manufacturing

Abstract

A method for placing at least one component provided with connection points on a substrate. First, positions of the connection points are determined, after which the component is positioned at desired positions on the substrate with the connection points thereof. Upon placement of a number of components, the contour of a component as well as the positions of the connection points relative to said contour are determined for a first number of components. On the basis of the calculated positions of the connection points relative to the contours average positions of the connection points relative to the contour are calculated. Upon placement of a second number of components the contour of a component is determined, whereupon the expected positions of the connection points relative to the contour are calculated on the basis of said average positions.

Claims

1. A method for placing at least one component provided with connection points on a substrate, wherein positions of the connection points are first determined, after which the component is positioned at desired positions on the substrate with the connection points thereof, wherein upon placement of a number of components the contour of a component as well as the positions of the connection points relative to said contour are determined for a first number of components, on the basis of which calculated positions of the connection points relative to the contours average positions of the connection points relative to the contour are calculated, after which, upon placement of a second number of components, the contour of a component is determined, whereupon the expected positions of the connection points relative to the contour are calculated on the basis of said average positions.

2. A method according to claim 1, wherein an average deviation between the calculated positions and theoretically desired positions of the connection points relative to the contour is determined from the calculated positions of the connection points relative to the contours, whereupon the expected positions of the connection points relative to the contour are determined on the basis of said average deviation.

3. A method according to claim 1, wherein the component is picked up by a nozzle, which nozzle is provided with at least one sensor for determining the position of the contour of the component relative to the nozzle, whilst the nozzle is movable with respect to a camera for determining the positions of the connection points.

4. A method according to claim 3, wherein the connection points lie in a plane of the component, with the component being rotated with respect to the sensor about an axis of rotation extending transversely to said plane for determining the contour of the component.

5. A method according to claim 4, wherein said sensor comprises a line array sensor.

6. A method according to claim 3, wherein an image of the plane is made by the camera in a direction transversely to said plane for determining the positions of the connection points, from which image the positions are determined.

7. A method according to claim 6, wherein the camera comprises a CCD sensor.

8. A device suitable for carrying out the method according to claim 1, which device comprises at least one movable nozzle by which a component can be picked up, and at least one camera for determining the positions of connection points of the component, wherein the device further comprises at least one sensor for determining the position of a contour of the component relative to the nozzle, a mechanism configured to calculate the average positions of connection points relative to the contour and a mechanism to calculate from said average positions the expected positions of connection points of a similar component whose contour has been determined.

9. A device according to claim 8, wherein the nozzle is provided with the sensor for determining the position of the contour of the component relative to the nozzle.

10. A device according to claim 8, wherein the nozzle is rotatable about an axis of rotation, wherein the image field of the sensor extends parallel to the axis of rotation, whilst the image field of the camera extends transversely to the axis of rotation.

11. A device according to claim 8, wherein said sensor comprises a line array sensor.

12. A device according to claim 8, wherein said camera comprises a CCD sensor.