Module and method for producing a module

• US 20090021920A1
• Filed: 07/16/2008
• Published: 01/22/2009
• Est. Priority Date: 07/16/2007
• Status: Active Grant

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Hund, Paul, Irslinger, Hans-Martin, Jobert, Tristan, Baer, Hans-Peter
• Granted Patent: US 8,094,465 B2
• Time in Patent Office: Days
• US Class Current: 361/728
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A module, in particular a sensor module, has a module housing, a carrier element, a connection element, and at least one component, the module housing completely enclosing the at least one component and being situated on the carrier element, and the at least one component also being mounted on the connection element and being situated between the connection element and the carrier element.

Claims

1. A module, comprising:

a module housing;

a carrier element;

a connection element; and

at least one component;

wherein the module housing completely encloses the at least one component and is situated on the carrier element; and

wherein the at least one component is mounted on the connection element and is situated between the connection element and the carrier element.

2. The module according to claim 1, wherein the module is arranged as a sensor module.

3. The module according to claim 1, wherein the module housing has a module housing cover having at least one electrically conductive spring device, an electrically conductive cold contact being provided between the conductive spring device and at least one partial area of the connection element.

4. The module according to claim 3, wherein the module housing cover at least one of (a) is electrically conductive, (b) includes an electrically conductive shielding element, and (c) is latched to the module housing.

5. The module according to claim 4, wherein at least one of (a) the electrically conductive spring device, (b) the conductive shielding element, and (c) the module housing cover is connected by at least one of (a) a conductive adhesive, (b) a press contact, and (c) a laser welding contact.

6. The module according to claim 1, wherein the connection element includes at least one of (a) a closed and (b) a conductive protective face in an overlap area with the at least one component parallel to a surface normal of the carrier element.

7. The module according to claim 1, wherein contacting of the at least one component with the connection element is provided in a contacting plane, a surface normal of the contacting plane being parallel to a surface normal of the carrier element and the contacting plane lying between a protective face and the carrier element, the contact being provided in the contacting plane in an edge area of the module housing.

8. The module according to claim 1, wherein at least one of (a) the connection element has contact pins that extend parallel to a surface normal from a contacting plane up to the carrier element and (b) the module housing includes a further module housing cover situated between the at least one component and the carrier element.

10. The method according to claim 9, wherein the module is arranged as recited in claim 1.

9. A method for producing a module, comprising:

at least one of (a) stamping and (b) embossing a connection element;

extrusion coating the connection element to produce a module housing;

mounting at least one component on the connection element inside the module housing;

mounting an assembly of the module housing, the connection element, and the at least one component on a carrier element such that the at least one component is situated between the connection element and the carrier element.

11. The method according to claim 9, further comprising mounting a further module housing cover between the mounting of the at least one component on the connection element inside the module housing and the mounting of the assembly on the carrier element.

12. The method according to claim 9, further comprising at least one of (a) after the mounting of the at least one component on the connection element inside the module housing, contacting the at least one component and (b) producing contact pins by at least one of (a) bending and (b) stamping partial areas of the connection element.