ALIGNMENT PRECISION ENHANCEMENT OF ELECTRONIC COMPONENT PROCESS ON FLEXIBLE SUBSTRATE DEVICE AND METHOD THEREOF THE SAME
First Claim
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1. An alignment precision enhancement device of an electronic component process on a flexible substrate, comprising:
- a substrate holder for carrying said flexible substrate;
a press machine for completely sticking said flexible substrate on said substrate holder by a polymer tape; and
an unstressed cutting machine for performing an unstressed cut according to positions of a plural of alignment marks and along the width of said flexible substrate so as to separate said flexible substrate from said substrate holder.
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Abstract
Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same is proposed. The process step of a flexible substrate is put on a substrate holder, wherein the flexible substrate is fixed by a polymer tape. A plural of alignment marks is making for lithography process. An unstressed cut is separated the flexible substrate and substrate holder when the electronic component is made.
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4 Claims
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1. An alignment precision enhancement device of an electronic component process on a flexible substrate, comprising:
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a substrate holder for carrying said flexible substrate; a press machine for completely sticking said flexible substrate on said substrate holder by a polymer tape; and an unstressed cutting machine for performing an unstressed cut according to positions of a plural of alignment marks and along the width of said flexible substrate so as to separate said flexible substrate from said substrate holder. - View Dependent Claims (2, 3, 4)
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Specification