Method, Computer Program and System Providing for Semiconductor Processes Optimization

• US 20090031260A1
• Filed: 07/25/2007
• Published: 01/29/2009
• Est. Priority Date: 07/25/2007
• Status: Abandoned Application

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Singh, Raminderpal, Elfadel, Ibrahim M., Angyal, Matthew, Woods, Wayne H., Standaert, Theodorus E., Deutsch, Alina
• Application Number:
  US11/782,747
• Publication Number:
  US 20090031260A1
• Time in Patent Office: Days
• US Class Current: 716/132
• CPC Class Codes: G06F 2111/08 Probabilistic or stochastic CAD
• CPC Class Codes: G06F 30/39 Circuit design at the physical level physical level design for reconfigurable circuits G06F30/347

Abstract

A method, computer program and system for the optimization of semiconductor process parameters given a pre-specified set of targets and constraints on electrical performance metrics are disclosed. Semiconductor process engineers who are not expert in the art of electrical analysis or mathematical optimization can readily use the method of this invention in optimizing semiconductor process parameters. Accommodates the differences in design styles, metal layer routing, and electrical metrics using priority schedules that are easy to input and understand. Enables the exploration of the process parameter space using primitive process tolerances and accurate electrical information provided by field solvers and circuit analysis programs.

Claims

1. ) A method comprising:

receiving a plurality of electrical metrics, corresponding target values, and corresponding weight factors, for each layer of a semiconductor;

receiving semiconductor process parameters, wherein at least one of the process parameters is specified as a statistical distribution;

determining at least one semiconductor process parameter that meets the plurality of electrical metrics within the corresponding target values according to their weight factors; and

providing an output of the at least one determined semiconductor process parameter.

2. ) The method of claim 1, further comprising generating a graphical user interface configured to facilitate the receiving of the process parameters, the electrical metrics, the target values, and the weight factors.

3. ) The method of claim 1, further comprising:

calculating a new set of electrical metrics from the semiconductor process parameters;

calculating sensitivity information with respect to variations in the semiconductor process parameters; and

using the calculated sensitivity information to guide the selection of the next set of process parameters.

4. ) The method of claim 3, wherein the electrical quantities and their sensitivities are calculated using field solvers.

5. ) The method of claim 1, wherein a figure of merit is used to evaluate the optimality of the process parameters.

6. ) The method of claim 1, wherein the determined process parameters are determined by at least one of:

an exhaustive search of the process parameter space and a mathematical optimization algorithm.

7. ) The method of claim 6, wherein the exhaustive search procedure is performed in parallel on a cluster of sequential machines.

8. ) The method of claim 7, wherein the exhaustive search procedure is controlled using a graphical user interface, comprising:

an input field for the number of sequential machines;

an input field for the number of simulations per machine; and

an input field for the report interval on each machine.

9. ) A signal bearing medium tangibly embodying a program of machine-readable instructions executable by a digital processing apparatus to perform operations comprising:

receiving a plurality of electrical metrics, corresponding target values, and corresponding weight factors, for each layer of a semiconductor;

receiving semiconductor process parameters, wherein at least one of the process parameters is specified as a statistical distribution;

determining at least one semiconductor process parameter that meets the plurality of electrical metrics within the corresponding target values according to their weight factors; and

providing an output of the at least one determined semiconductor process parameter.

10. ) The program of claim 9, further comprising generating a graphical user interface configured to facilitate the receiving of the process parameters, the electrical metrics, the target values, and the weight factors.

11. ) The program of claim 9, further comprising:

calculating a new set of electrical metrics from the semiconductor process parameters;

calculating sensitivity information with respect to variations in the semiconductor process parameters; and

using the calculated sensitivity information to guide the selection of the next set of process parameters.

12. ) The program of claim 11, wherein the electrical quantities and their sensitivities are calculated using field solvers.

13. ) The method of claim 9, wherein a figure of merit is used to evaluate the optimality of the process parameters.

14. ) The program of claim 9, wherein the determined process parameters are determined by at least one of:

an exhaustive search of the process parameter space and a mathematical optimization algorithm.

15. ) The program of claim 14, wherein the exhaustive search procedure is performed in parallel on a cluster of sequential machines.

16. ) The program of claim 15, wherein the exhaustive search procedure is controlled using a graphical user interface, comprising:

an input field for the number of sequential machines;

an input field for the number of simulations per machine; and

an input field for the report interval on each machine.

17. ) A system comprising:

a device configured to receive a plurality of electrical metrics, corresponding target values, and corresponding weight factors, for each layer of a semiconductor;

a device configured to receive semiconductor process parameters, wherein at least one of the process parameters is specified as a statistical distribution;

a device configured to generate a graphical user interface configured to facilitate the receiving of the process parameters, the electrical metrics, the target values, and the weight factors;

a device configured to determine at least one semiconductor process parameter that meets the plurality of electrical metrics within the corresponding target values according to their weight factors; and

a device configured to provide an output of the at least one determined semiconductor process parameter.

18. ) The system of claim 17, further comprising:

a device configured to;

calculate a new set of electrical metrics from the semiconductor process parameters;

calculate sensitivity information with respect to variations in the semiconductor process parameters; and

use the calculated sensitivity information to guide the selection of the next set of process parameters.

19. ) The system of claim 18, wherein the determined process parameters are determined by an exhaustive search procedure which is performed in parallel on a cluster of sequential machines.

20. ) The system of claim 19, wherein the exhaustive search procedure is controlled using a graphical user interface, comprising:

an input field for the number of sequential machines;

an input field for the number of simulations per machine; and

an input field for the report interval on each machine.