Memory module capable of lessening shock stress
First Claim
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1. A memory module comprising:
- a multi-layer printed circuit board (PCB) having a rectangular first surface, a rectangular second surface, a first long side, a second long side, and two short sides, the PCB including a plurality of gold fingers disposed on both surfaces of the first long side and a locking slot disposed on each short side;
a plurality of memory packages disposed at least on the first surface of the PCB; and
a stress-buffering layer disposed on both short sides of the PCB and extended to the first surface and the second surface.
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Abstract
A memory module capable of lessening shock stresses, primarily comprises a multi-layer printed circuit board (PCB), a plurality of memory packages, and a stress-buffering layer. The memory packages are disposed at least on one of the rectangular surfaces of the PCB. The stress-buffering layer is disposed at least on both short sides of the PCB and extended to the two rectangular surfaces to reduce the impact stresses. Preferably, the stress-buffering layer is further disposed on the other long side of the PCB opposite to the one with disposed gold fingers.
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Citations
11 Claims
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1. A memory module comprising:
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a multi-layer printed circuit board (PCB) having a rectangular first surface, a rectangular second surface, a first long side, a second long side, and two short sides, the PCB including a plurality of gold fingers disposed on both surfaces of the first long side and a locking slot disposed on each short side; a plurality of memory packages disposed at least on the first surface of the PCB; and a stress-buffering layer disposed on both short sides of the PCB and extended to the first surface and the second surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification