Relay substrate and substrate assembly

• US 20090029570A1
• Filed: 01/30/2008
• Published: 01/29/2009
• Est. Priority Date: 01/31/2007
• Status: Active Grant

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Yagisawa, Takatoshi, Cheung, Tszshing, Ikeuchi, Tadashi
• Granted Patent: US 7,696,628 B2
• Time in Patent Office: Days
• US Class Current: 439/67
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01P 1/047 Strip line joints
• CPC Class Codes: H05K 1/0219 Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/147 at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence
• CPC Class Codes: H05K 2201/09618 Via fence, i.e. one-dimensional array of vias
• CPC Class Codes: H05K 2201/09727 Varying width along a single conductor; Conductors or pads having different widths
• CPC Class Codes: H05K 2201/10121 Optical component, e.g. opto-electronic component
• CPC Class Codes: H05K 2201/10446 Mounted on an edge soldering edge mounted components H05K3/3405; edge terminals H05K2201/1034

Abstract

According to an aspect of an embodiment, a substrate for connecting circuit boards comprises: a substrate member having a first surface and a second surface facing each other and a first end and a second end facing each other; a first signal line formed on the first surface of the first end; a second signal line formed on the second surface of the second end; a third signal line connecting the first signal line with the second signal line; a first ground plane arranged on the first surface and surrounding the first signal line; and a portion of the second signal line formed over the first ground, the portion comprising narrower than an other portion of the second signal line.

Claims

1. A substrate for connecting circuit boards, comprising:

a substrate member having a first surface and a second surface facing each other and a first end and a second end facing each other;

a first signal line formed on the first surface of the first end;

a second signal line formed on the second surface of the second end;

a third signal line connecting the first signal line with the second signal line;

a first ground plane arranged on the first surface and surrounding the first signal line; and

a portion of the second signal line formed over the first ground, the portion comprising narrower than an other portion of the second signal line.

2. A substrate of the clime 1, further comprising a second ground arranged on the second surface and associated with the second signal line.

3. A substrate of the clime 1, wherein the first signal line is comprised between the first end and an end of the third signal line of the first surface.

4. A substrate of the clime 1, wherein the third signal line is a via-hole.

5. A substrate of the clime 1, wherein the third signal line comprises a fourth signal line arranged between the first surfaces and the second surface and having ends, a first via-hole arranged between the first surface and the end of the fourth signal line, and a second via-hole arranged between the second surface and the other end of the fourth signal line.

6. A substrate assembly, comprising;

a first circuit board having a first circuit board signal line;

a second circuit board having a second circuit board signal line; and

a relay substrate comprising;

a first signal line formed on the first surface of the first end;

a second signal line formed on the second surface of the second end;

a third signal line connecting the first signal line with the second signal line;

a first ground plane arranged on the first surface and surrounding the first signal line; and

a portion of the second signal line formed over the first ground, the portion comprising narrower than an other portion of the second signal line.