SEMICONDUCTOR DEVICE HAVING A SENSOR CHIP, AND METHOD FOR PRODUCING THE SAME
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Accused Products
Abstract
A semiconductor sensor device and method is disclosed. In one embodiment, the semiconductor device includes a cavity housing and a sensor chip. In one embodiment, the cavity housing has an opening to the surroundings. The sensor region of the sensor chip faces said opening. The sensor chip is mechanically decoupled from the cavity housing. In one embodiment, the sensor chip is embedded into a rubber-elastic composition on all sides in the cavity of the cavity housing.
108 Citations
39 Claims
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1-15. -15. (canceled)
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16. A semiconductor device having a sensor comprising:
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a cavity housing; a sensor chip with a sensor region, the sensor chip being arranged in the cavity of the housing, wherein the cavity housing has an opening to the surroundings, and the sensor region faces the opening; and wherein the sensor chip is embedded into a rubber-elastic composition on all sides in the cavity of the housing. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24)
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25. A method for producing a semiconductor device comprising:
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defining a cavity housing and a sensor chip with sensor region, the sensor chip being arranged in a cavity of the cavity housing; producing the cavity housing with internal conductor tracks and external contacts and a cavity base, and also side walls surrounding the cavity base, and ends of spacers which project from the cavity base, wherein the arrangement and size of the spacers are adapted to the areal extent of the rear side of a sensor chip such that the ends of the spacers form abutments for an arrangement and fitting of bonding wires on a sensor chip positioned on the ends of the spacers; filling the base of the cavity of the cavity housing with a rubber-elastic composition at least as far as the ends of the spacers; applying a sensor chip by its rear side to the ends of the spacers with fixing of the sensor chip on the rubber-elastic composition; fitting bonding wires on contact areas of the sensor chip; embedding the bonding wires and of the sensor chip into the rubber-elastic composition; and removing the spacers from the base with formation of passage openings in the base of the cavity housing. - View Dependent Claims (26, 27, 28, 29, 30)
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31. An integrated circuit having a semiconductor device comprising:
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a cavity housing; a sensor arranged in the cavity housing, mechanically decoupled from the cavity housing. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38)
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39. An integrated circuit having a semiconductor device comprising:
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a cavity housing; a sensor arranged in the cavity housing; and means for mechanically decoupling the sensor from the cavity housing.
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Specification