LAMINATED FILM HAVING GAS BARRIER CHARACTERISTICS

• US 20090022981A1
• Filed: 09/19/2006
• Published: 01/22/2009
• Est. Priority Date: 09/20/2005
• Status: Abandoned Application

• Current Assignee: Mitsubishi Plastics Incorporated (Mitsubishi Chemical Holdings Corporation)
• Original Assignee: Mitsubishi Plastics Incorporated (Mitsubishi Chemical Holdings Corporation)
• Inventors: Hachisuka, Tooru, Takemura, Motoyoshi, Yoshida, Shigenobu, Okawara, Chiharu
• Application Number:
  US12/067,326
• Publication Number:
  US 20090022981A1
• Time in Patent Office: Days
• US Class Current: 428/336
• CPC Class Codes: C08J 7/0423 with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder
• CPC Class Codes: C08J 7/043 Improving the adhesiveness of the coatings per se, e.g. forming primers adhesives in the form of films or foils characterised by the primer layers between the polymer carriers and the adhesives C09J7/50
• CPC Class Codes: C08J 7/046 Forming abrasion-resistant coatings; Forming surface-hardening coatings
• CPC Class Codes: C08J 7/048 Forming gas barrier coatings
• CPC Class Codes: C23C 28/00 Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
• CPC Class Codes: Y10T 428/265 1 mil or less

Abstract

Provided is a laminated film which exhibits high gas barrier performance immediately after the production and has excellent adhesive strength between constitutional layers, while maintaining the excellent gas barrier performance. The laminated film has at least one constitutional unit layer on an inorganic thin film formed at least on one surface of a base film. The constitutional unit layer is composed of an anchor coat layer having a thickness of 0.1 to 10 nm and an inorganic thin film formed on the anchor coat layer. A method for producing the laminated film is also provided.

Claims

1. A gas barrier laminated film, comprising an inorganic thin film formed on at least one side of a base film, wherein on that thin film there is at least one constitutional unit layer containing a 0.1 to 10 nm thick anchor coat layer, and an inorganic thin film formed on the anchor coat layer.

2. The laminated film according to claim 1, wherein a number of the constitutional unit layer is one to three.

3. The laminated film according to claim 1, wherein the anchor coat layer comprises at least one resin selected from the group consisting of a polyester-based resin, an urethane-based resin, an acryl-based resin, a nitrocellulose-based resin, a silicon-based resin, and an isocyanate-based resin.

4. The laminated film according to claim 1, wherein the anchor coat layer comprises a silane coupling agent.

5. The laminated film according to claim 1, wherein the anchor coat layer comprises at least one member selected from the group consisting of chromium, a titanium oxide, and a silicon nitride.

6. The laminated film according to claim 1, wherein the anchor coat layer is provided between the base film and the inorganic thin film.

7. The laminated film according to claim 1, wherein the inorganic thin film comprises a silicon oxide or an aluminum oxide.

8. The laminated film according to claim 1, comprising a protection layer as a top layer.

9. The laminated film according to claim 8, wherein the protection layer comprises a water-soluble resin.

10. The laminated film according to claim 9, wherein the protection layer comprises at least one resin selected from the group consisting of polyvinyl alcohol, ethylenevinyl alcohol, and an ethylene-unsaturated carboxylic acid copolymer.

11. A method for producing a gas barrier laminated film, comprising the steps of:

(A) forming an inorganic thin film on at least one side of a base film by a deposition method; and

(B) forming at least one constitutional unit layer which is obtained by successively forming a 0.1 to 10 nm thick anchor coat layer and an inorganic thin film formed by a deposition method on the inorganic thin film.