System and method for wireless communication in a backplane fabric architecture
First Claim
1. A wireless millimeter wave backplane network comprising:
- a first circuit board having a first module thereon, wherein the first circuit board is coupled to a high speed backplane;
a first communication node coupled to the first module and disposed on the first circuit board;
a second circuit board having a second module thereon, the second circuit board coupled to the high speed backplane; and
a second communication node coupled to the second module and disposed on the second circuit board, wherein the first and second modules wirelessly communicate using millimeter wave electromagnetic radiation with one another via the first and second communication nodes.
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Accused Products
Abstract
A wireless millimeter wave backplane network and method comprises a first circuit board that has a first module thereon, wherein the first circuit board is coupled to a high speed backplane. The network includes a first communication node that is coupled to the first module and which is disposed on the first circuit board. The network includes a second circuit board that has a second module thereon, wherein the second circuit board is coupled to the high speed backplane. The network includes a second communication node that is coupled to the second module and disposed on the second circuit board, wherein the first and second modules wirelessly communicate using millimeter wave electromagnetic radiation with one another via the first and second communication nodes.
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Citations
20 Claims
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1. A wireless millimeter wave backplane network comprising:
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a first circuit board having a first module thereon, wherein the first circuit board is coupled to a high speed backplane; a first communication node coupled to the first module and disposed on the first circuit board; a second circuit board having a second module thereon, the second circuit board coupled to the high speed backplane; and a second communication node coupled to the second module and disposed on the second circuit board, wherein the first and second modules wirelessly communicate using millimeter wave electromagnetic radiation with one another via the first and second communication nodes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for wirelessly communicating between a plurality of modules in a high speed backplane fabric, the method comprising:
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selecting a destination communication node to receive a data packet, the destination communication node having at least a receiving antenna and coupled to a first circuit board, wherein the first circuit board is coupled to a high speed backplane; wirelessly transmitting the data packet using millimeter waves from a source communication node via a transmitting antenna to the destination communication node, the source communication node coupled to a second circuit board, wherein the second circuit board is coupled to the high speed backplane. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A millimeter wave transceiver node comprising:
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a first transmitting antenna; a second transmitting antenna opposed from the first transmitting antenna with respect to a circuit board plane; a transmitting circuit coupled to the first transmitting antenna and the second transmitting antenna; a first receiving antenna; a second receiving antenna opposed from the first receiving antenna with respect to the circuit board plane; a receiving circuit coupled to the first receiving antenna and the second receiving antenna, wherein a data packet are received by either of the first or second receiving antennas and the transmitting circuit is configured to transmit the data packet to another node via either the first or second transmitting antenna.
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18. A wireless backplane fabric network comprising:
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a first circuit board having a first module thereon; a first communication node coupled to the first module and disposed on the first circuit board; a second circuit board having a second module thereon; and a second communication node coupled to the second module and disposed on the second circuit board, a third circuit board having a third module thereon; a third communication node coupled to the second module and disposed on the third circuit board, wherein the first, second and third modules wirelessly autonomously select and communicate within one another via at least two of the first, second and third communication nodes without using a central switching module. - View Dependent Claims (19)
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20. A system for wirelessly communicating between a plurality of modules disposed on one or more circuit boards, the system comprising:
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means for selecting a destination transceiver node to receive a data packet from a first module on a first circuit, the destination transceiver node having a receiving antenna; and means for wirelessly transmitting the data packet via a millimeter wave signal from a source transceiver node to the destination transceiver node, the source transceiver node autonomously selects the destination transceiver module and transmits thereto without using a central switching module.
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Specification