System and Method of Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements

• US 20090020266A1
• Filed: 09/11/2008
• Published: 01/22/2009
• Est. Priority Date: 11/30/2005
• Status: Active Grant

• Current Assignee: Raytheon Company (Rtx Corporation)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Payton, Albert P., Weber, Richard M., Rummel, Kerrin A.
• Granted Patent: US 9,383,145 B2
• Time in Patent Office: Days
• US Class Current: 165/104.210
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28F 3/022 the means being wires or pins
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/4735 Jet impingement H01L23/4336 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

According to one embodiment of the invention, a cooling system for a heat-generating structure comprises a chamber and structure disposed within the chamber. The chamber has an inlet and an outlet. The inlet receives fluid coolant into the chamber substantially in the form of a liquid. The outlet dispenses the fluid coolant out of the chamber at least partially in the form of a vapor. The structure disposed within the chamber receive thermal energy from the heat generating structure and transfers at least a portion of the thermal energy to the fluid coolant. The thermal energy from the heat-generating structure causes at least a portion of the fluid coolant substantially in the form of a liquid to boil and effuse vapor upon contact with a portion of the structure. The effusion of vapor creates a self-induced flow in the chamber. The self-induced flow distributes non-vaporized fluid coolant substantially in the form of a liquid to other portions of the structure.

Claims

1-20. -20. (canceled)

21. A method for cooling a heat-generating structure, the method comprising:

transferring thermal energy from a heat generating structure to a plurality of pin fins disposed in a chamber, the plurality of pin fins including upstream pin fins and downstream pin fins;

introducing a fluid coolant into the chamber;

exposing the fluid coolant to the upstream pin fins disposed in the chamber, thereby causing at least a portion of the fluid coolant substantially in the form of a liquid to boil and effuse vapor during the transfer of thermal energy from the upstream pin fins to the fluid coolant, the effused vapor creating a self-induced flow in the chamber and creating a jet impingement of fluid coolant upon at least a portion of the plurality of pin fins;

distributing non-vaporized fluid coolant substantially in the form of a liquid to the downstream pin fins through a spraying effect energized by the self-induced flow; and

transferring at least a portion of the thermal energy from the downstream fins to the sprayed non-vaporized fluid coolant.

22. The method of claim 21, wherein the introduction of fluid coolant into the chamber has a flow that is less than double the amount of flow necessary to absorb thermal energy with one hundred percent conversion.

23. The method of claim 21, wherein the introduction of fluid coolant into the chamber has a flow that is less than thirty percent more than the amount of flow necessary to absorb thermal energy with one hundred percent conversion.

24. The method of claim 21, wherein the method creates a maximum temperature differential between the plurality of pin fins disposed in the chamber to less than two degrees Celsius.

25. The method of claim 21, wherein a flow of fluid coolant into the chamber is gravity fed.

26. The method of claim 21, wherein the method operates as a thermal siphon.

27. The method of claim 21, wherein the self-induced flow is chaotic.

28. The method of claim 21, further comprising:

reducing a pressure of the fluid coolant to a subambient pressure at which the fluid coolant has a boiling temperature less than a temperature of the heat-generating structure.

29. A method for cooling a heat-generating structure, the method comprising:

transferring thermal energy from a heat generating structure to a structure disposed in a chamber;

introducing a fluid coolant into the chamber;

exposing the fluid coolant to at least a portion of the structure disposed in the chamber, thereby causing at least a portion of the fluid coolant substantially in the form of a liquid to boil and effuse vapor during the transfer of thermal energy from the at least a portion of the structure to the fluid coolant, the effused vapor creating a self-induced flow in the chamber;

distributing non-vaporized fluid coolant substantially in the form of a liquid to other portions of the structure using the self-induced flow; and

transferring at least a portion of the thermal energy from the other portions of the structure to the distributed non-vaporized fluid coolant.

30. The method of claim 29, wherein the introduction of fluid coolant into the chamber has a flow that is less than double the amount of flow necessary to absorb thermal energy with one hundred percent conversion.

31. The method of claim 29, wherein the introduction of fluid coolant into the chamber has a flow that is less than thirty percent more than the amount of flow necessary to absorb thermal energy with one hundred percent conversion.

32. The method of claim 29, wherein the self-induced flow is chaotic.

33. The method of claim 29, wherein

the structure is a plurality of pin fins, the plurality of pin fins including upstream pin fins and downstream pin fins;

the exposing the fluid coolant to at least a portion of the structure disposed in the chamber includes exposing the fluid coolant to the upstream pin fins; and

the distributing non-vaporized fluid coolant substantially in the form of a liquid to other portions of the structure using the self-induced flow includes distributing non-vaporized fluid coolant substantially in the form of a liquid to the downstream pin fins.

34. The method of claim 33, wherein the distribution of fluid coolant to the downstream pin fins is a spraying effect energized by the effused vapor.

35. The method of claim 33, wherein the effused vapor creates a jet impingement of fluid coolant upon at least a portion of the plurality of pin fins.

36. The method of claim 29, wherein the self-induced flow includes globs of fluid coolant substantially in the form of a liquid thrown against the other portions of the structure.

37. The method of claim 29, wherein the method creates a maximum temperature differential between different portions of the structure disposed in the chamber to less than two degrees Celsius.

38. The method of claim 29, wherein a flow of fluid coolant into the chamber is gravity fed.

39. The method of claim 29, wherein the method operates as a thermal siphon.

40. The method of claim 29, further comprising:

reducing a pressure of the fluid coolant to a subambient pressure at which the fluid coolant has a boiling temperature less than a temperature of the heat-generating structure.