SEMICONDUCTOR PACKAGE HAVING AN IMPROVED CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
First Claim
1. A semiconductor package comprising:
- a substrate comprising;
a substrate body;
connection pads located on a first surface of the substrate body; and
ball lands located on a second surface of the substrate body opposite the first surface,wherein the ball lands are electrically connected to the connection pads;
a semiconductor chip having bumps that correspond to the connection pads of the substrate; and
an anisotropic conductive member, the anisotropic conductive member comprising;
an insulation element interposed between the substrate and the semiconductor chip; and
electrically flowable conductive particles that flow within the insulation element according to electric fields,wherein the electrically flowable conductive particles are arranged between the connection pads and the bumps.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor package having an improved connection structure and a method for manufacturing the same is described. The semiconductor package includes a substrate having a substrate body, connection pads that are located on one surface of the substrate body, and ball lands that are located on the other surface of the substrate body opposite the one surface. The ball lands are electrically connected to the connection pads. A semiconductor chip having bumps that are formed to correspond to the connection pads is connected to the substrate. An anisotropic conductive member having an insulation element is interposed between the substrate and the semiconductor chip to connect the substrate and the semiconductor chip. Electrically flowable conductive particles within the insulation element flow in the insulation element according to applied electric fields so as to arrange the electrically flowable conductive particles between the connection pads and the bumps.
56 Citations
12 Claims
-
1. A semiconductor package comprising:
-
a substrate comprising; a substrate body; connection pads located on a first surface of the substrate body; and ball lands located on a second surface of the substrate body opposite the first surface, wherein the ball lands are electrically connected to the connection pads; a semiconductor chip having bumps that correspond to the connection pads of the substrate; and an anisotropic conductive member, the anisotropic conductive member comprising; an insulation element interposed between the substrate and the semiconductor chip; and electrically flowable conductive particles that flow within the insulation element according to electric fields, wherein the electrically flowable conductive particles are arranged between the connection pads and the bumps. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. A method for manufacturing a semiconductor package, comprising the steps of:
-
preparing a substrate having a substrate body, connection pads located on a first surface of the substrate body, and ball lands located on a second surface of the substrate body opposite the first surface that are electrically connected with the connection pads; locating an anisotropic conductive member on the first surface of the substrate, the anisotropic conductive material having electrically flowable conductive particles and an insulation element; applying electric fields to the electrically flowable conductive particles through the connection pads to move the electrically flowable conductive particles towards the connection pads within the insulation element in order to rearrange the electrically flowable conductive particles; and electrically connecting bumps of a semiconductor chip to the connection pads using the electrically flowable conductive particles that are rearranged between the connection pads and the bumps. - View Dependent Claims (8, 9, 10, 11, 12)
-
Specification