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Stacked Circuits

  • US 20090026524A1
  • Filed: 07/27/2007
  • Published: 01/29/2009
  • Est. Priority Date: 07/27/2007
  • Status: Abandoned Application
First Claim
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1. An integrated circuit comprising:

  • a first integrated circuit layer comprising at least one first transistor channel region and having a wafer bonding interface; and

    at least one second integrated circuit layer comprising at least one second transistor channel region and being arranged at the wafer bonding interface of the first integrated circuit layer.

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