SPUTTER COATING DEVICE AND METHOD OF DEPOSITING A LAYER ON A SUBSTRATE

• US 20090020416A1
• Filed: 06/25/2008
• Published: 01/22/2009
• Est. Priority Date: 07/18/2007
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Scholhammer, James, Dieguez-Campo, Jose Manuel, Hoffmann, Uwe
• Application Number:
  US12/145,755
• Publication Number:
  US 20090020416A1
• Time in Patent Office: Days
• US Class Current: 204/192.120
• CPC Class Codes: C23C 14/20 on organic substrates
• CPC Class Codes: C23C 14/352 using more than one target C23C14/56 takes precedence
• CPC Class Codes: C23C 14/564 Means for minimising impurities in the coating chamber such as dust, moisture, residual gases

Abstract

A sputter coating device comprises a vacuum coating chamber, substrates arranged within the coating chamber, a cylindrical hollow cathode including a rotatable target rotating around a central axis A, and a magnet assembly which is arranged within the hollow cathode such that confining plasma zones are generated in an area above the surface of the target. At least one substrate is to be coated. The substrate has an OLED layer deposited on the substrate surface. An intermediate area is arranged between the surface of the target and a shield that shields particles sputtered from the surface of the target that move in a direction toward the shield. On each side of the shield, passages are provided between the intermediate area and coating area. Through the passage, only sputtered particles that have been scattered in the intermediate area may enter the coating area via the passage, and impinge the OLED layer.

Claims

1. A sputter coating device for depositing a layer on a substrate having an organic material layer deposited thereon, the sputter coating device comprising:

a coating chamber;

a substrate having a surface and an organic material layer deposited thereon;

a rotatable cathode unit arranged in the coating chamber comprising a rotatable target for sputtering particles from the target and a magnet assembly for generating a plasma confinement zone arranged above a surface section of the target;

a scattering zone provided between the surface section of the target and the substrate surface for scattering the sputtered particles; and

means for selectively preventing a portion of the sputtered particles from moving to the substrate surface.

2. The sputter coating device according to claim 1, wherein the means comprises an arrangement and/or configuration of the surface section of the target, the scattering zone and the substrate surface such that the portion of the sputtered particles scattered in the scattering zone passes the means to impinge the substrate surface.

3. The sputter coating device according to claim 1, wherein the means comprises a passage between the scattering zone and the substrate wherein the passage is arranged and/or configured for a selective passage of particles scattered in the scattering zone to the substrate surface.

4. The sputter coating device according to claim 1, wherein the means comprises a configuration and/or an arrangement of the magnet assembly such that the average prevailing direction of movement of sputtered particles near the surface of the target is not directed toward the substrate surface.

5. The sputter coating device according to claim 1, wherein the means is configured such that there is a connecting path between the surface section of the target and the substrate surface to be coated for particles sputtered from the surface of the target and scattered in a defined area.

6. The sputter coating device according to claim 1, wherein the means comprises at least one shield.

7. The sputter coating device according to claim 1, wherein the sputter coating device comprises:

a first rotatable cathode unit arranged in the coating chamber comprising a first rotatable target and a first magnet assembly for generating a first plasma confinement zone arranged above a first surface section of the first target; and

a second rotatable cathode unit arranged in the coating chamber comprising a second target and a second magnet assembly for generating a second plasma confinement zone arranged above a surface section of the second target,

wherein the means are configured to selectively prevent the portion of the sputtered particles from moving to the surface of the substrate.

8. The sputter coating device according to claim 7, wherein the means comprises a configuration and/or arrangement of the first magnet assembly and the second magnet assembly such that the first surface section of the first target surface, and the second surface section of the second target surface are arranged face-to-face defining an intermediate zone there between.

9. The sputter coating device according to claim 8, wherein the sputter coating device comprises at least one shield between the intermediate zone and the substrate surface, the shield having at least one opening for scattered particles to move toward the substrate surface.

10. A method of depositing a layer on a substrate having an organic material layer deposited thereon, the method comprising the steps of:

a. Providing a first coating chamber;

b. Providing a substrate to be coated in the first coating chamber, the substrate having an organic material layer deposited thereon;

c. Providing a first rotatable cathode unit arranged in the first coating chamber comprising a first rotatable target and a first magnet assembly for generating a first plasma confinement zone arranged above a surface section of the first target;

d. Providing means for preventing sputtered particles from moving from the surface of the first rotatable target to the substrate surface on a substantially direct path; and

e. Sputtering particles from the first rotatable target to form a first layer on the substrate.

11. The method according to claim 10, wherein step c) comprises arranging the magnet assembly such that the average prevailing direction of movement of sputtered particles near the surface of the target is not directed toward the substrate surface.

12. The method according to 10, wherein the step c) comprises providing a second rotatable cathode unit arranged in the first coating chamber, the second cathode unit comprising a second rotatable target and a second magnet assembly for generating a second plasma confinement zone arranged above a surface section of the second target.

13. The method according to claim 12, wherein step c) comprises arranging the first magnet assembly and the second magnet assembly, wherein particles sputtered from the surface of the first target have a prevailing direction of movement toward the surface of the second target, wherein particles sputtered from the surface of the second target have a prevailing direction of movement toward the surface of the first target surface.

14. The method according to claim 10, wherein step d) comprises providing a connecting path between the surface section of the target and the substrate surface to be coated for particles sputtered from the surface of the target and scattered in a scattering zone.

15. The method according to claim 14, wherein step d) comprises providing at least one shield between the scattering zone and the substrate surface.

16. The method according to claim 14, wherein step d) comprises providing at least one shield having an opening for allowing the scattered particles sputtered from the target to pass through the opening and to impinge the substrate surface to be coated.

17. The method according to claim 10, wherein during the step e) the substrate surface is arranged substantially parallel relative to an average prevailing direction of movement of the sputtered particles near the surface of the target.

18. The method according to claim 10, the method further comprising step f) after depositing the first layer on the substrate:

f) Sputtering particles from a second rotatable target in a second coating chamber such that the sputtered particles have an average prevailing direction of movement toward the substrate surface to be coated for allowing the particles to impinge the substrate surface directly.

19. The method according to claim 18, wherein step f) comprises changing the alignment of the magnet assembly from a direction not facing the substrate surface to a direction facing the substrate surface.

20. The method according to claim 18, wherein step f) comprises:

transporting the substrate from the first coating chamber to the second coating chamber; and

sputtering particles from the second rotatable target to deposit a second layer on the first layer.

21. The method according to previous claims 20, wherein the first layer deposited during step e) comprises a thickness between 5 nm and 100 nm, wherein the second layer deposited in step f) comprises a thickness between 10 nm and 1000 nm.