APPARATUS TO MONITOR SUBSTRATE VIABILITY

• US 20090015278A1
• Filed: 07/12/2007
• Published: 01/15/2009
• Est. Priority Date: 07/12/2007
• Status: Abandoned Application

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Dang, Hien, Sri-Jayantha, Sri
• Application Number:
  US11/776,996
• Publication Number:
  US 20090015278A1
• Time in Patent Office: Days
• US Class Current: 324/762.60
• CPC Class Codes: G01R 31/2853 Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections G01R31/31717 takes precedence; test of chip-to-PCB or lead-to-PCB connections G01R31/66
• CPC Class Codes: G01R 31/2884 using dedicated test connectors, test elements or test circuits on the IC under test G01R31/2855 takes precedence
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT
• CPC Class Codes: H05K 1/0268 for electrical inspection or testing
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 2203/163 Monitoring a manufacturing process

Abstract

An apparatus for detecting and reporting a condition is described. The apparatus is an electronic package comprising a substrate with electrically conducting lines electrically connected to an integrated chip, and to a source of voltage. The integrated circuit chip is mounted onto a substrate and electrically connected to at least one electrically conducting line. A sensor, combined with a signal generator, connected to the substrate, is operable to generate an electrical signal upon detection of a condition selected from a condition of the substrate and a condition of an electrical connection to the substrate. The signal generator, after immediately receiving the aforesaid electrical signal from the sensor, emits the warning signal. The warning signal of indicated of an existing defect or a condition which can lower the longevity of the total electronic package.

Claims

1. An apparatus for detecting and reporting a condition, said apparatus comprising:

a. a substrate comprising an electrically conducting line operable for electrically connecting to an integrated circuit chip, and to a source of voltage;

wherein said substrate is a chip carrier; and

wherein said integrated circuit chip (i) is mounted onto said chip carrier; and

(ii) is electrically connected to said electrically conducting line;

b. a sensor either disposed within or mounted onto said chip carrier, said sensor being operable to generate an electrical signal upon detection of a condition of said chip carrier; and

c. a signal generating device operable to receive said electrical signal and, upon receipt thereof, operable to emit a warning signal.

2. An apparatus as in claim 1, wherein said chip carrier is selected from the group consisting of:

a multi chip ceramic chip carrier, a single chip ceramic chip carrier, an organic multi chip carrier, an organic single chip carrier, and a silicon chip carrier package.

3. An apparatus as in claim 1, wherein said sensor is a strain gauge operable to detect strain conditions in said chip carrier.

4. An apparatus as in claim 1, wherein said condition of said chip carrier comprises an electrical discontinuity in said electrically conducting line.

6. An apparatus as in claim 1, wherein said chip carrier comprises a plurality of electrical conducting lines wherein said sensor is operable to detect electrical shorting between electrically conducting lines.

7. An apparatus as in claim 1, wherein said sensor is operable to detect a thermal condition of said chip carrier.

8. An apparatus as in claim 1, wherein said sensor and said signal generating device are combined into a single integrated circuit device mounted on said chip carrier.

9. An apparatus as in claim 1, wherein said signal generating device forms part of said integrated circuit chip.

10. An apparatus as in claim 1, wherein said warning signal is sent by said signal generating device immediately upon receipt of said electrical signal by said signal generating device.

11. An apparatus as in claim 1, wherein data provided by said sensor via said signal generating device has been inputted into a lifetime predictive reliability model to immediately provide the remaining lifetime of said chip carrier.

5. (canceled)