IN-LINE SYSTEM AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE
First Claim
1. An in-line system for manufacturing a semiconductor package, the system comprising:
- a loading unit configured to load a wafer into the in-line system;
a back-lap unit configured to receive the wafer from the loading unit and to grind a rear surface of the wafer using a grinder;
a cleansing unit comprising an air pressure plasma generating unit, said cleansing unit configured to cleanse the rear surface of the wafer using air pressure plasma following grinding in the back-lap unit;
a coating unit configured to form an adhesive layer on the rear surface of the wafer that has been cleansed by the cleansing unit, wherein the coating unit is configured to coat a liquid adhesive agent onto the wafer using a nozzle;
an attaching unit configured to attach a dicing tape to the adhesive layer;
an unloading unit configured to unload the wafer; and
a transporting unit configured to transport the wafer sequentially between the loading unit, the back-lap unit, the cleansing unit, the coating unit, the attaching unit, and the unloading unit.
1 Assignment
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Accused Products
Abstract
An in-line system for manufacturing a semiconductor package according to principles of the present invention can prevent wafer warpage due to a back-lap process and die defects due to sticking of the die. In one embodiment, the in-line system adheres a semiconductor chip to a substrate by coating a liquid adhesive agent on a rear surface of the wafer. The processes of the in-line system are preferably performed in series. More particularly, the in-line system for manufacturing a semiconductor package can include a loading unit for loading a wafer into the system. A back-lap unit can include a grinder configured to back-grind a rear surface of the wafer received from the loading unit. A cleansing unit preferably comprises an air pressure plasma generating unit for cleansing the wafer using air pressure plasma. A coating unit can be configured to form an adhesive layer on a rear surface of the cleansed wafer by using a nozzle to coat a liquid adhesive agent onto the wafer. In the coating unit, the wafer can be rotated or not rotated depending on the desired characteristics of the adhesive layer. An attaching unit is preferably provided to attach a dicing tape on the adhesive layer formed. And an unloading unit unloads the wafer from the system. A transporting unit can be configured to transport the wafer sequentially between the loading unit, the back-lap unit, the cleansing unit, the coating unit, the attaching unit, and the unloading unit. One or more wafer chucks can be mounted to the wafer as the wafer is transported through the manufacturing processes.
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Citations
46 Claims
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1. An in-line system for manufacturing a semiconductor package, the system comprising:
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a loading unit configured to load a wafer into the in-line system; a back-lap unit configured to receive the wafer from the loading unit and to grind a rear surface of the wafer using a grinder; a cleansing unit comprising an air pressure plasma generating unit, said cleansing unit configured to cleanse the rear surface of the wafer using air pressure plasma following grinding in the back-lap unit; a coating unit configured to form an adhesive layer on the rear surface of the wafer that has been cleansed by the cleansing unit, wherein the coating unit is configured to coat a liquid adhesive agent onto the wafer using a nozzle; an attaching unit configured to attach a dicing tape to the adhesive layer; an unloading unit configured to unload the wafer; and a transporting unit configured to transport the wafer sequentially between the loading unit, the back-lap unit, the cleansing unit, the coating unit, the attaching unit, and the unloading unit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. An in-line system for manufacturing a semiconductor package, the system comprising:
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a loading unit configured to load a wafer into the in-line system; a back-lap unit configured to back-grind a rear surface of the wafer; a cleansing unit comprising an air pressure plasma generating unit, said cleansing unit configured to cleanse the wafer using air pressure plasma after grinding in the back-lap unit; a coating unit configured to form an adhesive layer on a rear surface of the wafer that has been cleansed by the cleansing unit, said coating unit configured to coat a liquid adhesive agent onto the wafer using a nozzle; a vacuum absorption unit configured to use a vacuum to remove bubbles from the adhesive layer formed on the wafer in the coating unit; a hardening unit configured to harden the adhesive layer; an attaching unit configured to attach a dicing tape on the adhesive layer; an unloading unit configured to unload the wafer; and a transporting unit configured to transport the wafer sequentially between the loading unit, the back-lap unit, the cleansing unit, the coating unit, the vacuum absorption unit, the hardening unit, the attaching unit, and the unloading unit. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43)
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44. A method of manufacturing a semiconductor package, the method comprising:
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loading a wafer into an in-line system using a loading unit; grinding a rear surface of the wafer using a back-lap unit; cleansing the wafer using air pressure plasma generated by an air pressure plasma generating unit arranged in a cleansing unit; forming an adhesive layer by coating a liquid adhesive agent on the rear surface of the wafer using a coating unit; attaching a dicing tape on the adhesive layer formed on the wafer using an attaching unit; unloading the wafer from the in-line system using an unloading unit; and sequentially transporting the wafer between the loading unit, the back-lap unit, the cleansing unit, the coating unit, the attaching unit, and the unloading unit using a transporting unit. - View Dependent Claims (45, 46)
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Specification