Device and Method for Determining the Temperature of a Heat Sink
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Accused Products
Abstract
A method for determining the temperature of a heat source and an electronic unit, including a printed-circuit board equipped with a sensor and a heat sink, the sensor being connected to the heat sink in a heat-conducting manner.
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Citations
42 Claims
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1-20. -20. (canceled)
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21. A device, comprising:
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a printed-circuit board; a sensor; and a heat sink; wherein the sensor is connected to the heat sink in a heat-conducting manner; wherein the printed-circuit board is connected to the heat sink; wherein the printed-circuit board is a multi-layer printed-circuit board; and wherein metallic areas of inner layers of the printed-circuit board are electrically and thermally connected to at least one metallic area at a surface of the printed-circuit board facing the heat sink. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35)
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36. A method for determining a temperature of a heat source connected to a heat sink in a heat-conducting manner, asensor being connected to the heat sink in a heat-conducting manner, a multi-layer printed-circuit board being equipped with the sensor, comprising:
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determining a temperature of the sensor; determining a measure for a temperature rise within a period of time; and determining the temperature of the heat source from a sum of the temperature of the sensor and the measure multiplied by a correction factor associated with the temperature rise. - View Dependent Claims (37, 38, 39, 40, 41, 42)
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Specification