LEAD WITH CONTACTS FORMED BY COILED CONDUCTOR AND METHODS OF MANUFACTURE AND USE

• US 20090012591A1
• Filed: 07/05/2007
• Published: 01/08/2009
• Est. Priority Date: 07/05/2007
• Status: Active Grant

• Current Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Original Assignee: Advanced Bionics Corporation (Sonova Holding AG)
• Inventors: Barker, John Michael
• Granted Patent: US 7,899,548 B2
• Time in Patent Office: Days
• US Class Current: 607/116
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0529 Electrodes for brain stimulation
• CPC Class Codes: A61N 1/0551 Spinal or peripheral nerve electrodes
• CPC Class Codes: Y10T 29/53204 Electrode

Abstract

A lead includes an elongated lead body of non-conductive material and a plurality of conductive wires. Each wire has a first portion disposed within the lead body and a second portion extending out of the lead body. The second portion is coiled around the lead body to form a contact on the outer surface of the lead.

Claims

1. A lead comprising:

an elongated lead body of non-conductive material, the lead body comprising a first end and a second end; and

a plurality of conductive wires, each wire comprising a first portion disposed within the lead body and a second portion extending out of the lead body, wherein the second portion is coiled around the lead body to form a contact on the outer surface of the lead.

2. The lead of claim 1, wherein the lead body comprises a plurality of indented regions near the first end, and wherein the second portions of the conductive wires are individually coiled around respective ones of the indented regions.

3. The lead of claim 2, wherein the respective contacts are isodiametric with respect to a non-indented region of the lead body adjacent to at least one of the indented regions.

4. The lead of claim 1, wherein the second portions of the conductive wires are adhesively bonded to the lead body.

5. The lead of claim 1, wherein the lead body defines a plurality of lumens, and wherein each conductive wire of the plurality of conductive wires is disposed within a one of the lumens.

6. The lead of claim 1, wherein at least one of the contacts is configured to be an electrode suitable to stimulate body tissue.

7. The lead of claim 1, wherein at least one of the contacts is configured to electrically couple the lead to a control module.

8. A stimulation system, comprising:

the lead of claim 1; and

a control module coupleable to the lead, wherein the control module is arranged to provide electrical signals to the contact.

9. The stimulation system of claim 8, wherein the lead and control module are implantable.

10. The stimulation system of claim 8, wherein the system is configured to provide spinal cord stimulation.

11. A method of producing a lead comprising:

disposing a conductive wire within, and along, an elongated lead body with a terminal portion of the wire extending through an opening at, or near, a first end of the lead body; and

coiling the terminal portion of the conductive wire around the lead body to form a contact.

12. The method of claim 11, further comprising forming an indented section on the lead body.

13. The method of claim 12, wherein forming an indented section on the lead body comprises applying compression to the lead body to form an indented section;

and forming the opening in the indented section.

14. The method of claim 13, wherein the lead body defines a lumen and forming an indented section on the lead body further comprises disposing a wire mandrel into the lumen prior to, and while, applying compression to the lead body.

15. The method of claim 13, wherein forming an indented section on the lead body further comprises heating a portion of the lead body with thermal energy.

16. The method of claim 13, wherein forming an indented section on the lead body further comprises heating a portion of the lead body with ultrasonic energy.

17. The method of claim 11, further comprising for each of a plurality of conductive wires, repeating the steps of disposing a conductive wire within, and along, an elongated lead body and coiling the terminal portion of the conductive wire around the lead body.

18. The method of claim 11, further comprising bonding the contact to the elongated body.

19. The method of claim 11, further comprising grinding the contact to form a smooth contact.

20. The method of claim 11, further comprising centerless grinding the contact to form a smooth contact.