Resin Composition for Optical Packaging Material and Process for Preparing the Same, and Optical Packaging Material, Optical Packaging Component, and Optical Module

• US 20090010603A1
• Filed: 10/07/2005
• Published: 01/08/2009
• Est. Priority Date: 10/07/2004
• Status: Abandoned Application

• Current Assignee: Nippon Shokubai Company Limited
• Original Assignee: Nippon Shokubai Company Limited
• Inventors: Tsujino, Yasunori, Asako, Yoshinobu, Sugioka, Takuo, Tajiri, Kozo
• Application Number:
  US11/664,818
• Publication Number:
  US 20090010603A1
• Time in Patent Office: Days
• US Class Current: 385/123
• CPC Class Codes: C08K 3/22 of metals
• CPC Class Codes: G02B 2006/1215 Splitter
• CPC Class Codes: G02B 6/30 for use between fibre and thin-film device

Abstract

To provide to a resin composition for an optical packaging material having a coefficient of thermal expansion approximately same as that of quartz and Pyrex (registered trade name) and capable of providing an optical packaging material exhibiting excellent flame retardancy and an optical packaging component, and an optical module and its production method. A molded body, an optical packaging component and an optical module having a low coefficient of thermal expansion and excellent flame retardancy can be obtained using a resin composition for an optical packaging material comprising a resin and inorganic fine particles which are made of a hydrolyzed condensate compound of an alkoxide compound and/or a carboxylic acid salt compound and have an average radius of gyration of 50 nm or smaller.

Claims

1. A resin composition for an optical packaging material comprising a resin and an inorganic fine particle, wherein the inorganic fine particle is a hydrolyzed condensate of an alkoxide compound and/or a carboxylic acid salt compound and has an average inertia radius of 50 nm or smaller.

2. The resin composition for the optical packaging material according to claim 1, wherein the resin is a thermosetting resin or a photocurable resin.

3. The resin composition for the optical packaging material according to claim 1, wherein the resin composition further contains 2% (inclusive) to 95% (exclusive) by weight of an inorganic compound having an average particle size of 0.1 μ

m to 100 μ

m.

4. An optical packaging material obtained by curing the resin composition for the optical packaging material according to claim 1.

5. A molded body of the optical packaging material according to claim 4.

6. The molded body of the optical packaging material according to claim 5 having a coefficient of thermal expansion of 80 ppm or lower at a temperature of a glass transition temperature or lower.

8. An optical packaging component using the optical packaging material and/or the molded body of the optical packaging material according to claim 4.

9. The optical packaging component according to claim 8, comprising any one of an optical fiber array, a micro hole array, or an optical waveguide device.

10. An optical module comprising the optical packaging component according to claim 8.

12. An optical waveguide device comprising

an optical waveguide having a core and a clad covering the core, wherein at least one of the core and the clad is formed by curing the resin composition for the optical packaging material according to claim 1.

13. The resin composition for the optical packaging material according to claim 2, wherein the resin composition further contains 2% (inclusive) to 95% (exclusive) by weight of an inorganic compound having an average particle size of 0.1 μ

m to 100 μ

m.

14. An optical packaging material obtained by curing the resin composition for the optical packaging material according to claim 2.

15. An optical packaging material obtained by curing the resin composition for the optical packaging material according to claim 3.

16. An optical packaging component using the optical packaging material and/or the molded body of the optical packaging material according to claim 5.

17. An optical packaging component using the optical packaging material and/or the molded body of the optical packaging material according to claim 6.

19. An optical module comprising the optical packaging component according to claim 9.

20. An optical waveguide device comprising

an optical waveguide having a core and a clad covering the core, wherein at least one of the core and the clad is formed by curing the resin composition for the optical packaging material according to claim 2.

21. An optical waveguide device comprising

an optical waveguide having a core and a clad covering the core, wherein at least one of the core and the clad is formed by curing the resin composition for the optical packaging material according to claim 3.

7. A halogen-free resin molded body for an optical packaging material, having flame retardancy of V-1 or higher defined by UL-94 and a coefficient of thermal expansion of 80 ppm or lower at a temperature of a glass transition temperature or lower thereof.

18. An optical packaging component using the optical packaging material and/or the molded body of the optical packaging material according to claim 7.

11. A method for preparing a molded body of an optical packaging material comprising,

pressure molding a resin composition for an optical packaging material comprising a resin and an inorganic fine particle wherein the inorganic fine particle is a hydrolyzed condensate of an alkoxide compound and/or a carboxylic acid salt compound and has an average inertia radius of 50 nm or smaller.