Packages, biochip kits and methods of packaging

• US 20090018035A1
• Filed: 07/02/2008
• Published: 01/15/2009
• Est. Priority Date: 07/13/2007
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Lee, Dong-Ho, Lee, June-Young
• Granted Patent: US 8,052,941 B2
• Time in Patent Office: Days
• US Class Current: 506/33
• CPC Class Codes: B01L 2200/16 Reagents, handling or storing thereof
• CPC Class Codes: B01L 2200/18 Transport of container or devices
• CPC Class Codes: B01L 2300/047 Additional chamber, reservoir
• CPC Class Codes: B01L 2300/0636 Integrated biosensor, microarrays
• CPC Class Codes: B01L 3/508 rigid containers not provided for above
• CPC Class Codes: C40B 60/12 for screening libraries

Abstract

A package having an improved yield is provided. The package includes a support on which a plurality of biochips are disposed, and a cover bonded to the support and defining a reaction space for each of the plurality of biochips together with the support, the cover including at least one inlet/outlet.

Claims

1. A package comprising:

a support on which a plurality of biochips are disposed; and

a cover bonded to the support and defining a reaction space for each of the plurality of biochips together with the support, the cover including at least one inlet/outlet.

2. The package of claim 1, wherein the reaction space includes a top surface, a bottom surface, and sidewalls, the top surface of the reaction space is formed by the cover, the bottom surface of the reaction space is formed by the support, and the sidewalls of the reaction space are formed by the support alone or the cover alone, or a combination of the support and the cover.

3. The package of claim 1, wherein the biochips include a plurality of active regions and a plurality of probes coupled to the active regions, the active regions being on a surface of the support.

4. A package comprising:

a support on which a plurality of biochips are disposed;

a spacer bonded to the support and having a plurality of openings corresponding to the plurality of biochips, each of the plurality of openings exposing a biochip; and

a cover bonded to the spacer and defining a reaction space for each of the plurality of biochips together with the support and the spacer.

5. The package of claim 4, wherein the spacer comprises silicone or urethane.

6. The package of claim 4, wherein the spacer comprises a self-sealing material.

7. The package of claim 4, wherein the reaction space includes a top surface, a bottom surface, and sidewalls, the top surface of the reaction space is formed by the cover, the bottom surface of the reaction space is formed by the support, and the sidewalls of the reaction space are formed by the support alone, the cover alone, the spacer alone, or a combination of the support, the spacer and the cover.

8. The package of claim 4, wherein the cover includes at least one inlet/outlet.

9. The package of claim 4, wherein the biochips include a plurality of active regions and a plurality of probes coupled to the active regions, the active regions being on a surface of the support.

10. A biochip kit comprising:

a substrate on which a biochip is disposed; and

a cover bonded to the substrate and defining a reaction space over the biochip together with the substrate, the cover including at least one inlet/outlet.

11. The biochip kit of claim 10, wherein the reaction space includes a top surface, a bottom surface, and sidewalls, the top surface of the reaction space is formed by the cover, the bottom surface of the reaction space is formed by the substrate, and the sidewalls of the reaction space are formed by the substrate alone, the cover alone, or a combination of the substrate and the cover.

12. The biochip kit of claim 10, wherein the biochip includes a plurality of active regions and a plurality of probes coupled to the active regions, the active regions being on the substrate.

13. The biochip kit of claim 10, wherein the substrate includes a substrate protrusion and the cover includes a cover protrusion, the cover protrusion corresponding to the substrate protrusion.

14. A biochip kit comprising:

a substrate on which a biochip is disposed;

a spacer bonded to the substrate and having an opening corresponding to the biochip, the opening exposing the biochip; and

a cover bonded to the spacer and defining a reaction space over the biochip together with the substrate and the spacer, the cover including at least one inlet/outlet.

15. The biochip kit of claim 14, wherein the spacer comprises silicone or urethane.

16. The biochip kit of claim 14, wherein the spacer comprises a self-sealing material.

17. The biochip kit of claim 14, wherein the reaction space includes a top surface, a bottom surface, and sidewalls, the top surface of the reaction space is formed by the cover, the bottom surface of the reaction space is formed by the substrate, and the sidewalls of the reaction space are formed by the spacer alone, a combination of the spacer and the cover, or a combination of the spacer and the substrate.

18. The biochip kit of claim 14, wherein the cover includes at least one inlet/outlet.

19. The biochip kit of claim 14, wherein the cover includes a cover protrusion corresponding to the biochip.

20. The biochip kit of claim 14, wherein the substrate includes a substrate protrusion and the cover includes a cover protrusion, the cover protrusion and the substrate protrusion facing each other.

21. A packaging method comprising:

providing a support on which a plurality of biochips are disposed; and

bonding a cover to the support to form a package, the cover including at least one inlet/outlet and defining a reaction space for each of the plurality of biochips together with the support, wherein the cover includes a plurality of cover protrusions, each corresponding to each of the plurality of biochips.

22. The packaging method of claim 21, wherein the bonding of the cover to the support comprises bonding the cover to the support including a plurality of support protrusions, the support protrusions corresponding to the cover protrusions.

23. A biochip kit packaging method comprising:

providing a support on which a plurality of biochips are disposed;

bonding a cover to the support to form a package, the cover including at least one inlet/outlet and defining a reaction space for each of the plurality of biochips together with the support; and

cutting the package to separate the plurality of biochips, each biochip having a discrete reaction space.

24. A packaging method comprising:

providing a support on which a plurality of biochips are disposed;

bonding a spacer having a plurality of openings corresponding to the plurality of biochips, each of the plurality of openings exposing each of the plurality of biochips; and

bonding a cover to the spacer to form a package, the cover defining a reaction space for each of the plurality of biochips together with the support and the spacer.

25. The packaging method of claim 24, wherein the spacer comprises silicone or urethane.

26. The packaging method of claim 24, wherein the spacer comprises a self-sealing material.

27. The wafer level packaging method of claim 24, wherein the cover includes at least one inlet/outlet.

28. A biochip kit packaging method comprising:

providing a support on which a plurality of biochips are disposed bonding a spacer having a plurality of openings corresponding to the plurality of biochips, each of the plurality of openings exposing each of the plurality of biochips;

bonding a cover to the spacer to form a package, the cover defining a reaction space for each of the plurality of biochips together with the support and the spacer; and

cutting the package to separate the plurality of biochips, each biochip having a discrete reaction space.

29. The biochip kit packaging method of claim 28, wherein the spacer comprises silicone or urethane.

30. The biochip kit packaging method of claim 28, wherein the spacer comprises a self-sealing material.

31. The biochip kit packaging method of claim 28, wherein the cover includes at least one inlet/outlet.