Integrated circuit package and system interface

• US 20090020868A1
• Filed: 09/15/2008
• Published: 01/22/2009
• Est. Priority Date: 08/18/2006
• Status: Active Grant

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: LSI Logic Corporation (Broadcom, Inc.)
• Inventors: Gasparik, Frantisek, Callicott, Steve
• Granted Patent: US 7,550,839 B2
• Time in Patent Office: Days
• US Class Current: 257/717
• CPC Class Codes: H01L 2223/6627 Waveguides, e.g. microstrip line, strip line, coplanar line
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/17 of a plurality of bump connectors
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12043 Photo diode
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15173 in a single layer of the multilayer substrate
• CPC Class Codes: H01L 2924/1903 including wave guides
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

An apparatus for enhancing the performance of an IC package and media interface. Adding a fissure to a Flip-Chip type package improves the crosstalk performance of the package for both high and low frequencies. The wall of the fissure can be implemented with a heat spreader layer and can be connected to any AC ground such as VSS or VDD package planes. The fissures can also accommodate the ingress of an optical fiber, which allows for a direct interface with the transceivers. The direct optical fiber interface permits the removal of solder balls for high speed signal traces, with their respective vias. On-chip integrated LEDs or other similar light source transceivers can drive the high speed signal media. Selective deposition of low dielectric material can also improve the frequency response of high speed signal package traces.

Claims

1. An apparatus for enhancing the performance and extending the frequency range of integrated circuit packages, comprising:

a fissure added to a Flip-Chip (FC) package in order to improve a cross talk performance of said FC package for high and low frequency ranges;

an AC ground connected to said fissure; and

a top wall of said fissure configured utilizing a heat spreader layer in order to form an improved IC package based on said FC package in association with said fissure and said top wall thereof.

2. The apparatus of claim 1, further comprising:

an ingress of an optical fiber configured to accommodate said fissure in order to provide for a direct interface of said optical fiber with a transceiver;

an on-chip integrated light emitting device for driving a high speed signal trace; and

a low dielectric material selectively deposited to improve a frequency response of said high speed signal trace.

3. The apparatus of claim 2 wherein said light emitting device comprises a light emitting diode (LED).

4. The apparatus of claim 2 wherein said optical fiber permits a removal of at least one solder ball from said high speed signal trace.

5. The apparatus of claim 2 wherein said high speed signal trace comprises said fissure.

6. The apparatus of claim 1 wherein said fissure extends a frequency range of said FC package.

7. The apparatus of claim 1 wherein said fissure is formed utilizing a conductive material walls in order to connect said fissure to said AC ground.

8. The apparatus of claim 1 further comprising:

a loop coupling associated with said improved IC package, wherein at least one I/O connected to said improved IC package drives said loop coupling; and

wherein said loop coupling comprises an input to waveguide associated with said improved IC package and wherein said waveguide joins another waveguide which is configured on a PCB.