DEFORMABLE PHYSIOLOGICAL SENSOR

• US 20090012380A1
• Filed: 06/27/2008
• Published: 01/08/2009
• Est. Priority Date: 06/27/2007
• Status: Active Grant

• Current Assignee: Covidien LP (Medtronic Plc)
• Original Assignee: Covidien LP (Medtronic Plc)
• Inventors: Scheuing, Rick, Gonopolskiy, Oleg
• Granted Patent: US 9,642,565 B2
• Time in Patent Office: Days
• US Class Current: 600/372
• CPC Class Codes: A61B 2562/085 combined with means for recording calibration data
• CPC Class Codes: A61B 2562/164 the sensor is mounted in or on a conformable substrate or carrier
• CPC Class Codes: A61B 5/0059 using light, e.g. diagnosis by transillumination, diascopy, fluorescence A61B5/0093, A61B5/1455, A61B5/02416 and A61B5/0261 take precedence
• CPC Class Codes: A61B 5/14552 Details of sensors specially adapted therefor
• CPC Class Codes: A61B 5/14553 specially adapted for cerebral tissue

Abstract

A sensor for measuring physiological characteristics is provided that includes a circuit assembly and a means of deforming the sensor to a desired shape of small radius compound curvature. In one embodiment, the sensor includes a deformable layer configured to conform and maintain a shape of a surface on which the sensor is applied.

Claims

1. A sensor for measuring physiological characteristics, comprising:

a circuit assembly; and

a means of deforming the sensor to a desired shape of small radius compound curvature.

2. The sensor of claim 1, wherein said circuit assembly is disposed between a top foam layer and a bottom foam layer.

3. The sensor of claim 1, wherein the sensor is configured to conform to and maintain a shape of a surface.

4. The sensor of claim 1, wherein said circuit assembly includes a plurality of optical components, wherein a center of said optical components are axially aligned to a horizontal plane of said circuit assembly.

5. The sensor of claim 1, wherein said circuit assembly is disposed between a top layer and a bottom layer such that said top layer and said bottom layer collectively equal the thickness of said plurality of optical components to minimize pressure points.

6. A sensor, comprising:

a circuit assembly; and

a deformable layer configured to conform and maintain a shape of a surface on which the sensor is applied.

7. The sensor of claim 6, wherein said surface has a small radius compound curvature.

8. The sensor of claim 6, wherein said deformable layer is aluminum.

9. The sensor of claim 6, wherein said circuit assembly is disposed between a top foam layer and a bottom foam layer.

10. The sensor of claim 6, wherein said circuit assembly includes a plurality of optical components, each having a center axially aligned to a horizontal plane of said circuit assembly.

11. The sensor of claim 6, wherein said circuit assembly is disposed between a top layer and a bottom layer such that said top layer and said bottom layer collectively equal the thickness of said plurality of optical components to minimize pressure points.

12. The sensor of claim 10, wherein said optical components include at least one light source configured to emit multiple wavelengths and at least one detector.

13. The sensor of claim 12, wherein said deformable layer is configured to reflect and intensify wavelengths of light.

14. The sensor of claim 6, wherein said deformable layer is a flexcircuit having a particular shape and sufficient metallization to conform and maintain a shape of a surface on which the sensor is applied.