RADIO FREQUENCY IC DEVICE AND ELECTRONIC APPARATUS

• US 20090021352A1
• Filed: 09/23/2008
• Published: 01/22/2009
• Est. Priority Date: 07/18/2007
• Status: Abandoned Application

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: KATAYA, Takeshi, DOKAI, Yuya, KATO, Noboru, ISHINO, Satoshi, IKEMOTO, Nobuo, KIMURA, Ikuhei
• Application Number:
  US12/235,753
• Publication Number:
  US 20090021352A1
• Time in Patent Office: Days
• US Class Current: 340/10.100
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/48 Earthing means; Earth screens; Counterpoises
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H04Q 2213/13095 PIN / Access code, authentication
• CPC Class Codes: H05K 1/0239 Signal transmission by AC coupling
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 2201/10098 Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas

Abstract

A radio frequency IC device includes a radio frequency IC chip arranged to process a transmitted/received signal, a printed circuit board on which the radio frequency IC chip is mounted, an electrode arrange on the circuit board, and a loop electrode that is arranged on the circuit board so that the loop electrode is electrically connected to the radio frequency IC chip and is coupled to the electrode by electromagnetic coupling. The electrode is coupled to the radio frequency IC chip via the loop electrode so as to transmit or receive a high-frequency signal. A power supply circuit board including a resonance circuit and/or a matching circuit may be disposed between the radio frequency IC chip and the loop electrode.

Claims

1. A radio frequency IC device comprising:

a radio frequency IC chip arranged to process a transmitted/received signal;

a circuit board on which the radio frequency IC chip is mounted;

an electrode arranged on the circuit board; and

a loop electrode arranged on the circuit board so that the loop electrode is coupled to the radio frequency IC chip and to the electrode.

2. The radio frequency IC device according to claim 1, wherein the loop electrode and the electrode arranged on the circuit board are arranged on the same main surface of the circuit board.

3. The radio frequency IC device according to claim 1, wherein at least one of the loop electrode and the electrode arranged on the circuit board is disposed in the circuit board.

4. The radio frequency IC device according to claim 1, wherein the loop electrode and the electrode arranged on the circuit board are electrically isolated from each other.

5. The radio frequency IC device according to claim 1, wherein the loop electrode and the electrode arranged on the circuit board are electrically connected to each other.

6. The radio frequency IC device according to claim 1, wherein the circuit board is a multilayer board in which one of a plurality of dielectric layers and a plurality of magnetic layers are laminated.

7. The radio frequency IC device according to claim 1, wherein the loop electrode provides an impedance matching function.

8. The radio frequency IC device according to claim 6, wherein the loop electrode is provided on a main surface of the circuit board and is provided on at least one of the plurality of dielectric layers or on at least one of the plurality of magnetic layers.

9. The radio frequency IC device according to claim 6, wherein the loop electrode is provided on a plurality of layers, and the loop electrode provided on at least one of the plurality of layers is different from the loop electrodes provided on the other ones of the plurality of layers in loop size.

10. The radio frequency IC device according to claim 9, wherein end portions of the loop electrode that is different from the loop electrodes in loop size are coupled to one of the radio frequency IC chip and the electromagnetic coupling module.

11. The radio frequency IC device according to claim 1, wherein a matching electrode is disposed on an inner side of the loop electrode.

12. An electronic apparatus comprising the radio frequency IC device according to claim 1.

29. An electronic apparatus comprising the radio frequency IC device according to claim 1.

13. A radio frequency IC device comprising:

an electromagnetic coupling module including a radio frequency IC arranged to process a transmitted/received signal and a power supply circuit board including an inductance element coupled to the radio frequency IC;

a circuit board on which the electromagnetic coupling module is mounted;

an electrode arranged on the circuit board; and

a loop electrode arranged on the circuit board so that the loop electrode is coupled to the power supply circuit board and to the electrode.

14. The radio frequency IC device according to claim 13, wherein a resonance circuit is provided in the power supply circuit board.

15. The radio frequency IC device according to claim 13, wherein a matching circuit is provided in the power supply circuit board.

16. The radio frequency IC device according to claim 13, wherein the loop electrode and the electrode arranged on the circuit board are arranged on the same main surface of the circuit board.

17. The radio frequency IC device according to claim 13, wherein at least one of the loop electrode and the electrode arranged on the circuit board is disposed in the circuit board.

18. The radio frequency IC device according to claim 13, wherein the loop electrode and the electrode arranged on the circuit board are electrically isolated from each other.

19. The radio frequency IC device according to claim 13, wherein the loop electrode and the electrode arranged on the circuit board are electrically connected to each other.

20. The radio frequency IC device according to claim 13, wherein the circuit board is a multilayer board in which one of a plurality of dielectric layers and a plurality of magnetic layers are laminated.

21. The radio frequency IC device according to claim 13, wherein the loop electrode provides an impedance matching function.

22. The radio frequency IC device according to claim 20, wherein the loop electrode is provided on a main surface of the circuit board and is provided on at least one of the plurality of dielectric layers or on at least one of the plurality of magnetic layers.

23. The radio frequency IC device according to claim 20, wherein the loop electrode is provided on a plurality of layers, and the loop electrode provided on at least one of the plurality of layers is different from the loop electrodes provided on the other ones of the plurality of layers in loop size.

24. The radio frequency IC device according to claim 23, wherein end portions of the loop electrode that is different from the loop electrodes in loop size are coupled to one of the radio frequency IC chip and the electromagnetic coupling module.

25. The radio frequency IC device according to claim 13, wherein a matching electrode is disposed on an inner side of the loop electrode.

26. The radio frequency IC device according to claim 13, wherein an outer electrode is provided on a surface of the power supply circuit board, the outer electrode being coupled to at least one of a resonance circuit and a matching circuit by electromagnetic field coupling and being electrically connected to the loop electrode.

27. The radio frequency IC device according to claim 13, wherein the power supply circuit board includes a multilayer board.

28. The radio frequency IC device according to claim 13, wherein the power supply circuit board includes a flexible board.