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ELECTRONIC DEVICE AND MANUFACTURING METHOD

  • US 20090014873A1
  • Filed: 04/21/2008
  • Published: 01/15/2009
  • Est. Priority Date: 07/13/2007
  • Status: Active Grant
First Claim
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1. An electronic device comprising:

  • a semiconductor device having a plurality of connecting terminals; and

    a mounting board facing the semiconductor device, and being connected to the connecting terminals;

    wherein thermally expandable particles are provided on at least one of a side of the semiconductor device and a surface of the mounting board around a projected area of the semiconductor device, the thermally expandable particles being covered with adhesive.

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