PLASMA TREATMENT APPARATUS AND PLASMA TREATMENT METHOD

• US 20090029564A1
• Filed: 05/30/2006
• Published: 01/29/2009
• Est. Priority Date: 05/31/2005
• Status: Abandoned Application

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Nishita, Tatsuo, Yamashita, Jun, Nakanishi, Toshio
• Application Number:
  US11/916,166
• Publication Number:
  US 20090029564A1
• Time in Patent Office: Days
• US Class Current: 438/788
• CPC Class Codes: H01J 37/32192 Microwave generated discharge H01J37/32357, H01J37/32366, H01J37/32394, H01J37/32403 take precedence
• CPC Class Codes: H01J 37/32633 Baffles
• CPC Class Codes: H01L 21/02164 the material being a silicon oxide, e.g. SiO2
• CPC Class Codes: H01L 21/02238 silicon in uncombined form, i.e. pure silicon
• CPC Class Codes: H01L 21/02252 formation by plasma treatment, e.g. plasma oxidation of the substrate after treatment of an insulating film by plasma H01L21/3105 and subgroups
• CPC Class Codes: H01L 21/31654 of semiconductor materials, e.g. the body itself
• CPC Class Codes: H01L 21/31662 of silicon in uncombined form
• CPC Class Codes: H01L 21/3185 of siliconnitrides
• CPC Class Codes: H05H 1/46 using applied electromagnetic fields, e.g. high frequency or microwave energy H05H1/26 takes precedence

Abstract

In a plasma oxidation treatment apparatus 100, dual plate structure 60 is arranged above a susceptor 2. An upper plate 61 and a lower plate 62 are made of a dielectric material such as quartz, separately arranged in parallel at a prescribed interval, for instance an interval of 5 mm, and have a plurality of through holes 61a, 62a. The two plates are arranged one over another by shifting the positions so that the through hole 62a of the lower plate 62 and the through hole 61a of the upper plate 61 are not overlapped.

Claims

1. :

A plasma processing apparatus comprising;

a processing chamber for accommodating therein a target substrate;

a substrate supporting table for mounting thereon the target substrate in the processing chamber;

a plasma bending unit for allowing a plasma of a processing gas supplied from an upper portion of the processing chamber to flow along non-linear passageways toward the target substrate mounted on the substrate supporting table, the plasma bending unit including at least a first plate and a second plate each of which is made of a first dielectric material and has a plurality of through holes, wherein the first plate and the second plate are arranged such that the through holes of the respective plates are not overlapped with each other; and

a gap adjusting member provided between the first plate and the second plate for adjusting a gap between the first and second plates.

5. :

The plasma processing apparatus of claim 1, wherein the gap adjusting member is an annular member.

16. :

The apparatus of claim 1, wherein the dielectric material is selected from quartz, SiN, SiC, Al₂O₃, and AlN.

17. :

The apparatus of claim 1, wherein the dielectric material is quartz material containing total impurities of about 50 ppm or less.

18. :

The apparatus of claim 1, wherein a distance between the second plate and the target substrate is in a range of from 3 to 20 mm.

19. :

The apparatus of claim 1, wherein each of the first and the second plate has a thickness ranging from 2 to 10 mm.

20. :

The apparatus of claim 1, wherein the plasma in a space provided between the second plate and the target substrate has an electron temperature controlled to be about 0.7 eV or less.

21. :

The apparatus of claim 20, wherein the plasma in the space provided between the second plate and the target substrate has an ion density controlled to be 1×

10⁹ to 1×

10¹¹/cm³.

22. :

The apparatus of claim 18, wherein the processing chamber has a second dielectric material provided at an upper portion thereof, and a distance between the second dielectric material and the first plate is in a range of from 20 to 50 mm.

23. :

The apparatus of claim 20, wherein an antenna is provided on the second dielectric material.

24. :

The apparatus of claim 23 wherein the antenna is a planar antenna having a plurality of slots and a microwave is supplied through the antenna into the processing chamber.

25. :

The apparatus of claim 1, wherein any one of an oxide film, a nitride film, and an oxynitride film is formed.

26. :

The apparatus of claim 25, wherein a thickness of the film formed is controlled to be 1 nm or less.

2-4. -4. (canceled)

6. :

A plasma processing apparatus comprising;

a processing chamber for accommodating therein a target substrate;

a substrate supporting table for mounting thereon the target substrate in the processing chamber; and

a plasma bending unit for allowing a plasma of a processing gas supplied from an upper portion of the processing chamber to flow along non-linear passageways toward the target substrate mounted on the substrate supporting table, the plasma bending unit having a plate made of a porous dielectric material.

7. :

The plasma processing apparatus of claim 6, wherein the porous dielectric material has porosity ranging from about 70% to 80%.

8. :

The plasma processing apparatus of claim 6, further comprising a planar antenna having a plurality of slots for introducing a microwave into the processing chamber.

9. :

A plasma processing method for forming a silicon oxide film by performing an oxidation process for oxidizing silicon on a surface of a target substrate by using an oxygen-containing plasma in a processing chamber, wherein

the oxidation process is performed in a state that a plasma bending unit for allowing the oxygen-containing plasma to flow along non-linear passageways is provided between the target substrate and a plasma generation region in the processing chamber, the plasma bending unit including at least a first plate and a second plate each of which is made of a first dielectric material and has a plurality of through holes, wherein the first plate and the second plate are arranged such that the through holes of the respective first and second plates are not overlapped with each other.

14. :

The plasma processing method of claim 9, wherein the silicon oxide film thus formed has a film thickness smaller than or equal to about 1 nm.

15. :

The plasma processing method of claim 9, wherein the oxygen-containing plasma is formed by introducing a microwave into the processing chamber with the use of a planar antenna having a plurality of slots.

10-11. -11. (canceled)

12. :

A plasma processing method for forming a silicon oxide film by performing an oxidation process for oxidizing silicon on a surface of a target substrate by using an oxygen-containing plasma in a processing chamber, wherein

the oxidation process is performed in a state that a plasma bending unit for allowing the oxygen-containing plasma to flow along non-linear passageways is provided between the target substrate and a plasma generation region in the processing chamber, the plasma bending unit having a plate made of a porous dielectric material.

13. :

The plasma processing method of claim 12, wherein the porous dielectric material has porosity ranging from about 70% to 80%.