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Memory module capable of lessening shock stress

  • US 20090026599A1
  • Filed: 07/27/2007
  • Published: 01/29/2009
  • Est. Priority Date: 07/27/2007
  • Status: Abandoned Application
First Claim
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1. A memory module comprising:

  • a multi-layer printed circuit board (PCB) having a rectangular first surface, a rectangular second surface, a first long side, a second long side, and two short sides, the PCB including a plurality of gold fingers disposed on both surfaces of the first long side and a locking slot disposed on each short side;

    a plurality of memory packages disposed at least on the first surface of the PCB; and

    a stress-buffering layer disposed on both short sides of the PCB and extended to the first surface and the second surface.

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