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IN-LINE SYSTEM AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE

  • US 20090028671A1
  • Filed: 11/20/2007
  • Published: 01/29/2009
  • Est. Priority Date: 12/15/2006
  • Status: Abandoned Application
First Claim
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1. An in-line system for manufacturing a semiconductor package, the system comprising:

  • a loading unit configured to load a wafer into the in-line system;

    a back-lap unit configured to receive the wafer from the loading unit and to grind a rear surface of the wafer using a grinder;

    a cleansing unit comprising an air pressure plasma generating unit, said cleansing unit configured to cleanse the rear surface of the wafer using air pressure plasma following grinding in the back-lap unit;

    a coating unit configured to form an adhesive layer on the rear surface of the wafer that has been cleansed by the cleansing unit, wherein the coating unit is configured to coat a liquid adhesive agent onto the wafer using a nozzle;

    an attaching unit configured to attach a dicing tape to the adhesive layer;

    an unloading unit configured to unload the wafer; and

    a transporting unit configured to transport the wafer sequentially between the loading unit, the back-lap unit, the cleansing unit, the coating unit, the attaching unit, and the unloading unit.

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