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VERTICAL MOS TRANSISTOR AND METHOD THEREFOR

  • US 20090014784A1
  • Filed: 07/13/2007
  • Published: 01/15/2009
  • Est. Priority Date: 07/13/2007
  • Status: Active Grant
First Claim
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1. A vertical MOS transistor comprising:

  • a bulk semiconductor substrate of a first conductivity type having a drain conductor on a first surface and having a second surface that is opposite to the first surface;

    an epitaxial layer of the first conductivity type on the second surface of the bulk semiconductor substrate;

    a first doped region of a second conductivity type on the epitaxial layer, the first doped region having a first outside edge extending from near the surface of the epitaxial layer into the epitaxial layer;

    a thin insulator on a portion of the epitaxial layer, a first portion of the thin insulator overlying a portion of the first doped region and extending past the first outside edge of the first doped region to overly a portion of the epitaxial layer that is adjacent to the first outside edge of the first doped region;

    a trench type gate formed on the epitaxial layer and extending into the first doped region, the trench type gate having a first gate conductor within a trench of the trench type gate;

    a source formed as a second doped region of the first conductivity type on the epitaxial layer and within the first doped region, the source positioned adjacent to the trench type gate;

    a second gate conductor on the first portion of the thin insulator and overlying a portion of the first doped region that is between the trench type gate and the first outside edge of the first doped region wherein the second gate conductor does not extend to overlie a P-N junction formed at an interface of the epitaxial layer and the first outside edge of the first doped region and wherein the second gate conductor does not overly a thick field oxide region;

    an inter-layer dielectric formed on the first portion of the thin insulator and overlying a portion of the second gate conductor wherein the inter-layer dielectric has a thickness that is at least twice a thickness of the thin insulator, the inter-layer dielectric extending across the thin insulator past the first outside edge of the first doped region; and

    a metal gate conductor formed on a portion of the inter-layer dielectric and on a portion of the second gate conductor.

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