INTEGRATED CIRCUIT SYSTEM WITH ANTENNA
First Claim
1. An integrated circuit system comprising:
- a substrate having an integrated circuit device;
a first pad on the substrate connected to the integrated circuit device;
a first dielectric layer over the substrate and the first pad, the first dielectric layer having an opening provided therein exposing the first pad;
an upper redistribution layer over the first dielectric layer;
an antenna comprising at least a portion of the upper redistribution layer, the antenna connected to the first pad; and
a second dielectric layer over the first dielectric layer and over the antenna.
2 Assignments
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Accused Products
Abstract
A system for manufacturing an integrated circuit system having a substrate with a integrated circuit device. A first pad is formed on the substrate and connected to the integrated circuit device. A first dielectric layer is formed over the substrate and the first pad, with the first dielectric layer having an opening provided therein exposing the first pad. An upper redistribution layer is formed over the first dielectric layer. A portion of the upper redistribution layer is formed into an antenna with the antenna connected to the first pad. A second dielectric layer is formed over the first dielectric layer and over the antenna.
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Citations
10 Claims
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1. An integrated circuit system comprising:
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a substrate having an integrated circuit device; a first pad on the substrate connected to the integrated circuit device; a first dielectric layer over the substrate and the first pad, the first dielectric layer having an opening provided therein exposing the first pad; an upper redistribution layer over the first dielectric layer; an antenna comprising at least a portion of the upper redistribution layer, the antenna connected to the first pad; and a second dielectric layer over the first dielectric layer and over the antenna. - View Dependent Claims (2, 3, 4, 5)
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6. An integrated circuit system comprising:
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a substrate having a radio frequency identification (RFID) integrated circuit device; a first pad on the substrate connected to the RFID integrated circuit device; a first dielectric layer over the substrate and the first pad, the first dielectric layer having an opening provided therein exposing the first pad; an upper redistribution layer over the first dielectric layer; an antenna comprising at least a portion of the upper redistribution layer into, the antenna connected to the first pad; and a second dielectric layer over the first dielectric layer and over the antenna. - View Dependent Claims (7, 8, 9, 10)
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Specification